미세 배선 적용을 위한 Ta/Cu 적층 구조에 따른 계면접착에너지 평가 및 분석

손기락,김성태,김철,김가희,주영창,박영배,Son, Kirak,Kim, Sungtae,Kim, Cheol,Kim, Gahui,Joo, Young-Chang,Park, Young-Bae 한국마이크로전자및패키징학회 2021 마이크로전자 및 패키징학회지 Vol.28 No.1

The quantitative measurement of interfacial adhesion energy (Gc) of multilayer thin films for Cu interconnects was investigated using a double cantilever beam (DCB) and 4-point bending (4-PB) test. In the case of a sample with Ta diffusion barrier applied, all Gc values measured by the DCB and 4-PB tests were higher than 5 J/㎡, which is the minimum criterion for Cu/low-k integration without delamination. However, in the case of the Ta/Cu sample, measured Gc value of the DCB test was lower than 5 J/㎡. All Gc values measured by the 4-PB test were higher than those of the DCB test. Measured Gc values increase with increasing phase angle, that is, 4-PB test higher than DCB test due to increasing plastic energy dissipation and roughness-related shielding effects, which matches well interfacial fracture mechanics theory. As a result of the 4-PB test, Ta/Cu and Cu/Ta interfaces measured Gc values were higher than 5 J/㎡, suggesting that Ta is considered to be applicable as a diffusion barrier and a capping layer for Cu interconnects. The 4-PB test method is recommended for quantitative adhesion energy measurement of the Cu interconnect interface because the thermal stress due to the difference in coefficient of thermal expansion and the delamination due to chemical mechanical polishing have a large effect of the mixing mode including shear stress. Cu 배선(interconnect) 적용을 위한 다층박막의 적층 구조에 따른 최적 계면접착에너지(interfacial adhesion energy, Gc) 평가방법을 도출하기 위해, Ta, Cu 및 tetraethyl orthosilicate(TEOS-SiO2) 박막 계면의 정량적 계면접착에너지를 double cantilever beam(DCB) 및 4-점 굽힘(4-point bending, 4-PB) 시험법을 통해 비교 평가하였다. 평가결과, Ta확산방지층이 적용된 시편(Cu/Ta, Cu/Ta/TEOS-SiO2)에서는 두 가지 평가방법 모두 반도체 전/후 공정에서 박리가 발생하지 않는 산업체 통용 기준인 5 J/㎡ 보다 높게 측정되었다. Ta/Cu 시편의 경우 DCB 시험에서만 5 J/㎡ 보다 낮게 측정되었다. 또한, DCB시험 보다 4-PB시험으로 측정된 Gc가 더 높았다. 이는 계면파괴역학 이론에 따라 이종재료의 계면균열 선단에서 위상각의 증가로 인한 계면 거칠기 및 소성변형에 의한 에너지 손실이 증가 하는것에 기인한다. 4-PB시험결과, Ta/Cu 및 Cu/Ta계면은 5 J/㎡ 이상의 높은 계면접착에너지를 보이므로, 계면접착에너지 관점에서는 Ta는 Cu배선의 확산방지층(diffusion barrier layer) 및 피복층(capping layer)으로 적용 가능할 것으로 생각된다. 또한, 배선 집적공정 및 소자의 사용환경에서 열팽창 계수 차이에 의한 열응력 및 화학적-기계적 연마 (chemical mechanical polishing)에 의한 박리는 전단응력이 포함된 혼합모드의 영향이 크므로 4-PB 시험으로 측정된 Gc와 연관성이 더 클 것으로 판단된다.

