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Wafer Level Package of Optical devices Using Polymer Bonding
Kyounghwan Na,Ill hwan Kim,Eunsung Lee,Hyeon Cheol Kim,Kukjin Chun 대한전자공학회 2007 ITC-CSCC :International Technical Conference on Ci Vol.2007 No.7
In this thesis, study on thick, uniform and patterned interposer using polymer bonding for wafer level package of optical devices was performed. Two types of interposer were examined. First one is the type using SU-8 photoresist as interposer and as glue layer, also. The other is the type using patterned silicon wafer as interposer and dry film resist layer as glue. As results of experiments, SU- 8 layer which has 400㎛ of thickness and 3.25% of uniformity was formed and bonding strength between SU-8 and glass substrate was improved to maximum 9.43㎫ of tensile strength. And bonding layer which has maximum 32.5㎫ of shear strength and seals cavity hermetically was obtained by using DFR as glue layer between silicon interposer and glass substrate.
나경환(Kyounghwan Na),누엔 티 후옹(Thi Huong Nguyen),이상명(Sang-Myung Lee),양성욱,김진석(Jinseok Kim),윤의성(Eui-Sung Yoon) 대한기계학회 2009 대한기계학회 춘추학술대회 Vol.2009 No.11
The mechanical properties of a single-stranded deoxyribonucleic acid (ssDNA, 30-mer) in deionized water (DI) have been investigated by atomic force microscopy (AFM). Both ends of ssDNA molecules were labeled at 3’ and 5’ ends by biotin and thiol linkers, respectively. The streptavidin functionalized AFM tip ‘pick-up’ the biotinylated-end while the gold surface covalently bound to thiolated-end. The molecular stretching signal would be observed during the tip/sample separation process, and they were used to estimate the stiffness of the ssDNA molecule. We have obtained the different Young’s modulus results when the surface was un-modified or modified by a thiol backfilling spacer. Those were clarified by analyzing the binding force between DNA molecules and the un-modified gold surface or the thiol spacer-modified surface. The DNA binding to thiol spacer-modified surface is much weaker than that on the un-modified surface.