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      • Improving Scanner Data Collection in P4-based SDN

        Yun-Zhan Cai,Chih-Hao Lai,Yu-Ting Wang,Meng-Hsun Tsai 한국통신학회 2020 한국통신학회 APNOMS Vol.2020 No.09

        Port scanning is a well-known behavior when a botnet searches target devices. To detect port scanning accurately, data with high discriminatory power are indispensable. Most related works, however, focus on data analysis methods but neglect storage limitations of switches, which makes their methods impractical. Therefore, we propose a new data collection method for collecting network information of port scanning in P4-based SDN named 0-replacement. Through simulations, we compare the 0-replacement method with two classic data collection methods. Results show that the 0-replacement method improves the true positive ratio by at least 25 percentage points but only consumes 0.36% memory space.

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        1-(2-Pyridylazo)-2-naphthol as a synergistic additive for improving throwing power of through hole copper electronic electroplating

        Lei Jin,Zhao-Yun Wang,Zhuan-Yun Cai,Jia-Qiang Yang,An-Ni Zheng,Fang-Zu Yang,De-Yin Wu,Dongping Zhan 한국공업화학회 2023 Journal of Industrial and Engineering Chemistry Vol.125 No.-

        In this work, we develop a novel 1-(2-Pyridylazo)-2-naphthol (PAN)-based acidic sulfate copper electronicelectroplating process for compact, homogeneous and conformal copper thickening of throughhole (TH). The adsorption characteristics, electrochemical properties and the interaction mechanismsof three additives (PEG, SPS and PAN) are studied in detail. Scanning electron microscope (SEM) and opticalmicroscope (OM) reveal that PAN can make the copper coating in fine grains and high throwing powerof 90.35% in TH without an overhang phenomenon. Theoretical calculations illustrate that the bindingenergies between additive molecules and copper surface decrease in the order: PAN > SPS > PEG. Cyclic voltammetry experiments at rotating rates of 1200 and 200 r/min prove that PAN itself can accelerateand weakly suppress copper electrodeposition at the center and mouth of TH, respectively. PANbehaves respectively the synergistic and antagonistic effects with PEG at the mouth and center of TH,and the weakly synergistic effects with SPS both at the mouth and center of TH. The addition of PANto the virgin make-up solution (VMS) containing PEG and SPS causes decreasing the relative electriccharge (DQ) at high and low rotating rates from 18.52 ± 0.08% to 8.25 ± 0.05%, which satisfies the closercopper electronic electroplating rate at the center and mouth of TH. The effective and complicated synergisticeffects of the additives PEG, SPS and PAN can achieve compact, homogeneous and conformal copperthickening of TH.

      • Mitigating SYN flooding Attack and ARP Spoofing in SDN Data Plane

        Ting-Yu Lin,Jhen-Ping Wu,Pei-Hsuan Hung,Ching-Hsuan Shao,Yu-Ting Wang,Yun-Zhan Cai,Meng-Hsun Tsai 한국통신학회 2020 한국통신학회 APNOMS Vol.2020 No.09

        As the number of network devices increases rapidly, it becomes more and more difficult to defend network attacks. Large-scaled attacks, such as SYN flooding, may lead to heavy burden to the switches as well as the controller in a software defined network (SDN). In this paper, we investigate the SYN flooding and Address Resolution Protocol (ARP) spoofing attacks in SDN, and then propose mechanisms to address these two attacks. We also present a new scheme to detect SYN flooding by using only a few forwarding rules. Moreover, we utilize the Programming Protocol-independent Packet Processors (P4) technique to mitigate the burden of the controller.

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