섬유금속적층판의 모드 I 접합 거동 예측을 위한 Levenberg-Marquardt 기법 기반의 역해석 기법에 관한 수치적 연구

박으뜸 ( Eu-tteum Park ),이영헌 ( Youngheon Lee ),김정 ( Jeong Kim ),강범수 ( Beom-soo Kang ),송우진 ( Woojin Song ) 한국복합재료학회 2018 Composites research Vol.31 No.5

섬유금속적층판은 금속과 섬유 강화 복합소재를 함께 적층한 하이브리드 재료 중 하나다. 섬유금속적층판은 계면의 접착층이 파괴되는 층간분리 현상이 발생할 수 있기 때문에 계면의 접착층에 대한 한계응력과 에너지 해방률을 실험적으로 도출해야만 한다. 하지만, 온도에 따른 에너지 해방률을 실험적으로 도출하는 과정에서 측정 장비의 사용 온도에 대한 제약을 받는다. 따라서, 본 연구에서는 Levenberg-Marquardt 기법을 기반한 역해석기법을 사용하여 접착층에 대한 모드 I 한계응력과 에너지 해방률에 대한 예측 가능성을 확인하는 것이 목표다. 먼저, 한계응력은 접착층의 인장강도와 같다고 가정하였으며, 에너지 해방률은 DCB 시험(double cantilever beamtest)을 수행하여 정의하였다. 또한, 유한요소법 기반 모델을 적용하여 한계응력과 에너지 해방률을 수치해석적으로 예측할 수 있는 지 확인하였다. 그 후, Levenberg-Marquardt 기법을 유한요소법 기반 모델에 적용하여 모드 I 한계응력과 에너지 해방률을 수치해석적으로 예측하였다. 아울러, 본 연구에서 사용한 역해석 기법의 수렴성을 확보하기 위하여 두 가지 경우의 초기 매개변수에 대한 역해석을 추가적으로 수행하였다. 결과적으로, 본 연구에서 사용한 역해석 기법은 모드 I 한계응력과 에너지 해방률을 효과적으로 예측할 수 있음을 보였다. Fiber metal laminate (FML) is a type of hybrid composites which consist of metallic and fiber-reinforced plastic sheets. As the FML has a drawback of the delamination that is a failure of the interfacial adhesive layer, the nominal stresses and the energy release rates should be determined to identify the delamination behavior. However, it is difficult to derive the nominal stresses and the energy release rates since the operating temperature of the equipment is restricted. For this reason, the objective of this paper is to predict the mode-I nominal stress and the mode-I energy release rate of the adhesive layer using the inverse analysis based on the Levenberg-Marquardt method. First, the mode-I nominal stress was assumed as the tensile strength of the adhesive layer, and the mode-I energy release rate was obtained from the double cantilever beam test. Next, the finite element method was applied to predict the mode-I delamination behavior. Finally, the mode-I nominal stress and the mode-I energy release rate were predicted by the inverse analysis. In addition, the convergence of the parameters was validated by trying to input two cases of the initial parameters. Consequently, it is noted that the inverse analysis can predict the mode-I delamination behavior, and the two input parameters were converged to similar values.

ULTRASONIC DETECTION OF INTERFACE CRACK IN ADHESIVELY BONDED DCB JOINTS

Chung, N.-Y.,Park, S.-I.,Lee, M.-D.,Park, C.-H. The Korean Society of Automotive Engineers 2002 International journal of automotive technology Vol.3 No.4

It is well recognized that the ultrasonic method is one of the most common and reliable nondestructive testing (NDT) methods for the quantitative estimation of defects in welded structures. However, NDT techniques applying for adhesively bonded joints have not been clearly established yet. In this paper, the detection of interface crack by the ultrasonic method was applied for the measurement of interfacial crack length in the adhesively bonded joints of double-cantilever beam (DCB). An optimal condition of transmission coefficients and experimental accuracy by the ultrasonic method in the adhesively bonded joints have been investigated and discussed. The experimental values are in good agreement with the computed results by boundary element method (BEM) and Ripling's equation.

