인공지반 녹화용 방수방근 복합 공법의 성능평가 시스템 연구

박창화(Park, Chang-Hwa),오상근(Oh, Sang-Keun),임남기(Lim, Nam-Gi) 대한건축학회 2011 대한건축학회 학술발표대회 논문집 - 계획계/구조계 Vol.31 No.1(구조계)

성과급제도의 발달에 관한 행정사적 고찰: 교원성과급제도를 중심으로

박창화 ( Chang Hwa Park ) 한국행정사학회 2010 韓國行政史學誌 Vol.27 No.-

교원성과급제도는 2001년 도입된 이래 성과급의 정책대상 집단인 교사들로부터 끊임없는 반발에 직면해 있는 등 지금까지도 많은 논란의 중심에 있는 실정이다. 이 연구는 현행 교원성과급제도의 도입에서 현재까지의 행정사적 발달과정을 경로의존성의 관점을 통하여 살펴봄으로서, 교원성과급제도의 변화와 논쟁의 핵심이 무엇인지 그리고 왜 교원성과급제도가 정부가 의도한 바와는 다르게 아직까지도 교사들의 집단 반발에 직면하고 있는지를 살펴보았다. 교원성과급 제도의 자기강화기제를 살펴보면 초기조건은 다양한 정책적 대안에 대한 충분한 검토 없이 교직사회에 성과급 제도를 도입하게 된다. 이후 교원성과급 제도의 자기강화기제로 성과급의 비율 조정을 통하여 강화 발판을 마련한다. 2006년 이후부터는 성과급 차등 지급 폭을 점차적으로 늘려 성과급제도의 자기강화를 하면서 이 제도의 안정적 운영을 유지하고자 하고 있다. 이에 반하여 정책대상 집단의 신념체제를 분석하여 보면 성과급제도 전반에 대하여 부정적 인식을 가지고 있었다. 이러한 교사들의 성과급에 대한 내면적 신념은 성과급제도에 대한 정책불신을 조장하고 점진적 타성으로 인한 관성적 사고를 낳아 교원성과급제의 안정적 정착을 가로막는 요인으로 작용하고 있다. 따라서 경로의존성의 관점에서 교원성과급제도의 발달을 분석해 보았을 때, 정부는 교원성과제도의 지급 비율의 변화를 통한 성과급제도의 유지를 추구 할 것으로 보이나, 이러한 제도의 자기강화기제는 정책대상 집단의 성과급에 대한 신념체계와 충돌이 되어 앞으로도 지속적으로 교원성과급제도에 대한 논란과 정책적 불응의 문제는 계속 될 것으로 보인다. The performance-based pay system for teachers (PBPT) has been faced with continuous opposition from teachers -the policy target group- since its introduction in 2001, and is still in the center of arising disputes. This study examines the introduction and the current situation of the PBPT, Primarily focusing on the historical development of public administration through a perspective of path dependency, in order to identify the changes of PBPT and main point of disputes, and to find out why PBPT still faces resistance from teachers` group contrary to the original intention of the government. Looking at self-reinforcement of PBPT, the initial condition showed that the system was introduced to the teacher society without sufficient consideration of various policy alternatives. After that, the self-reinforcement built a foundation for reinforcement was by adjusting a ratio in PBPT, with self-reinforcement of PBPT. Since 2006, the range for differential payment of PBPI` has increased resulting in stabilizing the system. On the other hand, the analysis on belief of the policy target group revealed that they had negative perceptions on the overall performance-based pay system. Thus the teachers` internal awareness on performance-based pay creates distrust of PBPT, and results in inertia thinking due to gradual force of habit, and in turn becomes a factor to inhibit the stable settlement of PBPT. Thus, when analyzing the development of PBPT from a perspective of path dependency, the government is likely pursues to sustain the PB VT` by changing the payment ratio; however, the self-reinforcement of the system conflicts with the policy target group`s belief in performance-based pay. Therefore, the disputes over PBPT and rebellion on the policy are likely to be continued in the future.

옥상녹화 방수 및 방근 기술로서 동판재의 적합성 및 시공성에 관한 연구

박창화 ( Chang-hwa Park ),조일규 ( Il-kyu Cho ),권시원 ( Shi-won Kwon ),오상근 ( Sang-keun Oh ) 한국건축시공학회 2007 한국건축시공학회 학술발표대회 논문집 Vol.7 No.1

To build up the green roofs, it must not adverse effect to durability and structural safety. That is conducted by safety system which consist of waterproofing to form basically, root barrier to protect the waterproofing. The reason why root barrier form is to protect the penetration force of root growth and the root could penetrate concrete surface, move inward so far. It may cause shorten the life span on concrete structure. For this problem, government constantly demand the solution to form the root barrier for waterproofing and concrete structure before the building is service. However, the technical action is not fully prepared. Therefore, in this study, we would like to suggest the workability and suitability of the copper plate to solve not only the side of waterproofing but also root barrier for green roof system and exhibit the mechanism for root penetration resistance and corrosion resistance.

