http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
박형 휴대폰 케이스용 고분자 재료 및 사출 조건에 관한 연구
김신우(S. -W. Kim),허윤(Y. Heo),하영욱(Y. -W. HA),박원규(W. -K. Park) 한국생산제조학회 2007 한국공작기계학회 춘계학술대회논문집 Vol.2007 No.-
This paper presents about effects that molding operational conditions affect to injection molded parts. We studied in the two aspects of the resins and mold condition for the case of slim cell phone. First of all, we choose the optimized resins through a comparative study of each resin in the condition of the regular mold processing and design. PC (Polycarbonate) is better at parts applied fatigue load and PPA (Polyphthalamide) is better at parts required strength. Mold temperature is better at over 100℃ to the strength and surface quality.