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오성택(S. T. Oh),이인환(I. H. Lee),조해용(H. Y. Cho) (사)한국CDE학회 2014 한국 CAD/CAM 학회 학술발표회 논문집 Vol.2014 No.2
It is known that a 3-D shape can be easily fabricated using the Solid Freeform Fabrication(SFF) technology. However, there are several problems to apply conventional SFF technologies to direct manufacturing of a product. In this regards, multi-material SFF is being focused. Furthermore, a novel three-dimensional electric circuit fabrication using multi-material deposition based on the SFF technology was proposed. This study is focused on the hybrid manufacturing process for a three-dimensional circuit device fabrication based on the multi-material SFF. A hybrid process which was composed of the Fused Deposition Modeling (FDM) and the Direct Writing (DW) is designed. The three-dimensional structure which was fabricated by FDM system of plastic material acts as a insulation material as well as the structure material. And the conducting wires were patterned by DW system using conductive material. During this process, the circuit elements were placed at designed layer of the three-dimensional PCB. Finally, three-dimensional circuits were fabricated, successfully.
오성택(S. T. Oh),이인환(I. H. Lee),김호찬(H. C. Kim),조해용(H. Y. Cho) 대한기계학회 2013 대한기계학회 춘추학술대회 Vol.2013 No.12
Solid Freeform Fabrication (SFF) is being focused on manufacturing field. However, because most products are made up of multiple materials, it is hard to apply conventional SFF technologies to direct manufacturing of a product. For this reason, SFF technology is being required to be capable of multi-material fabrication. Recently, a three-dimensional Printed Circuit Board (PCB) fabrication using multi-material deposition based on the SFF technology was proposed. This study is focused on the development of novel manufacturing technology for a three-dimensional circuit fabrication based on the multi-material SFF. Hybrid system which composed of the Fused Deposition Modeling (FDM) and the Direct Writing (DW) is designed. Plastic material of FDM is constituted for the three-dimensional structure as well as the insulation barrier fabrication and conductive material is patterned as the conducting wire using DW. Three-dimensional circuit samples were fabricated by single manufacturing process.
이인환(I.H.Lee),장성현(S.H.Jang),오성택(S.T.Oh),김민경(M.K.Kim),김호찬(H.C.Kim),조해용(H.Y.Cho) 대한기계학회 2015 대한기계학회 춘추학술대회 Vol.2015 No.11
Additive Manufacturing is being focused to apply for directfabrication of a product. In this paper, 3-Dimensional Circuit Device(3DCD) fabrication based on 3-D Printing technology was proposed. In contrast with general 2-Dimensional Printer Circuit Board(PCB), circuit elements of 3DCD are placed in 3-Dimensional configuration at multiple layers. Therefore, 3DCD technology had a design freedom of an electronic product.