동판재를 활용한 옥상녹화 방근공법의 적용과 성능평가

박창화(Park Chang-Hwa),오상근(Oh Sang-Keun),임남기(Lim Nam-Gi) 대한건축학회 2010 大韓建築學會論文集 : 構造系 Vol.26 No.9

This study in on an application and performance of copper plate as root barrier for green roof system evaluation. We suggest new materials which already used as roofing supply, as analyzing the performance of against the root penetration and corrosion, furthermore workability and suitablity as root barrier for green roof foundation. It proved that the copper include chemical component to control a certain chemical component at growing point of plant. It is effective to control the penetrating vertical power of root by copper, and this is using principle that lead to take root horizontal in the soil by growing fine root instead of thicken root not grow any more. This is different with exist chemical root barrier treated weed-killer or insecticide, give more safety for growing plant.

마이크로 구조물 형성을 위한 핫 엠보싱용 플라스틱 스탬프 제작

차남구,박창화,임현우,박진구,정준호,이응숙,Cha Nam-Goo,Park Chang-Hwa,Lim Hyun-Woo,Park Jin-Goo,Jeong Jun-Ho,Lee Eung-Sug 한국재료학회 2005 한국재료학회지 Vol.15 No.9

Nanoimprinting lithography (NIL) is known as a suitable technique for fabricating nano and micro structures of high definition. Hot embossing is one of NIL techniques and can imprint on thin films and bulk polymers. Key issues of hot embossing are time and expense needed to produce a stamp withstanding a high temperature and pressure. Fabrication of a metal stamp such as an electroplated nickel is cost intensive and time consuming. A ceramic stamp made by silicon is easy to break when the pressure is applied. In this paper, a plastic stamp using a high temperature epoxy was fabricated and tested. The plastic stamp was relatively inexpensive, rapid to produce and durable enough to withstanding multiple hot embossing cycles. The merits of low viscosity epoxy solutions were a fast degassing and a rapid filling the microstructures. The hot embossing process with plastic stamp was performed on PMMA substrates. The hot embossing was conducted at 12.6 bar, $120^{\circ}C$ and 10 minutes. An imprinted PMMA wafer was almost same value of the plastic stamp after 10 times embossing. Entire fabrication process from silicon master to plastic stamp was completed within 12 hours.

PECVD를 이용한 금속 스탬프용 점착방지막 형성과 특성 평가

차남구,박창화,조민수,김규채,박진구,정준호,이응숙,Cha, Nam-Goo,Park, Chang-Hwa,Cho, Min-Soo,Kim, Kyu-Chae,Park, Jin-Goo,Jeong, Jun-Ho,Lee, Eung-Sug 한국재료학회 2006 한국재료학회지 Vol.16 No.4

Nanoimprint lithography (NIL) is a novel method of fabricating nanometer scale patterns. It is a simple process with low cost, high throughput and resolution. NIL creates patterns by mechanical deformation of an imprint resist and physical contact process. The imprint resist is typically a monomer or polymer formulation that is cured by heat or UV light during the imprinting process. Stiction between the resist and the stamp is resulted from this physical contact process. Stiction issue is more important in the stamps including narrow pattern size and wide area. Therefore, the antistiction layer coating is very effective to prevent this problem and ensure successful NIL. In this paper, an antistiction layer was deposited and characterized by PECVD (plasma enhanced chemical vapor deposition) method for metal stamps. Deposition rates of an antistiction layer on Si and Ni substrates were in proportion to deposited time and 3.4 nm/min and 2.5 nm/min, respectively. A 50 nm thick antistiction layer showed 90% relative transmittance at 365 nm wavelength. Contact angle result showed good hydrophobicity over 105 degree. $CF_2$ and $CF_3$ peaks were founded in ATR-FTIR analysis. The thicknesses and the contact angle of a 50 nm thick antistiction film were slightly changed during chemical resistance test using acetone and sulfuric acid. To evaluate the deposited antistiction layer, a 50 nm thick film was coated on a stainless steel stamp made by wet etching process. A PMMA substrate was successfully imprinting without pattern degradations by the stainless steel stamp with an antistiction layer. The test result shows that antistiction layer coating is very effective for NIL.

