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- 저자 : Zhuan-Yun Cai (검색결과 1 건)
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Lei Jin,Zhao-Yun Wang,Zhuan-Yun Cai,Jia-Qiang Yang,An-Ni Zheng,Fang-Zu Yang,De-Yin Wu,Dongping Zhan 한국공업화학회 2023 Journal of Industrial and Engineering Chemistry Vol.125 No.-
In this work, we develop a novel 1-(2-Pyridylazo)-2-naphthol (PAN)-based acidic sulfate copper electronicelectroplating process for compact, homogeneous and conformal copper thickening of throughhole (TH). The adsorption characteristics, electrochemical properties and the interaction mechanismsof three additives (PEG, SPS and PAN) are studied in detail. Scanning electron microscope (SEM) and opticalmicroscope (OM) reveal that PAN can make the copper coating in fine grains and high throwing powerof 90.35% in TH without an overhang phenomenon. Theoretical calculations illustrate that the bindingenergies between additive molecules and copper surface decrease in the order: PAN > SPS > PEG. Cyclic voltammetry experiments at rotating rates of 1200 and 200 r/min prove that PAN itself can accelerateand weakly suppress copper electrodeposition at the center and mouth of TH, respectively. PANbehaves respectively the synergistic and antagonistic effects with PEG at the mouth and center of TH,and the weakly synergistic effects with SPS both at the mouth and center of TH. The addition of PANto the virgin make-up solution (VMS) containing PEG and SPS causes decreasing the relative electriccharge (DQ) at high and low rotating rates from 18.52 ± 0.08% to 8.25 ± 0.05%, which satisfies the closercopper electronic electroplating rate at the center and mouth of TH. The effective and complicated synergisticeffects of the additives PEG, SPS and PAN can achieve compact, homogeneous and conformal copperthickening of TH.
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