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이강천(Kangchun Lee),이상호(Sangho Lee),서정연(Jungyun Seo) 한국정보과학회 1996 한국정보과학회 학술발표논문집 Vol.23 No.1A
자연어 생성 시스템은 기계 번역이나 대화 시스템 등 여러 시스템의 인터페이스로 중요한 역할을 한다. 자연어 생성 시스템을 효율적으로 구축하고, 확장을 용이하게 하기 위해서는 해당언어의 생성에 필요한 정보를 효과적으로 표현할 수 있는 규칙 표현법이 필요하다. 본 논문은 한국어 생성에서 사용하는 격틀과 격틀이외의 여러 정보를 표현할 수 있는 표현법을 제안하였다. 그리고 제안한 규칙을 수행하기 위해서 Shieber의 semantic-head-driven방식[4]을 변형한 엔진을 구현하였다.
『개방형 한국어 지식 대사전』 신어 분과의 표제어 선정과 그 실제
소강춘(So, Kangchun),이래호(Lee, Raeho),주경미(Ju, Kyoungmi) 한국사전학회 2012 한국사전학 Vol.- No.20
The aim of this thesis is to introduce the principles of the entries selection and its procedure of new word department into the Gaebanghyeong-Hangugeo-Jisik-Daesajeon and the problems that arise during their entry selection process. Up to the present, new words have been variously defined. But, in our department, to work correspondingly on the purpose of the Gaebanghyeong-Hangugeo-Jisik-Daesajeon wherein the lexicons which include practical life vocabularies are registered, the new words will soon be defined as unregistered words which are frequently used in daily but are not recorded in the Pyojun Korean Unabridged Dictionary. The new words department entry selection principles are based on the following five presentations: (1) Selection of actively used words in reality, (2) Selection of established words in the official language, (3) Selection of non-standard words that are frequently used in daily life can also be an entry, (4) Selection of purified words that are actively used, (5) Selection of vocabularies among entries that seem to lack lexical paradigm. The selection of new words were based on data from the year 1994 until 2010 Neologism Source Book, results from frequent present word research data, Naver open dictionary, candidates for new words from the year 2008 until 2010 and finally, the Naver news corpus. With this selection principle, the classifications of the selection of new word entries from the data are composed of neologism, everyday words, phrases, technical terms, loanwords, non-standard words, etc.
Kim, Kijung,Lee, Kangchun,So, Sounghyun,Cho, Sungwook,Lee, Myeongjae,You, Keungtae,Moon, Jinok,Song, Taeseup The Electrochemical Society 2018 ECS journal of solid state science and technology Vol.7 No.3
<P>The Fenton reaction has been used for the tungsten oxidation under acidic conditions in tungsten chemical mechanical planarization (CMP). However, the narrow working pH window required for ideal reaction limits its application. Herein, we report a simple Fenton-like system via the reaction between copper ion and hydrogen peroxide (H2O2) for the tungsten oxidation over a broad pH range. Copper ion was employed as a reactant with H2O2 for the Fenton-like reaction, resulting in high production rates of hydroxyl radicals in the range of acidic to neutral pH, which leads to a high rate of tungsten oxidation. As a result, the Fenton-like reaction between copper ions and H2O2 enables the high removal rates of tungsten films during CMP process in acidic to neutral pH ranges. (C) 2018 The Electrochemical Society.</P>
Seho Sun,Kangchun Lee,Ganggyu Lee,Yehwan Kim,Sungmin Kim,Junha Hwang,Hyungoo Kong,Kyung Yoon Chung,Ghulam Ali,Taeseup Song,Ungyu Paik 한국공업화학회 2022 Journal of Industrial and Engineering Chemistry Vol.111 No.-
Chemical mechanical planarization (CMP) is indispensable for processing of integrated circuit semiconductordevices to attain globally planarized surfaces. One of the critical consumables in the CMP processis a slurry containing abrasives like colloidal silica (SiO2). However, there is a limit to the use of CMP slurriescontaining SiO2 under acidic conditions due to deterioration of colloidal stability, resulting in defectson the planarized surfaces. Herein, we developed an Fe-substituted SiO2 consisting of single-atom Fe(III),enabling improved colloidal stability over universal pH regions for low-defect tungsten CMP applications. The facile and unique single-atom modification process is proposed by controlling the lattice dissolution–reprecipitation replacement of Fe3+ and Si4+ ions. The physicochemical states of Fe atoms in the surficiallattice of Fe-substituted SiO2 were confirmed through Raman spectroscopy, electron microscopy, x-rayabsorption spectroscopy, and energy-dispersive x-ray spectroscopy. Consequently, enhanced performancein W CMP was achieved using Fe-substituted SiO2. Regarding defect performance, defects werereduced from 11 scratches to 0 and 94 other defects to only 7. Additionally, the removal rate increasedfrom 67 to 122 Å/min, and the surface topography improved from 6.6 to 2.9 nm.
