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Highly Miniaturized RF components employing metamaterial structure on MMIC
Han-nah Joh,Young-Bae Park,Se-Ho Kim,Young Yun 대한전자공학회 2008 ITC-CSCC :International Technical Conference on Ci Vol.2008 No.7
In this study, we introduce highly miniaturized on-chip impedance transformer and Wilkinson power divider, which were fabricated using metamaterial structure on MMIC. Concretely, a microstrip line employing metamaterial was used for a fabrication of the RF passive components. The size of the impedance transformer and power divider were reduced to 2.3 and 6 % of the conventional one, respectively.
조한나(Han-nah Joh),박영배(Young-Bae Park),김세호(Se-Ho Kim),윤영(Young Yun) 한국항해항만학회 2007 한국항해항만학회 학술대회논문집 Vol.2 No.춘계
본 논문에서는 CMOS(Complementary Metal Oxide Semi Conductor)를 이용한 L 대역 2단 전력증폭기(Power Amplifier)를 설계하였고, 제작하였다. 제안된 전력증폭기의 출력전력이 최대가 되도록 증폭기의 출력 정합회로를 설계하였고, 최대출력 임피던스는 load-pull 기법을 이용하여 결정하였다. 설계된 전력증폭기는 TSMC CMOS 0.18 ㎛ RF공정으로 제작되었다. 제작된 전력증폭기는 1.5 GHz에서 11.28 dB의 이득과 15 dBm의 출력전력을 보였다. In this paper, CMOS(Complementary Metal Oxide Semiconductor) 2-stage power amplifier was designed and fabricated for L-band application. In order to obtain optimal power characteristic, the power amplifier was designed using optimal power matching technique and load-pull technique. The CMOS power amplifier was fabricated by TSMC 0.18 ㎛ CMOS. The power amplifier showed a gain of 10dB and output power of 15dBm, at 1.5GHz.
Young Yun,Han-Nah Joh,Young-Bae Park,Se-Ho Kim 대한전자공학회 2008 ITC-CSCC :International Technical Conference on Ci Vol.2008 No.7
In this work, a 3D capacitive coupling structure employing periodic pattern was used for application to miniaturized on-chip passive components on MMIC (Monolithic Microwave Integrated Circuit). Unlike conventional periodic structure, the characteristic impedance of the 3D capacitive coupling structure was hardly dependent on frequency. Using the 3D capacitive coupling structure, RF passive component was highly miniaturized in comparison with conventional one.
Young-Bae Park,Han-Nah Joh,Se-Ho Kim,Young Yun,Kyu-Ho Park,Kwang-Ho Ahn 대한전자공학회 2008 ITC-CSCC :International Technical Conference on Ci Vol.2008 No.7
A highly integrated monolithic microwave integrated circuit (MMIC) chip set employing InGap/GaAs/GaAs heterojunction bipolar transistor (HBT) were developed for satellite communication applications. Concretely, using InGap/GaAs/GaAs HBT, downconverter MMIC and an active balun were developed. The downconverter MMIC showed a conversion gain of 9.5 ㏈ and an LO suppression of -30 ㏈c. The fabricated chip, including a mixer, 2 stage IF amplifier, and LO rejection filter, exhibited a small size of 0.8×2.4 ㎟. The size of the active balun was about 31.6 % of conventional passive branch-line coupler.
Miniaturized RF components employing π-type multiple coupled microstrip line structure
Se-Ho Kim,Young-Bae Park,Han-Nah Joh,Young Yun,Kyu-Ho Park,Kwang-Ho Ahn 대한전자공학회 2008 ITC-CSCC :International Technical Conference on Ci Vol.2008 No.7
In this work, using a π-type multiple coupled microstrip line structure (MCMLS), we fabricated highly miniaturized Wilkinson power divider and branch-line coupler. The line length of the Wilkinson power divider and branch-line coupler were reduced to about λ/44 and λ/38, respectively, and their size were 11.2 % and 14.6 % of conventional ones, respectively. The miniaturized Wilkinson power divider and branch-line coupler showed good RF performances in C band.
Miniaturized active balun MMIC employing active device
Young-Bae Park,Se-Ho Kim,Han-Nah Joh,Young Yun,Kyu-Ho Park,Kwang-Ho Ahn 대한전자공학회 2008 ITC-CSCC :International Technical Conference on Ci Vol.2008 No.7
In this paper, miniaturized active baluns employing active device were proposed. The miniaturized active baluns were fabricated employing InGaP/GaAs HBT (heterojunction bipolar transistor) on GaAs substrate for MMIC applications, and especially a composite structure employing common-emitter (CE) and commoncollector (CC) circuits was used for 90° power coupling. The size of the active balun for power coupling was about 1.9 % of conventional passive branch-line coupler. The active baluns for power coupling showed good RF performances comparable to passive branch-line couplers.