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Zu-Guo Zhao,Shuang-Shuang Yan,Yun-Mei Yu,Na Mi,La-Xi Zhang,Jun Liu,Xiao-Ling Li,Fang Liu,Jun-Fa Xu,Wei-Qing Yang,Guo-Ming Li 한국미생물학회 2013 The journal of microbiology Vol.51 No.2
Yunnan Baiyao is a famous Chinese medicine that has long been directly applied to wounds to reduce bleeding, pain, and swelling without causing infection. However, little is known about its ability to prevent infection. The present study aimed to assess in vitro the anti-virulence activity of an aqueous extract of Yunnan Baiyao (YBX) using Pseudomonas aeruginosa as a pathogenic model. We found that a sub-MIC (2.5 mg/ml) of YBX can efficiently interfere with the quorum-sensing (QS) signaling circuit. Real-time polymerase chain reaction analysis showed that a sub-MIC of YBX downregulated the transcriptions of lasR, lasI, rhlR, and rhlI,which resulted in global attenuation of QS-regulated virulence activities, such as biofilm formation, and secretion of LasA protease, LasB elastase and pyocyanin. Further, YBX reduced the motility of P. aeruginosa related to QS, and impaired the formation of biofilms. These results suggest that YBX may possess global inhibitory activity against the virulence of P. aeruginosa and that YBX may also exhibit antimicrobial activity in vivo. The present study suggests that Yunnan Baiyao represents a potential source for isolating novel, safe, and efficacious antimicrobial agents.
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Lei Jin,Zhao-Yun Wang,Zhuan-Yun Cai,Jia-Qiang Yang,An-Ni Zheng,Fang-Zu Yang,De-Yin Wu,Dongping Zhan 한국공업화학회 2023 Journal of Industrial and Engineering Chemistry Vol.125 No.-
In this work, we develop a novel 1-(2-Pyridylazo)-2-naphthol (PAN)-based acidic sulfate copper electronicelectroplating process for compact, homogeneous and conformal copper thickening of throughhole (TH). The adsorption characteristics, electrochemical properties and the interaction mechanismsof three additives (PEG, SPS and PAN) are studied in detail. Scanning electron microscope (SEM) and opticalmicroscope (OM) reveal that PAN can make the copper coating in fine grains and high throwing powerof 90.35% in TH without an overhang phenomenon. Theoretical calculations illustrate that the bindingenergies between additive molecules and copper surface decrease in the order: PAN > SPS > PEG. Cyclic voltammetry experiments at rotating rates of 1200 and 200 r/min prove that PAN itself can accelerateand weakly suppress copper electrodeposition at the center and mouth of TH, respectively. PANbehaves respectively the synergistic and antagonistic effects with PEG at the mouth and center of TH,and the weakly synergistic effects with SPS both at the mouth and center of TH. The addition of PANto the virgin make-up solution (VMS) containing PEG and SPS causes decreasing the relative electriccharge (DQ) at high and low rotating rates from 18.52 ± 0.08% to 8.25 ± 0.05%, which satisfies the closercopper electronic electroplating rate at the center and mouth of TH. The effective and complicated synergisticeffects of the additives PEG, SPS and PAN can achieve compact, homogeneous and conformal copperthickening of TH.
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