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RISS 인기검색어
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- 저자 : Yuehui He (검색결과 3 건)
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Kim, Sang Yeol,He, Yuehui,Jacob, Yannick,Noh, Yoo-Sun,Michaels, Scott,Amasino, Richard American Society of Plant Physiologists 2005 The Plant cell Vol.17 No.12
<P>Winter-annual accessions of Arabidopsis thaliana are often characterized by a requirement for exposure to the cold of winter to initiate flowering in the spring. The block to flowering prior to cold exposure is due to high levels of the flowering repressor FLOWERING LOCUS C (FLC). Exposure to cold promotes flowering through a process known as vernalization that epigenetically represses FLC expression. Rapid-cycling accessions typically have low levels of FLC expression and therefore do not require vernalization. A screen for mutants in which a winter-annual Arabidopsis is converted to a rapid-cycling type has identified a putative histone H3 methyl transferase that is required for FLC expression. Lesions in this methyl transferase, EARLY FLOWERING IN SHORT DAYS (EFS), result in reduced levels of histone H3 Lys 4 trimethylation in FLC chromatin. EFS is also required for expression of other genes in the FLC clade, such as MADS AFFECTING FLOWERING2 and FLOWERING LOCUS M. The requirement for EFS to permit expression of several FLC clade genes accounts for the ability of efs lesions to suppress delayed flowering due to the presence of FRIGIDA, autonomous pathway mutations, or growth in noninductive photoperiods. efs mutants exhibit pleiotropic phenotypes, indicating that the role of EFS is not limited to the regulation of flowering time.</P>
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In Situ Synthesis and Strengthening of Powder Metallurgy High Speed Steel in Addition of LaB6
Weijun Shen,Linping Yu,Zhi Li,Yuehui He,Qiankun Zhang,Huibin Zhang,Yao Jiang,Nan Lin 대한금속·재료학회 2017 METALS AND MATERIALS International Vol.23 No.6
A novel technology which was characterized by the vacuum solid state sintering was developed for powder metallurgyhigh speed steels production. During sintering, both the WC and Mo2C reacted with Fe and transformed toW and Mo rich M6C carbides which were the common hard phases in high speed steels. Also, a high number of W,Mo and Fe were dissolved in VC, forming the MC carbides. The densification of the material mainly relied on thesolubility effect during the M6C and MC carbides formation. By alloying with a 0.1 wt% of LaB6 to the steel, thebending strength and the fracture toughness were improved from 3290 MPa and 25.6 MPam1/2to 4018 MPa and29.4 MPam1/2, respectively. The TEM analysis demonstrated three types of reaction products by the LaB6 addition:the amorphous phase, the core-shell structure and the La2O3 phase. The impurity elements such as the Mg, Al,Si, S, Ca, and O were absorbed following the LaB6 addition. Moreover, the deoxidization effect caused by the LaB6addition promoted the sintering at a high-temperature period which contributed to the bending strength and fracturetoughness improvement.
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Controlled fabrication and electrochemical corrosion behavior of ultrathin Ni-Cu alloy foil
Linping Yu,Long Chen,Qizhi Chen,Luli Feng,Ziyi Xu,Bo Nan,Xiyue Kang,Yuehui He 한국공업화학회 2021 Journal of Industrial and Engineering Chemistry Vol.103 No.-
Cost-effective ultrathin alloy foils (<20 lm) are highly expected with the development of electronicindustry and micro-system technology. In this paper, electrodeposition combined with vacuum sinteringis used to fabricate a Ni-Cu alloy foil with thickness of 12.0 (±0.2) lm. For the ultrathin Ni-Cu alloy foil, adensified structure without pores can be achieved by prolonging sintering duration at 900 ℃ for 3 h. Under the current density of 10 mA cm 2, 700 s is the optimal electrodeposition time to obtain the highesttensile strength (187 MPa) with the Ni content of 41.5 wt.% in the alloy foil. Compared with Cu foil, Ni-Cu alloy foil shows superior corrosion resistance in 3.5 wt.% NaCl solution and also HCl solutions (0.5 mol/L, 1.0 mol/L, 2.0 mol/L), respectively. The uniform composition and defect-free surface, excellent tensilestrength and corrosion resistance together exhibits the great application potential of the obtained Ni-Cualloy foil, which may provide an inspiration for future development of integrated electronic or medicaldevices.
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