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Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer
Seok‑Bon Koo,Chang‑Myeon Lee,Sang‑Jun Kwon,Jun‑Mi Jeon,Jin‑young Hur,Hong‑Kee Lee 대한금속·재료학회 2019 METALS AND MATERIALS International Vol.25 No.1
This paper experimentally confirmed that the adhesion strength of the copper layer formed on the surface of the polyimidefilm by wet plating greatly changes with the aging time. The adhesion strength of the copper layer showed a rapid increasefrom 4 to 10 h after aging had begun and then converged to a value without a significant change. The adhesion enhancementbetween polyimide film and copper layer by aging is due to the interlocking effect caused by the volume expansion of copperoxide (CuO) formed in the polyimide, the increased mobility of copper particles enlarged by the decrease of impuritiesin the copper layer grain boundaries, and the consequent change of the crystal structure of the copper layer leading to theinternal stress reduction. Such adhesion improvement can be confirmed by the progress of the cohesive failure indicatingthe breakdown of the polyimide film.
구석본(Seok-Bon Koo),전준미(Jun-Mi Jeon),이창면(Chang-Myeon Lee),허진영(Jin-Young Hur),이홍기(Hong-Kee Lee) 한국표면공학회 2018 한국표면공학회지 Vol.51 No.4
The self-annealing which leads evolution of microstructure in copper electroplating layers at room temperature occurs after forming deposition layer. During the process, crystal orientation, size and sheet resistance of plating layer change. Lastly, it causes the change of physical and mechanical characteristics such as a tensile strength of plating layer. In this study, the variation of incorporated impurities, microstructure and sheet resistance of copper plating layer formed by electroplating are measured with and without inorganic additives during the self-annealing. In case of absence of inorganic additives, the copper layer presents strong total intensity of incorporated impurities. During the self-annealing, such width of reduction was significant. Moreover, microstructure and crystal size are increased while the tensile strength is decreased noticeably. On the other hand, in the presence of inorganic additives, there is no observable distinction in the copper plating layer. According to the observation on movements of the incorporated impurities in electrodeposition copper layer, within 12 hours the impurities are continuously shifted from inside of the plating layer to its surface after as-deposited electroplating. Within 24 hours, except for the small portion of surface layer, it is considered that most of the microstructure is transformed.
Reappraisal of the work hardening behavior of bulk amorphous matrix composites
Lee, Chang-Myeon,Park, Kyoung-Won,Lee, Jae-Hoon,Lee, Hong-Gie,Jang, Jae-Il,Lee, Jae-Chul Elsevier 2009 Materials science & engineering. properties, micro Vol.513 No.-
<P><B>Abstract</B></P><P>This paper investigates the origin of work hardening in amorphous composites by directly measuring the hardness variations of crystalline particles and amorphous matrices at various strains. The work hardening of the amorphous composites was caused predominantly by hardening of the amorphous matrices, rather than of the crystalline particles. The hardening mechanism was explained based on the kinetics and thermodynamics.</P>
Lee, Mirim,Lee, Chang-Myeon,Lee, Kwang-Ryeol,Ma, Evan,Lee, Jae-Chul Elsevier 2011 Acta materialia Vol.59 No.1
<P><B>Abstract</B></P><P>The local structures of metallic glasses have been analyzed previously in term of various types of short-range order (SRO). However, the SRO alone, neglecting the interconnection of neighboring icosahedra to medium range and beyond, is insufficient to account for the structure–property relationship in metallic glasses. In this study, we use molecular dynamics (MD) simulations of Cu–Zr binary metallic glasses to examine the effects of the next level of structural hierarchy: the interpenetrating connection of icosahedra (ICOI) and the linkage of the medium-range ICOI patches to form networks of icosahedra over extended range. The mechanical properties of these metallic glasses, especially the shear transformations that mediate plasticity, are found to be dependent on the degree of ICOI and development of the ICOI network. The evolution of the ICOI network during shear deformation, as well as the composition dependence, has been monitored and discussed.</P>
Role of Nanocrystals on the Plasticity of Amorphous Alloy
( Chang-Myeon Lee ),( Soo-Won Chae ),( Hwi-Jun Kim ),( Jae-Chul Lee ) 대한금속재료학회 ( 구 대한금속학회 ) 2007 METALS AND MATERIALS International Vol.13 No.3
The role of nanocrystals on the plasticity of the Cu64Zr36 amorphous alloy was studied in terms of the initiation of shear bands and the propagation of cracks. The plastic deformation behaviors of the fully amorphous and the partially crystallized samples with various degrees of crystallinity were compared. The partially crystallized alloys with an adequate amount of nanocrystals showed a considerable enhancement in their plasticity. Finite element calculations were conducted to qualitatively examine the role of the nanocrystals on the formation of the shear bands, while high-resolution electron microscopy was used to directly observe the crack propagation behavior through the matrix with (or without) nanocrystals.
