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전해도금에 의해 형성된 반도체 고속도금용 주석-납 합금피막의 첨가제 및 전해조건의 영향
정강효(K. H. Jung),김병관(B. K. Kim),박상언(S. U. Park),김만(M. Kim),장도연(D. Y. Chang) 한국표면공학회 2002 한국표면공학회지 Vol.36 No.1
Effects of additives and plating conditions of high speed electroplating were investigated. The Sn content in electrodeposit was highly decreased with increasing current density from 10A/d㎡ to 50A/d㎡, and the current efficiency on the cathode was decreased. The carbon content in the electrodeposit was decreased with increasing current density from 10A/d㎡ to 30A/d㎡, however the carbon content was highly increased in the range of 40A/d㎡~50A/d㎡. The formation of tetravalent tin and stannic oxide sludge was prevented by the addition of gallic acid in the bath. The changing of Sn content in the electrodeposit is caused by the addition of gallic acid.
김동수(D. Kim),김만(M. Kim),박상언(S. U. Park),남기석(K. S. Nam),장도연(D. Y. Chang),권식철(S. C. Kwon),신동수(D. S. Shin) 한국표면공학회 2001 한국표면공학회지 Vol.34 No.1
The addition of organic compound containing -COOH, -CONH₂, -CHO group such as formic acid, formamide, formaldehyde or diethyleneamine to a chromium electroplating bath results in a chromium deposit in which carbon is incorporated. Such deposits have fewer defects than chromium layers produced by a conventional method. It was found that the as-deposited layers were amorphous and auger electron spectroscopy (AES) showed that carbon is distributed uniformly in the deposit. During heat treatment, Cr-C deposits began to crystallize at 400℃, and at 800℃ they were crystallized into chromium carbides and oxides. The effects of current density, amount of additives, applied current waveform on Cr-C alloy electroplating were examined.
음극표면 pH 측정에 의한 Ni-P 합금의 전착기구 고찰
이규환(K. H. Lee),장도연(D. Chang),김동수(D. Kim),이상열(S. Y. Lee),권식철(S. C. Kwon),강성군(S. G. Kang) 한국표면공학회 2001 한국표면공학회지 Vol.34 No.2
To better understand the codeposition mechanism of phosphorous, surface pH and potential of cathode were measured during electrodeposition of Ni-P alloys. The pH of cathode surface was measured using a flat-bottom glass pH electrode and a 500 mesh gold gauze as cathode. The cathode surface pH was increased with increasing the current density and always higher than the pH in the bulk solution. As a result of overplotting the surface pH and cathode potential on the Pourbaix diagram, it was found that cathode surface shift to the domain of predominant of H₂PO₃-or H₂PO₂-. Additionally, new deposition mechanism was suggested that H₂PO₂- and H₂PO₃- play important roles in the deposition reaction of Ni-P alloys.