미세 Cu 배선 적용을 위한 SiNx/Co/Cu 박막구조에서 Co층이 계면 신뢰성에 미치는 영향 분석

이현철(Hyeonchul Lee),정민수(Minsu Jeong),김가희(Gahui Kim),손기락(Kirak Son),박영배(Young-Bae Park) 한국마이크로전자및패키징학회 2020 마이크로전자 및 패키징학회지 Vol.27 No.3

The effect of Co interlayer on the interfacial reliability of SiNx/Co/Cu thin film structure for advanced Cu interconnects was systematically evaluated by using a double cantilever beam test. The interfacial adhesion energy of the SiNx/Cu thin film structure was 0.90 J/㎡. This value of the SiNx/Co/Cu thin film structure increased to 9.59 J/㎡.Measured interfacial adhesion energy of SiNx/Co/Cu structure was around 10 times higher than SiNx/Cu structure due to CoSi2 reaction layer formation at SiNx/Co interface, which was confirmed by X-ray photoelectron spectroscopy analysis. The interfacial adhesion energy of SiNx/Co/Cu structure decreased sharply after post-annealing at 200℃ for 24 h due to Co oxidation at SiNx/Co interface. Therefore, it is required to control the CoO and Co3O4 formation during the environmental storage of the SiNx/Co/Cu thin film to achieve interfacial reliability for advanced Cu interconnections. 비메모리 반도체 미세 Cu배선의 전기적 신뢰성 향상을 위해 SiNx 피복층(capping layer)과 Cu 배선 사이 50 nm 두께의 Co 박막층 삽입이 계면 신뢰성에 미치는 영향을 double-cantilever beam (DCB) 접착력 측정법으로 평가하였다. DCB 평가 결과 SiNx/Cu 구조는 계면접착에너지가 0.90 J/㎡이었으나 SiNx/Co/Cu 구조에서는 9.59 J/㎡으로 SiNx/Cu 구조보다 약 10배 높게 측정되었다. 대기중에서 200℃, 24시간 동안 후속 열처리 진행한 결과 SiNx/Cu 구조는 0.93 J/㎡으로 계면접착에너지의 변화가 거의 없는 것으로 확인되었으나 SiNx/Co/Cu 구조에서는 2.41 J/㎡으로 열처리 전보다 크게 감소한 것을 확인하였다. X-선 광전자 분광법 분석 결과 SiNx/Cu 도금층 사이에 Co를 증착 시킴으로써 SiNx/Co 계면에 CoSi2 반응층이 형성되어 SiNx/Co/Cu 구조의 계면접착에너지가 매우 높은 것으로 판단된다. 또한 대기중 고온에서 장시간 후속 열처리에 의해 SiNx/Co 계면에 지속적으로 유입된 산소로 인한 Co 산화막 형성이 계면접착에너지 저하의 주요인으로 판단된다.

Effects of hydrophobic agent content in macro-porous substrates on the fracture behavior of the gas diffusion layer for proton exchange membrane fuel cells

Kim, S.,Jeong, B.H.,Hong, B.K.,Kim, T.S. Elsevier Sequoia 2014 Journal of Power Sources Vol.270 No.-

Although the adhesion between the macro-porous substrate (MPS) and micro-porous layer (MPL) of a gas diffusion layer (GDL) is a critical factor that affects the reliability and durability of proton exchange membrane fuel cells, systematic studies quantifying the interfacial fracture energy of GDL have not yet been reported. Therefore, in this study, the interfacial fracture energy of GDLs with different contents of hydrophobic agents in the MPS is quantitatively measured. GDL samples with 0, 5, 10, and 20 wt% of hydrophobic agent content are tested using double cantilever beam fracture mechanics tests. It is observed that the interfacial fracture energy of the GDLs increases as the content of hydrophobic agent increases, due to more favorable interactions between the hydrophobic agents of the MPL and MPS. Optical microscope, scanning electron microscope, and energy-dispersive X-ray spectroscope analyses are performed on the bare and delaminated surfaces in order to investigate the mechanism of the interfacial fracture energy increase of the GDLs.

