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음극표면 pH 측정에 의한 Ni-P 합금의 전착기구 고찰
이규환(K. H. Lee),장도연(D. Chang),김동수(D. Kim),이상열(S. Y. Lee),권식철(S. C. Kwon),강성군(S. G. Kang) 한국표면공학회 2001 한국표면공학회지 Vol.34 No.2
To better understand the codeposition mechanism of phosphorous, surface pH and potential of cathode were measured during electrodeposition of Ni-P alloys. The pH of cathode surface was measured using a flat-bottom glass pH electrode and a 500 mesh gold gauze as cathode. The cathode surface pH was increased with increasing the current density and always higher than the pH in the bulk solution. As a result of overplotting the surface pH and cathode potential on the Pourbaix diagram, it was found that cathode surface shift to the domain of predominant of H₂PO₃-or H₂PO₂-. Additionally, new deposition mechanism was suggested that H₂PO₂- and H₂PO₃- play important roles in the deposition reaction of Ni-P alloys.