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Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer
Seok‑Bon Koo,Chang‑Myeon Lee,Sang‑Jun Kwon,Jun‑Mi Jeon,Jin‑young Hur,Hong‑Kee Lee 대한금속·재료학회 2019 METALS AND MATERIALS International Vol.25 No.1
This paper experimentally confirmed that the adhesion strength of the copper layer formed on the surface of the polyimidefilm by wet plating greatly changes with the aging time. The adhesion strength of the copper layer showed a rapid increasefrom 4 to 10 h after aging had begun and then converged to a value without a significant change. The adhesion enhancementbetween polyimide film and copper layer by aging is due to the interlocking effect caused by the volume expansion of copperoxide (CuO) formed in the polyimide, the increased mobility of copper particles enlarged by the decrease of impuritiesin the copper layer grain boundaries, and the consequent change of the crystal structure of the copper layer leading to theinternal stress reduction. Such adhesion improvement can be confirmed by the progress of the cohesive failure indicatingthe breakdown of the polyimide film.
구석본(Seok-Bon Koo),전준미(Jun-Mi Jeon),이창면(Chang-Myeon Lee),허진영(Jin-Young Hur),이홍기(Hong-Kee Lee) 한국표면공학회 2018 한국표면공학회지 Vol.51 No.4
The self-annealing which leads evolution of microstructure in copper electroplating layers at room temperature occurs after forming deposition layer. During the process, crystal orientation, size and sheet resistance of plating layer change. Lastly, it causes the change of physical and mechanical characteristics such as a tensile strength of plating layer. In this study, the variation of incorporated impurities, microstructure and sheet resistance of copper plating layer formed by electroplating are measured with and without inorganic additives during the self-annealing. In case of absence of inorganic additives, the copper layer presents strong total intensity of incorporated impurities. During the self-annealing, such width of reduction was significant. Moreover, microstructure and crystal size are increased while the tensile strength is decreased noticeably. On the other hand, in the presence of inorganic additives, there is no observable distinction in the copper plating layer. According to the observation on movements of the incorporated impurities in electrodeposition copper layer, within 12 hours the impurities are continuously shifted from inside of the plating layer to its surface after as-deposited electroplating. Within 24 hours, except for the small portion of surface layer, it is considered that most of the microstructure is transformed.
Lee, Mirim,Lee, Chang-Myeon,Lee, Kwang-Ryeol,Ma, Evan,Lee, Jae-Chul Elsevier 2011 Acta materialia Vol.59 No.1
<P><B>Abstract</B></P><P>The local structures of metallic glasses have been analyzed previously in term of various types of short-range order (SRO). However, the SRO alone, neglecting the interconnection of neighboring icosahedra to medium range and beyond, is insufficient to account for the structure–property relationship in metallic glasses. In this study, we use molecular dynamics (MD) simulations of Cu–Zr binary metallic glasses to examine the effects of the next level of structural hierarchy: the interpenetrating connection of icosahedra (ICOI) and the linkage of the medium-range ICOI patches to form networks of icosahedra over extended range. The mechanical properties of these metallic glasses, especially the shear transformations that mediate plasticity, are found to be dependent on the degree of ICOI and development of the ICOI network. The evolution of the ICOI network during shear deformation, as well as the composition dependence, has been monitored and discussed.</P>
Reappraisal of the work hardening behavior of bulk amorphous matrix composites
Lee, Chang-Myeon,Park, Kyoung-Won,Lee, Jae-Hoon,Lee, Hong-Gie,Jang, Jae-Il,Lee, Jae-Chul Elsevier 2009 Materials science & engineering. properties, micro Vol.513 No.-
<P><B>Abstract</B></P><P>This paper investigates the origin of work hardening in amorphous composites by directly measuring the hardness variations of crystalline particles and amorphous matrices at various strains. The work hardening of the amorphous composites was caused predominantly by hardening of the amorphous matrices, rather than of the crystalline particles. The hardening mechanism was explained based on the kinetics and thermodynamics.</P>
Role of Nanocrystals on the Plasticity of Amorphous Alloy
( Chang-Myeon Lee ),( Soo-Won Chae ),( Hwi-Jun Kim ),( Jae-Chul Lee ) 대한금속재료학회 ( 구 대한금속학회 ) 2007 METALS AND MATERIALS International Vol.13 No.3
The role of nanocrystals on the plasticity of the Cu64Zr36 amorphous alloy was studied in terms of the initiation of shear bands and the propagation of cracks. The plastic deformation behaviors of the fully amorphous and the partially crystallized samples with various degrees of crystallinity were compared. The partially crystallized alloys with an adequate amount of nanocrystals showed a considerable enhancement in their plasticity. Finite element calculations were conducted to qualitatively examine the role of the nanocrystals on the formation of the shear bands, while high-resolution electron microscopy was used to directly observe the crack propagation behavior through the matrix with (or without) nanocrystals.
무전해 동 도금을 위한 초음파 적용 주석-은-팔라듐 활성화 공정에 대한 연구
이창면(Chang-myeon Lee),허진영(Jin-young Hur),이홍기(Hong-kee Lee) 한국표면공학회 2014 한국표면공학회지 Vol.47 No.6
An ultrasound-assisted Sn-Ag-Pd activation method for electroless copper plating was presented in this study. With this activation process, it was shown that the fine catalyst particles were homogeneously distributed with high density on the entire specimen. In addition, it was observed that incubation period occurred during the electroless plating step was decreased owing to the absorption of Ag which holds high catalytic activity. Resulting from the refinement and high densification of catalyst, the defect-free gap-fill was achieved within the 20x nm trench
비정질 합금의 중주기배열구조 및 이 구조가 소성에 미치는 역할: 분자동력학적 연구
이창면 ( Chang Myeon Lee ),이미림 ( Mi Rim Lee ),이광렬 ( Kwang Ryeol Lee ),강경한 ( Kyung Han Kang ),이병주 ( Byeong Joo Lee ),이재철 ( Jae Chul Lee ) 대한금속·재료학회 2010 대한금속·재료학회지 Vol.48 No.2
The local structural states of amorphous alloys have been depicted previously via short-range orders (SROs). However, the concept of SROs alone is inadequate and sometimes insufficient to explain the structure-property relation of the amorphous alloys. In this study, we propose new types of medium-range building structures that affect the mechanical properties, plasticity in particular. Using a combination of molecular dynamics simulations and the Voronoi tessellation method, we demonstrate a three-dimensional configuration of icosahedral medium-range orders (I-MROs) and elucidate how these icosahedral orders evolve by the application of shear deformation. It was observed that the structural stability of the icosahedral orders relies largely on how they are linked via percolation and this linking is explained in detail.
무전해 구리 도금액에서 착화제가 접합력에 미치는 영향에 대한 고찰
이창면(Chang-myeon Lee),전준미(Jun-Mi Jeon),허진영(Jin-young Hur),이홍기(Hong-kee Lee) 한국표면공학회 2014 한국표면공학회지 Vol.47 No.4
The primary purpose of this research is to investigate how much the complexing agent in electroless Cu electrolytes will affect adhesion strength between copper film and Ta diffusion barrier for Cu interconnect of semiconductor. The adhesion strength using rochelle’s salt as complexing agent was higher than the case of using EDTA-4Na. Effect of complexing agent on adhesion strength and electrical resistivity was studied in crystal structural point of view.