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한민섭(Min-Seop Han),허세곤(Segon Heo),김웅(Woong Kim),민병권(Byung-Kwon Min) 한국생산제조학회 2010 한국공작기계학회 추계학술대회논문집 Vol.2010 No.-
Recently demands for precision micro-machining of hard and brittle material has dramatically increased in various industrial applications. In case of mechanical machining low surface integrity is produced due to the surface fractures and cracks. In this study thermal assisted mechanical micromachining of glass is proposed to improve the geometric accuracy and surface integrity by utilizing electrochemical discharge phenomena. Experimental investigation demonstrates improved machining performance for the fabrication of micro-features such as micro-holes and micro-channels of glass material.
한민섭(Min-Seop Han),허세곤(Segon Heo),김웅(Woong Kim),민병권(Byung-Kwon Min) 한국생산제조학회 2010 한국생산제조시스템학회 학술발표대회 논문집 Vol.2010 No.10
Recently demands for precision micro-machining of hard and brittle material has dramatically increased in various industrial applications. In case of mechanical machining low surface integrity is produced due to the surface fractures and cracks. In this study thermal assisted mechanical micromachining of glass is proposed to improve the geometric accuracy and surface integrity by utilizing electrochemical discharge phenomena. Experimental investigation demonstrates improved machining performance for the fabrication of micro-features such as micro-holes and micro-channels of glass material.
한민섭(Min-Seop Han),민병권(Byung-Kwon Min),이상조(Sang Jo Lee) 한국생산제조학회 2009 한국생산제조시스템학회 학술발표대회 논문집 Vol.2009 No.5
Electrochemical discharge machining (ECDM)process is one of spark based micromachining methods especially for microstructuring of nonconductive materials such as glass and ceramics. In ECDM process spark discharge is produced by the dielectric gas film which formed by the coalescence of electrochemically generated gas bubbles. ECDM process has been suffered from achieving uniform geometry of microstructures because of the irregular gas film characteristics. In this study various technical approaches, pulse voltage, side insulated electrode and ultrasonic vibrated electrolyte are proposed to improve the geometric accuracy of ECDM process. Side insulated electrode helps improve the spark discharge uniformity by localizing the electrolysis at the tool tip, while ultrasonic vibrated electrolyte enhances the flushing effects at the gap between the tool and the workpiece. Experimental investigation demonstrates that geometric accuracy of microchannel and microhole is improved by using the proposed methods.
한민섭(Min-Seop Han),김성수(Seong Su Kim),민병권(Byung-Kwon Min),이승우(Seung Woo Lee),이진하(Jin Ha Lee),이혜진(Hye-Jin Lee) 한국생산제조학회 2008 한국생산제조시스템학회 학술발표대회 논문집 Vol.2008 No.5
As the semiconductor wafer is required to be thinner for better compactness and higher integrity of the electronic products, mechanical dicing saw technique using the diamond blade is facing serious problems such as low cutting speed, tool wear, side wall crack and back side chipping. Recently, UV laser dicing process has emerged as an alternative methods to the blade dicing especially for the very thin wafers below 100㎛. In this study 355 ㎚ UV laser dicing system has been developed in order to improve the productivity and reliability of ultra thin wafer dicing process. For the quality improvement of the developed dicing system various laser parameters are investigated such as power, speed and frequency of the laser beam. Moreover various measurement techniques are employed to evaluate the dicing quality using optical microscope, SEM and focused ion beam.
한민섭,김성수,민병권,이승우,이진하,이혜진 한국공작기계학회 2008 한국공작기계학회 춘계학술대회논문집 Vol.2008 No.-
As the semiconductor wafer is required to be thinner for better compactness and higher integrity of the electronic products, mechanical dicing saw technique using the diamond blade is facing serious problems such as low cutting speed, tool wear, side wall crack and back side chipping. Recently, UV laser dicing process has emerged as an alternative methods to the blade dicing especially for the very thin wafers below 100㎛. In this study 355 nm UV laser dicing system has been developed in order to improve the productivity and reliability of ultra thin wafer dicing process. For the quality improvement of the developed dicing system various laser parameters are investigated such as power, speed and frequency of the laser beam. Moreover various measurement techniques are employed to evaluate the dicing quality using optical microscope, SEM and focused ion beam.
한민섭,민병권,이상조 한국공작기계학회 2009 한국공작기계학회 춘계학술대회논문집 Vol.2009 No.-
Electrochemical discharge machining (ECDM)process is one of spark based micromachining methods especially for microstructuring of nonconductive materials such as glass and ceramics. In ECDM process spark discharge is produced by the dielectric gas film which formed by the coalescence of electrochemically generated gas bubbles. ECDM process has been suffered from achieving uniform geometry of microstructures because of the irregular gas film characteristics. In this study various technical approaches, pulse voltage, side insulated electrode and ultrasonic vibrated electrolyte are proposed to improve the geometric accuracy of ECDM process. Side insulated electrode helps improve the spark discharge uniformity by localizing the electrolysis at the tool tip, while ultrasonic vibrated electrolyte enhances the flushing effects at the gap between the tool and the workpiece. Experimental investigation demonstrates that geometric accuracy of microchannel and microhole is improved by using the proposed methods.