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Aerosol Deposition Process for Ceramic Thick Film Formation
Tsurumi Takaaki,Akedo Jun,Sekine Takashi,Momotani Nohoko,Kakemoto Hirofumi,Wada Satoshi 한국분말야금학회 2006 한국분말야금학회 학술대회논문집 Vol.2006 No.1
The 21st Century Frontier Program, which is one of the R&D programs funded by Korean government, was launched in 1999 to elevate the status of Korean science and engineering capabilities to the advanced nation in the strategic fields. Currently, 23 different fields of science and engineering programs are carried out by researchers in institutes, universities and industries. Center for Advanced Materials Processing (CAMP) was formulated in 2001 to develop the advanced materials as well as to improve the parts manufacturing process. The main role of CAMP is proposing and forecasting the long term vision in Materials Processing Technology and also supporting the project teams for their best performance in R&D. The CAMP program consists of 5 research areas such as, Multi-layer Ceramic Electronic Parts, Powder Formed Precision Parts, 3 Dimensional Polymer Based Composites, Functional Metal Sheets, Parts Integration Technology. An introduction of R & D activities at CAMP, specially focusing on powder metallurgy, wil be presented.
Tsurumi, Takaaki,Nam, Song-Min,Mori, Naoko,Kakemoto, Hirofumi,Wada, Satoshi,Akedo, Jun The Korean Ceramic Society 2003 한국세라믹학회지 Vol.40 No.8
The Aerosol Deposition (AD) process will be proposed as a new fabrication technology for the integrated RF modules. $\alpha$-A1$_2$O$_3$ thick films were successfully grown on glass and Al substrates at room temperature by the AD process. Relative dielectric permittivity and loss tangent of the $Al_2$O$_3$ thick films on Al showed 9.5 and 0.005, respectively. To form microstrip lines on aerosol-deposited A1903 thick films, copper electroplating and lithography processes were employed, and the square-type cross section with sharp edges could be obtained. Low-pass LC filters with 10 GHz cutoff frequency were simulated by an electromagnetic analysis, exhibiting the validity of the AD process as a fabrication technology f3r integrated RF modules.