실험 계획법을 이용한 점착방지막용 플라즈마 증착 공정변수의 최적화 연구

차남구,박창화,조민수,박진구,정준호,이응숙,Cha Nam-Goo,Park Chang-Hwa,Cho Min-Soo,Park Jin-Goo,Jeong Jun-Ho,Lee Eung-Sug 한국재료학회 2005 한국재료학회지 Vol.15 No.11

NIL (nanoimprint lithography) technique has demonstrated a high potential for wafer size definition of nanometer as well as micrometer size patterns. During the replication process by NIL, the stiction between the stamp and the polymer is one of major problems. This stiction problem is moi·e important in small sized patterns. An antistiction layer prevents this stiction ana insures a clean demolding process. In this paper, we were using a TCP (transfer coupled plasma) equipment and $C_4F_8$ as a precursor to make a Teflon-like antistiction layer. This antistiction layer was deposited on a 6 inch silicon wafer to have nanometer scale thicknesses. The thickness of deposited antistiction layer was measured by ellipsometry. To optimize the process factor such as table height (TH), substrate temperature (ST), working pressure (WP) and plasma power (PP), we were using a design of experimental (DOE) method. The table of full factorial arrays was set by the 4 factors and 2 levels. Using this table, experiments were organized to achieve 2 responses such as deposition rate and non-uniformity. It was investigated that the main effects and interaction effects between parameters. Deposition rate was in proportion to table height, working pressure and plasma power. Non-uniformity was in proportion to substrate temperature and working pressure. Using a response optimization, we were able to get the optimized deposition condition at desired deposition rate and an experimental deposition rate showed similar results.

IPA 저온 접합법을 이용한 PMMA Micro CE Chip의 제작

차남구,박창화,임현우,조민수,박진구,Cha, Nam-Goo,Park, Chang-Hwa,Lim, Hyun-Woo,Cho, Min-Soo,Park, Jin-Goo 한국재료학회 2006 한국재료학회지 Vol.16 No.2

This paper reports an improved bonding method using the IPA (isopropyl alcohol) assisted low-temperature bonding process for the PMMA (polymethylmethacrylate) micro CE (capillary electrophoresis) chip. There is a problem about channel deformations during the conventional processes such as thermal bonding and solvent bonding methods. The bonding test using an IPA showed good results without channel deformations over 4 inch PMMA wafer at $60^{\circ}C$ and 1.3 bar for 10 minutes. The mechanism of IPA bonding was attributed to the formation of a small amount of vaporized acetone made from the oxidized IPA which allows to solvent bonding. To verify the usefulness of the IPA assisted low-temperature bonding process, the PMMA micro CE chip which had a $45{\mu}m$ channel height was fabricated by hot embossing process. A functional test of the fabricated CE chip was demonstrated by the separation of fluorescein and dichlorofluorescein. Any leakage of liquids was not observed during the test and the electropherogram result was successfully achieved. An IPA assisted low-temperature bonding process could be an easy and effective way to fabricate the PMMA micro CE chip and would help to increase the yield.

핫 엠보싱용 점착방지막으로 사용되는 10nm급 두께의 Teflon-like 박막의 형성 및 특성평가

차남구,김인권,박창화,임현우,박진구,Cha Nam-Goo,Kim In-Kwon,Park Chang-Hwa,Lim Hyung-Woo,Park Jin-Goo 한국재료학회 2005 한국재료학회지 Vol.15 No.3

Teflon like fluorocarbon thin films have been deposited on silicon and oxide molds as an antistiction layer for the hot embossing process by an inductively coupled plasma (ICP) chemical vapor deposition (CVD) method. The process was performed at $C_4F_8$ gas flow rate of 2 sccm and 30 W of plasma power as a function of substrate temperature. The thickness of film was measured by a spectroscopic ellipsometry. These films were left in a vacuum oven of 100, 200 and $300^{\circ}C$ for a week. The change of film thickness, contact angle and adhesion and friction force was measured before and after the thermal test. No degradation of film was observed when films were treated at $100^{\circ}C$. The heat treatment of films at 200 and $300^{\circ}C$ caused the reduction of contact angles and film thickness in both silicon and oxide samples. Higher adhesion and friction forces of films were also measured on films treated at higher temperatures than $100^{\circ}C$. No differences on film properties were found when films were deposited on either silicon or oxide. A 100 nm silicon template with 1 to $500\;{\mu}m$ patterns was used for the hot embossing process on $4.5\;{\mu}m$ thick PMMA spun coated silicon wafers. The antistiction layer of 10 nm was deposited on the silicon mold. No stiction or damages were found on PMMA surfaces even after 30 times of hot embossing at $200^{\circ}C$ and 10 kN.

지하구조물 상부 인공지반용 방수·방근 재료 및 평가기술 개발에 관한 연구

김명지 ( Kim Meong Ji ),박창화 ( Park Chang Hwa ),오상근 ( Oh Sang Keun ) 한국구조물진단유지관리공학회 2014 한국구조물진단유지관리공학회 학술발표대회 논문집 Vol.18 No.2