Ar/N₂ 2단계 플라즈마 처리에 따른 저온 Cu-Cu 직접 접합부의 정량적 계면접착에너지 평가 및 분석

최성훈,김가희,서한결,김사라은경,박영배,Choi, Seonghun,Kim, Gahui,Seo, Hankyeol,Kim, Sarah Eunkyung,Park, Young-Bae 한국마이크로전자및패키징학회 2021 마이크로전자 및 패키징학회지 Vol.28 No.2

3 차원 패키징을 위한 저온 Cu-Cu직접 접합부의 계면접착에너지를 향상시키기 위해 Cu박막 표면에 대한 Ar/N₂ 2단계 플라즈마 처리 전, 후 Cu표면 및 접합계면에 대한 화학결합을 X-선 광전자 분광법(X-ray photoelectron spectroscopy)을 통해 정량화한 결과, 2단계 플라즈마 처리로 인해 Cu표면에 Cu₄N이 형성되어 Cu산화를 효과적으로 억제하는 것을 확인하였다. 2단계 플라즈마 처리하지 않은 Cu-Cu시편은 표면 산화막의 영향으로 접합이 제대로 되지 않았으나 2단계 플라즈마 처리한 시편은 효과적인 표면 산화방지효과로 인해 양호한 Cu-Cu접합을 형성하였다. Cu-Cu직접접합 계면의 정량적 계면접착에너지를 double cantilever beam 시험방법 및 4점 굽힘(4-point bending, 4-PB) 시험방법을 통해 비교한 결과, 각각 1.63±0.24, 2.33±0.67 J/m²으로 4-PB 시험의 계면접착에너지가 더 크게 측정되었다. 이는 계면파괴역학의 위상각(phase angle)에 따른 계면접착에너지 증가 거동으로 설명할 수 있는데 즉, 4-PB의 계면균열선단 전단응력성분 증가로 인한 계면거칠기의 효과에 기인한 것으로 판단된다. The effect of Ar/N₂ two-step plasma treatment on the quantitative interfacial adhesion energy of low temperature Cu-Cu bonding interface were systematically investigated. X-ray photoelectron spectroscopy analysis showed that Ar/N₂ 2-step plasma treatment has less copper oxide due to the formation of an effective Cu4N passivation layer. Quantitative measurements of interfacial adhesion energy of Cu-Cu bonding interface with Ar/N₂ 2-step plasma treatment were performed using a double cantilever beam (DCB) and 4-point bending (4-PB) test, where the measured values were 1.63±0.24 J/m² and 2.33±0.67 J/m², respectively. This can be explained by the increased interfacial adhesion energy according phase angle due to the effect of the higher interface roughness of 4-PB test than that of DCB test.

DETECTION OF INTERFACIAL CRACK LENGTH BY USING ULTRASONIC ATTENUATION COEFFICIENTS ON ADHESIVELY BONDED JOINTS

Chung, N.Y.,Park, S.I. The Korean Society of Automotive Engineers 2004 International journal of automotive technology Vol.5 No.4

In this paper, an interfacial crack length has been detected by using the ultrasonic attenuation coefficient on the adhesively bonded double-cantilever beam (DCB) joints. The correlations between energy release rates which were investigated by experimental measurement, the boundary element method (BEM) and Ripling's equation are compared with each other. The experimental results show that the interfacial crack length for the ultrasonic attenuation coefficient and energy release rate increases proportionally. From the experimental results, we propose a method to detect the interfacial crack length by using the ultrasonic attenuation coefficient and discuss it.

