운송용 조종사의 조직시민행동 인식과 안전문화에 대한 연구

김근수,김기웅,최연철,최성수,Kim, Keun Soo,Kim, Kee Woong,Choi, Yeon Chul,Cho, Seong Soo 한국항공운항학회 2016 한국항공운항학회지 Vol.24 No.3

The purpose of this paper is to analyze the relationship between the perception of organizational citizenship behavior and that of safety culture by airline pilots. Finding factors which composed of organizational citizenship behavior, this paper will prove the effects of those factors to the safety culture of an airline. Organizational citizenship behavior means the activities of members, based on their free will, to enhance organization's overall productivity and performance, which are, however, not officially and apparently approved by the organization. Safety culture is to contain the concept in the organization's protocol, procedure and policy affecting safety performance of the organization. According to the analysis, it was proven compliance of organizational citizenship behaviors has a positive effect on safety culture through job satisfaction. Moreover, altruism and individual initiative have a direct positive effect on safety behavior of pilots.

그래핀/사파이어 기판상에 스퍼터링 후 열처리된 VO₂박막의 구조 및 광학적 특성변화 연구

김근수,김형근,김예나,한승호,배동재,양우석,Kim, Keun Soo,Kim, Hyeongkeun,Kim, Yena,Han, Seung-Ho,Bae, Dong Jae,Yang, Woo Seok 한국진공학회 2013 Applied Science and Convergence Technology Vol.22 No.2

이산화바나듐($VO_2$)는 써모크로믹(thermochromic) 물질로서 온도변화에 따른 구조적 상전이에 의해 전기적, 광학적 특성을 스위칭 할 수 있는 매력적인 소재이며, 최근 신소재로써 그 연구가 활발한 그래핀 역시, 전기적으로나 광학적으로 그 특성이 우수하여 투명전극에 관한 연구가 아주 활발하게 진행되고 있다. 이에 우리는 $VO_2$와 그래핀 두 가지 소재를 접목했을 경우 나타나는 현상을 그래핀의 층 수와 온도를 변수로 하여 형성된 박막의 구조와 광학적 특성을 측정하고 분석하였다. 본 연구 결과에 따르면 그래핀 필름이 전사된 사파이어 기판 위에 형성된 $VO_2$ 박막의 표면구조 및 특성이 bare 사파이어 기판 위의 $VO_2$ 박막보다 그레인이 작고 밀도가 높아 균일하였으며, IR 영역에서의 광투과도 역시 그래핀 필름이 있을 경우 ~10% 정도 개선됨을 확인하였다. 아울러 평균상전이 온도를 낮출 수 있으며, 상전이 히스테리시스 변화폭 또한 좁아지는 것을 확인하였다. $VO_2$ is an attractive thermochromic material, in which its electrical and optical properties can be switched by the structural phase-transition about $68^{\circ}C$. Recently, graphene is also a rising material which is researched as a transparent electrode because of its superior electrical and optical characteristics. In this respect, we try to fabricate the hybridized films using $VO_2$ and graphene on transparent sapphire substrate and then we investigate a structure and characterize an optical property for the samples as a function of temperature. According to the result of IR-transmittance analysis of $VO_2$ films as a function of temperature, the graphene-supported sapphire substrates are better about 10% than the bare sapphire substrates. The mean phase transition temperatures are also decreased as the number of graphene-layers increased and the hysteresis of phase transitions are narrowed.

Ag 인쇄배선과 이종재료기판과의 접합계면

김근수,허석환,Kim, Keun-Soo,Suganuma, Katsuaki,Huh, Seok-Hwan 대한용접접합학회 2011 대한용접·접합학회지 Vol.29 No.5

Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ink-jet printing with Ag nano particle inks demonstrated the potentials of the new printed electronics technology. The bonding at the interface between the Ag wiring layer and the various substrates is very important. In this study, the details of interfaces in Ag wiring are investigated primarily by microstructure observation. By adjusting the materials and sintering conditions, nicely formed interfaces between Ag wiring and Cu, Au or organic substrates are achieved. In contrast, transmission electron microscope (TEM) image clearly shows interface debonding between Ag wiring and Sn substrate. Sn oxides are formed on the surface of the Sn plating. The formation of these is a root cause of the interface debonding.

순 Sn 도금에서의 Sn 휘스커 성장제어 기술

김근수,Kim, Keun-Soo 대한용접접합학회 2013 대한용접·접합학회지 Vol.31 No.3

Sn whiskers are one of the serious causes of the failure of electronics. Sn whiskers grow spontaneously from Sn-based, lead-free finished surfaces, even at room temperature. A primary factor of these Sn whiskers growth is compressive stress, which enhances the diffusion of Sn or other elements. The sources of compressive stress are the growth of non-uniform large intermetallic compounds along the interface between the Sn grain boundary and Cu substrate. Recent studies revealed the methods for reducing Sn whisker growth. This paper gives an overview about recent researches for mitigation methods of Sn whisker growth during nearly room temperature storage.

