http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
선박엔진용 초대형 열간단조품, 피스톤크라운의 단조공정 및 금형 설계
황범철(B. C. Hwang),이우형(W. H. Lee),배원병(W. B. Bae),김철(C. Kim) 한국소성·가공학회 2008 소성가공 : 한국소성가공학회지 Vol.17 No.8
In closed-die hot forging, a billet is formed in dies such that the flow of metal from the die cavity is restricted. Some parts can be forged in a single set of dies, whilst others, due to shape complexity and material flow limitations, must be shaped in multi sets of dies. The purpose of a performing operation is to distribute the volume of the parts such that material flow in the finisher dies will be sound. This study focused on the design of preforms, flash thickness and land width by theoretical calculation and finite element analysis, to manufacture the super hot forging product, 70MC type piston crown used in marine engine. The optimal design of preforms by the finite element analysis and the design experiment achieves adequate metal distribution without any defects and guarantees the minimum forming load and fully filling of the cavity of the die for producing the large piston crown. The maximum loads obtained by finite element analysis are compared with the results of experiments. The loads of the analysis have good agreements with those of the experiment. Results obtained using DEFORM-2D enable the designer and manufacturer of super hot forging dies to be more efficient in this field.
이석윤,허명수,손동수,황병철,조동율,천희곤,오태희,송병무,송한식,이우형,이광철,김오규,권영규,구경완 경북대학교 센서기술연구소 1995 센서技術學術大會論文集 Vol.6 No.1
The thin film growing processes and the photolithographic techniques involved in the manufacturing of thin film magnetic heads are discussed. The thin film heads are composed of the hundreds of electromagnetic transducers on a single wafer and are made of Al_(2)O_(3)-TiC substrate on which Al_(2)O_(3) film as a insulating, protective layer and gap material, Cu film as a multi-turn coil and permalloy film as a magnetic material are deposited and patterned. In this article we will introduce how the thin film heads is fabricated and differ from an integrated semiconductor device. An effort is devoted to develop the formation of PR frame using a lithography process and finally the thin film heads manufacturing technologies.