논문 : 비정질 합금의 자유부피 생성기구: 분자동력학적 고찰
이창면 ( Chang Myeon Lee ),박경원 ( Kyoung Won Park ),이병주 ( Byeong Joo Lee ),심재혁 ( Jae Hyeok Shim ),이재훈 ( Jae Hoon Lee ),이재철 ( Jae Chul Lee ) 대한금속재료학회 ( 구 대한금속학회 ) 2008 대한금속·재료학회지 Vol.46 No.11
This study examined the creation mechanism of free volume during homogeneous deformation induced by the elastostatic compression at room temperature. Experiments demonstrated that amorphous alloys subjected to the elastostatic compression underwent structural disordering, during which densely packed polyhedra breakdown to form new, loosely packed ones, resulting in the creation of excess free volume. A combination of experiments and molecular dynamics simulations are used to explore fundamental issues on how free volume is created during elastostatic compression.
Epidemic Trends of Imported Shigellosis Cases in Korea and Japan, 2016–2020
Won-Chang Lee,Myeon-Jin Lee,Kyu Sung Kim,Young Hwan Kwon 한국항공우주의학협회 2023 항공우주의학회지 Vol.33 No.3
Purpose: To observe and compare the trends in epidemic aspects of imported shigellosis (Sg) cases from overseas travelers (OTs) in Korea and Japan between 2016 and 2020. Methods: We analyzed the raw data of imported Sg cases from the Korea Diseases Control and Prevention Agency and the National Institute of Infectious Diseases in Japan between 2016 and 2020. Results: In Korea, there were a total of 596 Sg infections, including 353 cases from overseas travel-associated imported cases, with a cumulative incidence rate (CIR) of 0.23 per 100,000 populations. The CIR of imported Sg cases was 0.32 per 100,000 OTs. In Japan, during the same period, there were a total of 757 Sg cases, including 388 imported cases, with a CIR of 0.12 per 100,000 populations. The CIR of imported Sg cases was 0.50 per 100,000 OTs. The CIR of total Sg cases in Korea was higher than in Japan, but the CIR of imported cases in Korea was lower than in Japan (P<0.01). Additionally, the imported-to-domestic cases ratio of Sg in Korea (1.45) was higher than in Japan (1.05) (P<0.05). Conclusion: Based on the trends in the epidemiological aspects of domestic and imported Sg infection cases in both countries, a robust information system is needed to provide effective warnings and preventive measures for travelers visiting high-risk areas.
무전해 구리 도금액에서 착화제가 접합력에 미치는 영향에 대한 고찰
이창면(Chang-myeon Lee),전준미(Jun-Mi Jeon),허진영(Jin-young Hur),이홍기(Hong-kee Lee) 한국표면공학회 2014 한국표면공학회지 Vol.47 No.4
The primary purpose of this research is to investigate how much the complexing agent in electroless Cu electrolytes will affect adhesion strength between copper film and Ta diffusion barrier for Cu interconnect of semiconductor. The adhesion strength using rochelle’s salt as complexing agent was higher than the case of using EDTA-4Na. Effect of complexing agent on adhesion strength and electrical resistivity was studied in crystal structural point of view.