Human ALG-2 C-말단의 전사활성화 능력 분석

김근수,김은희,Kim, Keun-Soo,Kim, Eun-Hee 배재대학교 자연과학연구소 1999 自然科學論文集 Vol.11 No.1

ALG-2 (apoptosis linked gene-2) is a 22 kDa calcium-binding protein necessary for apoptosis induced by various stimuli in lymphocyte. The transactivation of human ALG-2 was assessed in yeast as a fusion protein with the DNA binding domains (DBDs) of LexA. The C-terminal of hALG-2 (93-191 amino acid) exhibited transacitivation of the reporter gene, LacZ, whereas the full-length hALG-2 (1-91 amino acid) and its N-terminal (1-98 amino acid) did not. The transactivation of LacZ reporter was driven more strongly (more than 2.7-fold increase) by the C-terminus of hALG-2 than by the B42, as a positive control for transactivation. Hence, our data suggested a possible regulatory role of the N-termini of hALG-2 upon transactivation. 본 연구에서는 다양한 신호에 의해 면역세포를 세포사멸로 유도하는 22 kDa의 calcium-binding 단백질인 ALG-2 (apoptosis linked gene-2) 에 대해 LexA DNA blinding domain (DBD) 과 융합시킨 Lex/ALG-2 융합단백질을 이용하여 효모에서의 전사활성화 능력을 측정하였다. hALG-2의 전사활성화 능력을 측정한 결과 전체 ALG-2 (아미노산 1-191) 와 N-말단 (아미노산 1-98) 에서는 전사활성화 능력은 보이지 않았으나, C-말단 (아미노산 93-191) 에서는 reporter 유전자인 LacZ를 전사활성화 시킴을 확인하였다. hALG-2 C-말단의 전사활성화 능력은 양성 대조구로 사용한 Lex-B42에 비하여 2.7배 강한 것으로 나타났다. 본 연구의 결과는 hALG-2의 N-말단에 전사 억제 조절 신호가 존재할 가능성을 시사한다고 보여진다 .

도전성접착제/Sn도금의 계면특성에 미치는 Cl의 영향

김근수,이기주,허석환,Kim, Keun-Soo,Lee, Ki-Ju,Suganuma, Katsuaki,Huh, Seok-Hwan 한국마이크로전자및패키징학회 2011 마이크로전자 및 패키징학회지 Vol.18 No.3

본 연구에서는 Ag-에폭시계 도전성접착제와 Sn도금 부품의 접합체를 이용하여 고온 고습 분위기($85^{\circ}C$/85%RH) 중에서의 미세조직과 전기저항의 변화를 중심으로 계면열화에 미치는 Cl의 영향을 검토하였다. $85^{\circ}C$/85%RH 분위기에서 전형적인 Cl량이 함유된 Ag-에폭시계 도전성접착제를 사용한 접합체의 전기저항은 Cl 함유량이 적은 접합제를 사용한 접합체에 비해 시간의 경과에 따라 급격히 증가하는 경향을 나타내었다. 그 원인을 밝히기 위해 미세조직을 분석한 결과, 고Cl 접합체의 경우, Sn 산화물과 Sn-Cl-O가 Sn도금/Ag-에폭시계 도전성접착제의 계면에 불균일하게 생성되어 있는 반면, 저Cl 접합체에서는 Sn-Cl-O생성이 관찰되지 않았고, Sn산화물도 비교적 적은 것을 알았다. 이러한 결과들을 통해 Ag-에폭시계 도전성접착제에 함유된 Cl이 Ag-에폭시계 도전성접착제와 Sn도금 부품 접합체의 전기적 열화를 가속시키는 원인 중의 하나임을 알았다. In this study, the degradation mechanism of mounted chip resistors with Ag-epoxy isotropic conductive adhesives (ICAs) under the humidity exposure ($85^{\circ}C$/85%RH) was examined by electrical resistance change and microstructural study. The effect of the chloride content in Ag-epoxy ICA on joint stability was also examined. The increasing range of the electrical resistance in the typical ICA joint was greater than that in the low Cl content ICA joint. In the case of the typical ICA joint, Sn oxides such as SnO, $SnO_2$, and Sn-Cl-O were formed inhomogeneously on the surface of the Sn plating during the $85^{\circ}C$/85%RH test. In contrast, no Sn-Cl-O was found in the low Cl content ICA joint during the $85^{\circ}C$/85%RH. It is suggested that Cl in Ag-epoxy ICA accelerate the electrical degradation of Sn plated chip components joined with Ag-epoxy ICA.

전자기기의 시장환경조건과 신뢰성시험

김근수,Kim, Keun-Soo 한국마이크로전자및패키징학회 2012 마이크로전자 및 패키징학회지 Vol.19 No.4

The quality and performance of electronic parts and equipment are affected by various types of stresses. Thermal stress caused by changes in the ambient usage environment and mechanical stress from vibration shock during transportation can degrade both quality and performance. This paper gives an overview about recent researches for measuring market environmental conditions of electronic equipments.

태양전지 모듈의 신뢰성 평가

김근수,Kim, Keun-Soo 한국마이크로전자및패키징학회 2012 마이크로전자 및 패키징학회지 Vol.19 No.2

Long-term reliability of Si photovoltaic modules is a crucial issue for the cost-reduction on the power-supply system. To elevate this reliability, several environmental tests have been created as qualification and certification procedures. This paper gives an overview about recent researches of reliability tests for Si photovoltaic modules.

Sn 휘스커 연구동향

김근수,Kim, Keun-Soo 한국마이크로전자및패키징학회 2012 마이크로전자 및 패키징학회지 Vol.19 No.4

Sn whiskers are a serious cause of failure in electronic devices as they create short circuits. Sn whisker growth and mitigation have been investigated by many Japanese consortia including JEITA and JAXA. This paper gives an overview about recent researches of JEITA and JAXA.

절대 절점 좌표를 이용한 유연 다물체계의 대변형 해석

김근수(Keun-soo Kim),김광석(Kwang-suk Kim),유완석(Wan-suk Yoo) 한국자동차공학회 2000 한국자동차공학회 지부 학술대회 논문집 Vol.- No.-

The large deformation problems are recently issued in the flexible multibody dynamics. In this paper, the absolute nodal coordinate formulation is applied for the large deformation analysis of flexible multibody systems.<br/> In the absolute nodal coordinates, global slopes are used to define the orientation of the elements. The deried formulation is compared to other formulation via numerical examples.<br/>