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DTV(Digital TV) 수신 모듈용 광대역 가변 위상기의 설계
한기진,김종필,나형기 한국전자파학회 2003 한국전자파학회논문지 Vol.14 No.3
In this paper, a design method is proposed for the reflection type phase shifter applied to the DTV(Digital TV) receiver, and a phase shifter is designed by using the design equations to satisfy the phase shifting range over 180 degrees for frequency range from 470 MHz to 860 MHz, the receiving band of DTV. From the proposed method, it is possible that the systematic design of the reflection type phase shifter with desired phase shifting range and insertion loss. In addition, it is found that the realized phase shifter satisfies the given specifications. 본 논문에서는 DTV(Digital TV) 수신 모듈에 적용되는 반사형 가변 위상기의 설계를 위한 설계식을 제안하고 이를 이용해 DTV 수신대역인 470 MHz에서 860 MHz까지 180$^{\circ}$ 이상의 위상 가변특성을 만족하는 가변 위 상기를 설계하였다. 제시된 설계식을 이용하여 원하는 위상 가변 범위와 삽입손실을 만족하는 반사형 가변 위상의 체계적인 설계가 가능하며, 제작된 가변 위상기가 주어진 사양을 만족함을 확인할 수 있었다.
한기진,임영현,김영민 대한전자공학회 2014 Journal of semiconductor technology and science Vol.14 No.5
In this study, the effects of the frequency-dependent characteristics of through-silicon vias (TSVs) on the performance of 3D ICs are examined by evaluating a typical interconnection structure, which is composed of 32-nm CMOS inverter drivers and receivers connected through TSVs. The frequency-domain model of TSVs is extracted in S-parameter from a 3D electromagnetic (EM) method, where the dimensional variation effect of TSVs can be accurately considered for a comprehensive parameter sweep simulation. A parametric analysis shows that the propagation delay increases with the diameter and height of the TSVs but decreases with the pitch and liner thickness. We also investigate the crosstalk effect between TSVs by testing different signaling conditions. From the simulations, the worst signal integrity is observed when the signal experiences a simultaneously coupled transition in the opposite direction from the aggressor lines. Simulation results for nine-TSV bundles having regular and staggered patterns reveal that the proposed method can characterize TSV-based 3D interconnections of any dimensions and patterns.