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UV- and thermal-curing behaviors of dual-curable adhesives using divinyl sulfone
임승호,김하은,황태성,김정수,장영욱,김동현 한국공업화학회 2020 한국공업화학회 연구논문 초록집 Vol.2020 No.-
The dual curable adhesive was prepared using a sequential dual curing system based on the thiol-acrylate-epoxy formulation. The curing proceeds the UV-curing of thiol-acrylate and the thermal-curing of thiol-epoxy which requires a photo-initiator and a catalyst, respectively. The presence of sulfone in the thiol-acrylate reaction shows a high reaction selectivity and reaction rate. Thiol-acrylate-epoxy resin was synthesized using thiol monomer with four functionality, diacrylate monomer, and bisphenol A diglycidyl ether. The chemical structure of dual curable adhesive was characterized using a fourier transform infrared spectrophotometer. Thermal stability of dual curable ones was analyzed by thermogravimetric analysis. The adhesion strength and peel strength of dual curable ones were compared with using the universal testing machine.
임승호,Im, Seung-Ho 한국상하수도협회 1980 水道 Vol.23 No.-
필자의 외국 하수도 시찰보고서를 2회에 나누어 게재한다. 많은 참고있기를 바랍니다
임승호,Im, Seung-Ho 한국상하수도협회 1980 水道 Vol.22 No.-
필자의 외국 하수도 시찰보고서를 2회에 나누어 게재한다. 많은 참고있기를 바랍니다