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Guoxing Qiu,Dongping Zhan,Changsheng Liu,Min Qi,Zhouhua Jiang,Huishu Zhang 한국원자력학회 2019 Nuclear Engineering and Technology Vol.51 No.5
The effects of Y and Ti on the microstructure stability and tensile properties of the reduced activationferritic/martensitic steel have been investigated. The addition of Y and Ti affected the prior austenitegrain size due to the pinning of the inclusions. Ti addition of 0.008 wt% to the steel was intended topromote the precipitation of nano-sized carbides with a high resistance to coarsening. 8Ti14Y exhibited ahigher yield strength and a lower DBTT than the other alloys due to the fine grain size and additionalprecipitation hardening by (Ti, Ta)-rich MX. After thermal exposure at 550 C for 1500 h, yield strengthwas dropped significantly in exposed 0Ti13Y. On the contrary, a lower reduction of YS was observed in8Ti14Y. The M23C6 in 0Ti13Y and 8Ti14Y and MX in 25Ti14Y and 39Ti15Y coarsened seriously duringageing, which could be responsible for the reduction of the tensile properties of alloys.
Guoxing Qiu,Dongping Zhan,Changsheng Liu,Min Qi,Zhouhua Jiang,Huishu Zhang 한국원자력학회 2019 Nuclear Engineering and Technology Vol.51 No.6
In this paper, the CLAM steel strengthened by micro-scale YeZreO was prepared by vacuum inductionmelting followed by electroslag remelting (VIM-ESR). Yttrium (Y) and zirconium (Zr) were easy to aggregatesinto massive yttrium-zirconium-rich inclusions in the steel melted by vacuum inductionmelting (VIM), which would interrupt the continuity of the matrix and reduce the mechanical propertiesof steel. Micron-sized YeZreO inclusions would be produced with the removal of original blocky YeZrrichinclusions and the submicron-sized inclusions smaller than 0.2 mm could be retained in the steel. The small grain size and the better refinement and distribution uniformity of YeZreO inclusions afterremelting would be responsible for the better yield strength and toughness. For VIM-ESR alloy, the ultimatetensile strength is 749 MPa and the yield strength is 642 MPa at room temperature, meanwhilethey are 391 MPa and 367 MPa at 600 C, respectively. Meanwhile, the ductile-brittle transition temperature(DBTT) reduced from 43 C (VIM) to-76 C (VIM-ESR).
Qiu, Guoxing,Zhan, Dongping,Li, Changsheng,Yang, Yongkun,Jiang, Zhouhua,Zhang, Huishu Korean Nuclear Society 2020 Nuclear Engineering and Technology Vol.52 No.4
Y-containing CLAM steels were melted via vacuum induction melting and electroslag remelting. In this study, the evolution, microstructure, and mechanical properties of the alloy inclusions (ESR-1 (0 wt.% Y), ESR-2 (0.016 wt.% Y) and ESR-3 (0.042 wt.% Y)) were investigated. Further, the number of inclusions in ESRed steel was observed to obviously decrease, and the distributions were more uniform. The fine Y-Al-O inclusions (1-2 ㎛) were the main inclusions in ESR-2. The addition of Y affected the prior austenite grain size (PAGZ), increasing the tensile strength at test temperature. Low ductile-brittle transition temperature (DBTT) was obtained because of the fine PAGZ and dispersive inclusions. For the ESRed CLAM steel with 0.016 wt.% Y, the yield strengths were 621 MPa at 20 ℃ and 354 MPa at 600 ℃ in air. Further, the uniform elongation and elongation of the ESR-2 alloy were 5.5% and 20.1% at 20 ℃, respectively. Meanwhile, the DBTT tested using full-size Charpy impact specimen (55 cm × 10 cm × 10 cm) was reduced to -83 ℃.
Lei Jin,Zhao-Yun Wang,Zhuan-Yun Cai,Jia-Qiang Yang,An-Ni Zheng,Fang-Zu Yang,De-Yin Wu,Dongping Zhan 한국공업화학회 2023 Journal of Industrial and Engineering Chemistry Vol.125 No.-
In this work, we develop a novel 1-(2-Pyridylazo)-2-naphthol (PAN)-based acidic sulfate copper electronicelectroplating process for compact, homogeneous and conformal copper thickening of throughhole (TH). The adsorption characteristics, electrochemical properties and the interaction mechanismsof three additives (PEG, SPS and PAN) are studied in detail. Scanning electron microscope (SEM) and opticalmicroscope (OM) reveal that PAN can make the copper coating in fine grains and high throwing powerof 90.35% in TH without an overhang phenomenon. Theoretical calculations illustrate that the bindingenergies between additive molecules and copper surface decrease in the order: PAN > SPS > PEG. Cyclic voltammetry experiments at rotating rates of 1200 and 200 r/min prove that PAN itself can accelerateand weakly suppress copper electrodeposition at the center and mouth of TH, respectively. PANbehaves respectively the synergistic and antagonistic effects with PEG at the mouth and center of TH,and the weakly synergistic effects with SPS both at the mouth and center of TH. The addition of PANto the virgin make-up solution (VMS) containing PEG and SPS causes decreasing the relative electriccharge (DQ) at high and low rotating rates from 18.52 ± 0.08% to 8.25 ± 0.05%, which satisfies the closercopper electronic electroplating rate at the center and mouth of TH. The effective and complicated synergisticeffects of the additives PEG, SPS and PAN can achieve compact, homogeneous and conformal copperthickening of TH.