FOWLP 적용을 위한 Cu 재배선과 WPR 절연층 계면의 정량적 계면접착에너지 측정방법 비교 평가

김가희,이진아,박세훈,강수민,김택수,박영배 한국마이크로전자및패키징학회 2018 마이크로전자 및 패키징학회지 Vol.25 No.2

Fan-out wafer level packaging (FOWLP) 적용을 위한 최적의 Cu 재배선 계면접착에너지 측정방법을 도출하기 위해, 전기도금 Cu 박막과 WPR 절연층 계면의 정량적 계면접착에너지를 90o 필 테스트, 4점 굽힘 시험법, double cantilever beam (DCB) 측정법을 통해 비교 평가 하였다. 측정 결과, 세 가지 측정법 모두 배선 및 패키징 공정 후 박리가 일어나지 않는 산업체 통용 기준인 5 J/m2보다 높게 측정되었다. 또한, DCB, 4점 굽힘 시험법, 90o 필 테스트 순으로계면접착에너지가 증가하는 거동을 보였는데, 이는 계면파괴역학 이론에 의해 위상각 증가에 따라 이종재료 계면균열 선단의 전단응력성분 증가에 따른 소성변형에너지 및 계면 거칠기 증가 효과에 의한 것으로 설명이 가능하다. FOWLP 재배선에 대한 최적의 계면접착에너지 도출을 위해서는 시편제작 공정, 위상각 차이, 정량적 측정 정확도 및 결합력 크기등을 고려하여 4점 굽힘 시험법 또는 DCB 측정법을 적절히 혼용 사용하는 것이 타당한 것으로 판단된다. The quantitative interfacial adhesion energy measurement method of copper redistribution layer and WPR dielectric interface were investigated using 90o peel test, 4-point bending test, double cantilever beam (DCB) measurement for FOWLP Applications. Measured interfacial adhesion energy values of all three methods were higher than 5 J/m2, which is considered as a minimum criterion for reliable Cu/low-k integration with CMP processes without delamination. Measured energy values increase with increasing phase angle, that is, in order of DCB, 4-point bending test, and 90o peel test due to increasing roughness-related shielding and plastic energy dissipation effects, which match well interfacial fracture mechanics theory. Considering adhesion specimen preparation process, phase angle, measurement accuracy and bonding energy levels, both DCB and 4-point bending test methods are recommended for quantitative adhesion energy measurement of RDL interface depending on the real application situations.

Effects of Post-annealing and Co Interlayer Between SiNx and Cu on the Interfacial Adhesion Energy for Advanced Cu Interconnections

Hyeonchul Lee,Minsu Jeong,김가희,Kirak Son,Jeongmin Seo,Taek-Soo Kim,Young-Bae Park 대한금속·재료학회 2020 ELECTRONIC MATERIALS LETTERS Vol.16 No.4

Effects of Co interlayer and 200 °C post-annealing treatment on interfacial adhesion energy of SiNx/Cu structure were systematically investigated. Initial interfacial adhesion energy of SiNx/Cu structure measured by double cantilever beam test was 0.92 J/m2. The interfacial adhesion energy increased to 2.94 J/m2 with Co interlayer between SiNx and Cu films. After post-annealing treatment at 200 °C for 500 h, the interfacial adhesion energy of SiNx/Co/Cu structure decreased to 0.95 J/m2. X-ray photoelectron spectroscopy analysis revealed that the interfacial adhesion energy increased for SiNx/Co/Cu thin films due to CoSi2 reaction layer at SiNx/Co interface, but sharply decreased during post-annealing treatment by SiO2 formation at SiNx/Co interface.

Determination of cohesive zone model parameters for tape delamination based on tests and finite element simulations

Seung-Yeun Park,정현용 대한기계학회 2022 JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY Vol.36 No.11

Adhesive tapes are commonly used in electronics and automotive parts, and it is important to predict the peel force of the tapes by finite element simulations. Much research has been conducted to propose different functional forms of the cohesive zone model which are used in finite element simulations, but it is difficult to determine the parameters of those functional forms. In this study a methodology was proposed to determine the parameters of a bilinear cohesive zone model based on the results of the double cantilever beam test and several peel tests, and to predict the peel force at other peel tests by conducting finite element simulations. By comparing the estimated peel forces from finite element simulations to the measured peel forces, the methodology proposed in this study was proven to be simple yet effective.