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유연·신축성 전자 소자 개발을 위한 은 나노와이어 기반 투명전극 기술
김대곤,김영민,김종웅,Kim, Dae-Gon,Kim, Youngmin,Kim, Jong-Woong 한국마이크로전자및패키징학회 2015 마이크로전자 및 패키징학회지 Vol.22 No.1
Recently, advances in nano-material researches have opened the door for various transparent conductive materials, which include carbon nanotube, graphene, Ag and Cu nanowire, and printable metal grids. Among them, Ag nanowires are particularly interesting to synthesize because bulk Ag exhibits the highest electrical conductivity among all metals. Here we reviewed recently-published research works introducing various devices from organic light emitting diode to tactile sensing devices, all of which are employing AgNW for a conducting material. They proposed methods to enhance the stretchability and reversibility of the transparent electrodes, and apply them to make various flexible and stretchable electronics. It is expected that Ag nanowires are applicable to a wide range of high-performance, low-cost, stretchable electronic devices.
디바이스 내장형 플렉시블 전자 모듈 제조 및 신뢰성 평가
김대곤,홍성택,김덕흥,홍원식,이창우,Kim, Dae Gon,Hong, Sung Taik,Kim, Deok Heung,Hong, Won Sik,Lee, Chang-Woo 대한용접접합학회 2013 대한용접·접합학회지 Vol.31 No.3
These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.
김대곤,Kim Yu Jin,Jeong Joo,Joo Yoon Ha,Jo You Hwan,Park Seung Min 대한응급의학회 2023 Clinical and Experimental Emergency Medicine Vol.10 No.2
Objective: A new blind intubation device (BID) has been developed for endotracheal intubation. This study aimed to test the usability of the BID in comparison to direct laryngoscopy (DL) and video laryngoscopy (VL) with inexperienced healthcare providers for endotracheal intubation. Methods: This was a randomized crossover simulation study. Participants who had conducted fewer than five live intubation sessions were included in the study. The manikin simulation was conducted using a Laerdal trainer airway manikin. Participants performed intubation using all three devices, DL, VL, and BID. The primary outcome was intubation success rate in the first pass the secondary outcome was intubation time to first ventilation, and the tertiary outcome was dental injury. Results: A total of 45 healthcare workers who were novices in intubation participated in this study, including 13 physicians (interns), 14 emergency medical technicians, and 18 nurses. The intubation success rates in the first pass with BID, DL, and VL were 93.3%, 91.1%, and 97.8%, respectively (P=0.53). The intubation times to first ventilation with BID, DL, and VL were 13.15±6.16, 19.07±7.71, and 17.31±6.57 seconds, respectively (P<0.01). The proportions of dental injuries associated with BID, DL, and VL were 0% for physicians; 28.6%, 14.3%, and 0%, respectively for emergency medical technicians; and 27.8%, 11.1%, and 16.7%, respectively for nurses. Conclusion: We performed a pilot study to test the usability of the new BID. There was no significant difference in intubation success rate in the first pass among BID, DL, and VL. The intubation time to first ventilation was shorter with the BID compared to DL and VL.
면진장치 들림 효과를 고려한 면진된 골조의 구조 거동 평가
김대곤,Kim, Dae-Kon 한국공간구조학회 2010 한국공간구조학회지 Vol.10 No.2
적층고무 면진장치의 전단강성 뿐만 아니라 인장강성 및 압축강성을 실험적으로 구한 후 비선형 해석 프로그램을 이용하여 면진장치를 모델링 하였다. 수평력을 받는 면진된 골조의 면진장치에 전도에 의한 인장응력이 발생되게 하기 위하여 큰 초기변위를 부여한 자유진동 실험을 해석적으로 수행하였다. 적층고무 면진장치는 인장에 약하기 때문에 면진장치에서의 들림 현상을 해석적으로 구하기 위하여 면진장치의 수직방향 강성들이 해석 모델에 적절히 반영되어야 한다. After obtaining tensile and compressive stiffness as well as shear stiffness of elastomeric seismic isolator experimentally, those stiffness were modeled analytically using nonlinear computer program. To induce tensile stress due to overturning in the seismic isolators of an isolated frame for horizontal force, free vibration simulations generated by large initial displacement were conducted. Since elastomeric seismic isolator is weak for tensile stress, the axial stiffness of isolators shall be included properly in the analytical model to evaluate the uplift phenomenon of elastomeric seismic isolator.
조립오차가 능동 자기베어링으로 지지된 축의 성능에 미치는 영향
김대곤,김경웅,Kim, Dae-Gon,Kim, Kyung-Woong 대한기계학회 1996 大韓機械學會論文集A Vol.20 No.12
Magnetic bearing is the machine element that supports the shaft without mechanical contact using the magnetic force induced by permanent magnet of electromagnet. Active magnetic bearing system is composed of sensor, controller, power amplifier, and electromagnet. If all the elements were dieal, shaft position could be controlled to sensor resolution, Because each elements inreal system have mechanical and electricla losses and nonlinearity, it is impossible to attain the desired performance using general control algorithm. So far it has been studied on improvement of the control algorithm of the electric characteristics of each elements. Another factors to affect shaft behavior are the manufacturing errors due to machine work, and assembling errors due to accumulate manufacturing errors of the radial magnetic bearing. This paper describes that the shaft behavior due to accumulate manufacturing errors and asymmetric bolting. This paper describes that the shaft behavior due to assembling errors of the radial bearings donot affect the rotaitonal accuracy of the shaft. But when the amplitude of the assembling errors increasees over the certain value, the bearing can not support the shaft properly.
김대곤,김종웅,하상수,정재필,신영의,문정훈,정승부,Kim, Dae-Gon,Kim, Jong-Woong,Ha, Sang-Su,Jung, Jae-Pil,Shin, Young-Eui,Moon, Jeong-Hoon,Jung, Seung-Boo 대한용접접합학회 2006 대한용접·접합학회지 Vol.24 No.2
The 3-dimensional (3D) chip stacking technology is a leading technology to realize a high density and high performance system in package (SiP). There are several kinds of methods for chip stacking, but the stacking and interconnection through Cu filled through-hole via is considered to be one of the most advanced stacking technologies. Therefore, we studied the optimum process of through-hole via formation and Cu filling process for Si wafer stacking. Through-hole via was formed with DRIE (Deep Reactive ion Etching) and Cu filling was realized with the electroplating method. The optimized conditions for the via formation were RE coil power of 200 W, etch/passivation cycle time of 6.5 : 6 s and SF6 : C4F8 gas flow rate of 260 : 100 sccm. The reverse pulsed current of 1.5 A/dm2 was the most favorable condition for the Cu electroplating in the via. The Cu filled Si wafer was chemically and mechanically polished (CMP) for the following flip chip bumping technology.