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Field Emission Display 용 진공 패키징시 진공하에서 유리 두께에 따른 유리에 걸리는 응력 및 변위(Spacer가 없는 경우)
김희수,문제도,오재열,조영래,김진상,정재은,정효수 한국마이크로전자및패키징학회 1997 하이브리드마이크로일렉트로닉스 Vol.4 No.2
Stress developed in the glass plate during vacuum packaging of an FFD (Field Emission Display) was calculated. Bending stress was derived from the bending moment of the glass plate experiencing bending in the condition of built in edge. Fracture behaviour of the glass plate was observed and the displacement at the center was also measured. Vercuum packaging experiments were carried cut on 3.7$quot; and 5.7$quot; panels. 'floe fracture behavior of the evacuated panel was explained using the bending stress which was derived on the assumption that all edges of the gins were built in.
슬라이더 LPE 법에 의한 Hg0.3Cd0.7Te 박막의 제조
서상희,김진상,류한일 대한금속재료학회(대한금속학회) 1989 대한금속·재료학회지 Vol.27 No.2
Hg_(0.3)Cd_(0.7)Te epi layers were grown by a slider liquid phase epitaxial growth process with using ramp cooling. A new slider boat was designed to keep the composition of the Te-rech growth solution from changing during growth. It was possible to grow Hg_(0.3)Cd_(0.7)Te epi layers with uniform composition in the thickness direction. The temperature at which CdTe substrate is contacted with the growth solution should be 1∼2℃ higher than the liquidus temperature in order to obtain the surface morphology with uniform terraces.