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전해도금에 의해 형성된 반도체 고속도금용 주석-납 합금피막의 첨가제 및 전해조건의 영향
정강효(K. H. Jung),김병관(B. K. Kim),박상언(S. U. Park),김만(M. Kim),장도연(D. Y. Chang) 한국표면공학회 2002 한국표면공학회지 Vol.36 No.1
Effects of additives and plating conditions of high speed electroplating were investigated. The Sn content in electrodeposit was highly decreased with increasing current density from 10A/d㎡ to 50A/d㎡, and the current efficiency on the cathode was decreased. The carbon content in the electrodeposit was decreased with increasing current density from 10A/d㎡ to 30A/d㎡, however the carbon content was highly increased in the range of 40A/d㎡~50A/d㎡. The formation of tetravalent tin and stannic oxide sludge was prevented by the addition of gallic acid in the bath. The changing of Sn content in the electrodeposit is caused by the addition of gallic acid.