Kim, Kijung,Lee, Kangchun,So, Sounghyun,Cho, Sungwook,Lee, Myeongjae,You, Keungtae,Moon, Jinok,Song, Taeseup The Electrochemical Society 2018 ECS journal of solid state science and technology Vol.7 No.3
<P>We studied the effect of selective adsorption of polyethylene glycol (PEG) on SiO2 for high removal selectivity of tungsten to SiO2 in tungsten CMP. The hydrogen bonding between PEG and SiO2 increased as the solution pH decreased. At pH 3, the maximum adsorption of PEG on SiO2 occurred due to the low surface charge of SiO2 (near its isoelectric point). The selective adsorption led to the selective reduction of removal rate of SiO2 during CMP process. As a result, the removal selectivity increased from 4.5 to 85.5 as the PEG concentration increased from 0 to 9 wt% at pH 3. (C) 2018 The Electrochemical Society.</P>
Kim, Kijung,Lee, Kangchun,Seo, Jihoon,Song, Taeseup The Electrochemical Society 2017 ECS journal of solid state science and technology Vol.6 No.10
<P>We investigated the effect of friction force between ceria abrasive and SiO<SUB>2</SUB> film on dishing in STI CMP. The control of adsorption amount of poly acrylic acid (PAA) on ceria surface led to the reduction of the friction force during CMP. The reduced friction force by a thick surface layer on ceria resulted in the decrease of the dishing in STI structure during over-polishing process. In the patterned wafer, the dishing decreased from 976 to 594 Å/min at 37.5% pattern density (Si<SUB>3</SUB>N<SUB>4</SUB>/SiO<SUB>2</SUB> = 30/50 μm) as a maximum adsorption amount increased from 0.49 to 0.64 mg/m<SUP>2</SUP>.</P>
Ce<sup>3+</sup>-enriched core-shell ceria nanoparticles for silicate adsorption
Kim, Kijung,Seo, Jihoon,Lee, Myoungjae,Moon, Jinok,Lee, Kangchun,Yi, Dong Kee,Paik, Ungyu Published for the Materials Research Society by th 2017 Journal of materials research Vol.32 No.14
<▼1><B>Abstract</B><P/></▼1><▼2><P>Ce<SUP>3+</SUP> ions in ceria nanoparticles (NPs) play a role as reactive sites in the adsorption of silicate anions. However, the limited concentration of Ce<SUP>3+</SUP> ions in ceria NPs remains a major challenge in this regard. Herein, we report a simple strategy to synthesize Ce<SUP>3+</SUP>-enriched core-shell ceria NPs for enhanced adsorption of silicate anions. To increase the overall Ce<SUP>3+</SUP> concentration, a shell layer is composed of Ce<SUP>3+</SUP>-rich ultrasmall ceria NPs approximately 5 nm in size. The Ce<SUP>3+</SUP> concentration of such core-shell ceria NPs is increased by 12.7-17.1% relative to that of the pristine ceria NPs, resulting in increased adsorption of silicate anions. The Freundlich model fits the observed adsorption isotherm well and the constants of adsorption capacity (<I>K</I>F) and adsorption intensity (1/<I>n</I>) indicate higher adsorption affinity of the core-shell ceria NPs for silicate anions. We attribute these improvements to the increased Ce<SUP>3+</SUP> concentration contributed by the ultrasmall ceria coating. This strategy can be used for enhancing the reactivity of ceria materials.</P></▼2>
Kim, Kijung,Seo, Jihoon,Lee, Myeongjae,Moon, Jinok,Lee, Kangchun,Yi, Dong Kee,Paik, Ungyu The Electrochemical Society 2017 ECS journal of solid state science and technology Vol.6 No.7
<P>Silica nanoparticles (NPs) are used as abrasives for tungsten chemical mechanical planarization (CMP) at acidic pH. However, the use of silica NPs at pH near their isoelectric point remains a problem because agglomeration due to low surface charge leads to defects on the tungsten surface during CMP. Herein, we report a simple strategy to increase the surface charge of silica NPs at acidic pH for defect-free tungsten CMP. The isomorphic substitution of Si4+ by Fe3+ ions on the surface of silica NPs by hydrothermal reaction led to a pH-independent permanent negative surface charge, which increased as the concentration of substituted Fe3+ ions increased. At acidic pH, the increased negative surface charge of Fe3+-substituted silica (Fe-silica) NPs resulted in a reduction in the number of agglomerated large particles relative to that of pure silica NPs. As a result, highly negatively-charged Fe-silica NPs showed high performance in the reduction of defect count on the tungsten surface after CMP. (C) 2017 The Electrochemical Society. All rights reserved.</P>