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PET-CT에 사용하는 방사성 동위원소 18F를 이용한 납가운의 유용성 평가
조영학,박명철,송지원,임채영,김기진,유세종,이진회,김정호 대한안전경영과학회 2016 대한안전경영과학회 학술대회논문집 Vol.2016 No.04
본 연구의 목적은 임상의 핵의학, PET 진단 분야에서 진단 시에 사용되는 방사성 동위원소 중 18F를 이용하여 납가운의 두께 별 에너지스펙트럼을 측정하고 납가운 0.3, 0.5mmPb에 대한 차폐율을 측정하고자 하였다. 에너지 스펙트럼 측정의 경우 자체 제작한 방법으로 측정하였고 차폐율 및 선량 측정의 경우 납가운과 선원의 거리에 대 해 선원과 측정기에 대해 납 가운의 위치를 달리 하여 3가지 조건으로 나누어 각각 20회씩 측정을 하여 평균값을 산출하였다. 에너지 스펙트럼 상에서는 납가운을 위치하 였을 때 본래 방사성 동위원소로부터 방출되는 에너지 외의 에너지 피크영역이 측정 되었고 차폐율 및 선량측정에서는 방사성동위원소 18F은 납가운을 이용하여 차폐를 할 경우 차폐율이 매우 미비하거나 음수의 값이 측정되었다.
치아회분(齒牙灰粉)과 도재(陶材) 복합(複合) 매식체(埋植體)에 관(關)한 광학현미경(光學顯微鏡) 급(及) 주사전자현미경적(走査電子顯微鏡的) 연구(硏究)
조영학,Cho, Young-Hak 대한치과보철학회 1984 대한치과보철학회지 Vol.22 No.1
The purpose of this study was to investigate whether the ashed tooth powder is utilized as an alternative material of the implant to recovery the bony defect. For this purpose its biocompatibility was evaluated comparing to the synthetic calcium phosphate compounds, such as Syntograft and Calcitite, as well as the vacuum firing porcelain (Ceramco Inc.) which is anticipated to use as a matrix to aid sintering. Bony defects to exposure the bone marrow, $3{\times}5$ mm in size, were created in the right and left tibias of fifteen rabbits, and then the ashed tooth powder at $950^{\circ}C$, the porcelain powder, Syhtograft and Calcitite were inserted in the defects of twelve rabbits of the experimental group and the blood clot only was filled in the defects of three rabbits of the control group. The experimental and control rabbits were sacrificed at 1st, 2nd 3rd week after implantation and the histologic examination was performed. The ashed tooth powder in order to make the needed form of the implant was molded using the cylindrical mold 1 cm high, 1 cm in diameter under the pressure of $1000kg/cm^2$ and the ashed tooth powder was sintered at $1100^{\circ}C$ for 1 hour and the mixture of the porcelain powder and the ashed tooth powder at the weight ratio of 7:3, 6:4, 5:5, 4:6 were molded in the same manner and were sintered at $925^{\circ}C$. From this sintered material, square shaped implants were prepared in the dimension of $2{\times}4{\times}6mm$. The prepared implants were surgically placed in the subperiosteum of lateral surfaces of the right and left mandibular bodies. The dogs were sacrificed at 4 weeks, and then the specimens were examined using the light and scanning electron microscopes. The results of this study were obtained as follows: 1. Any inflammatory response was not noted after implanting of the ashed tooth powder, Syntograft, Calcitite and the porcelain powder during the whole experimental period after implantation. 2. Induction of the new bone formation was significantly shown in the ashed tooth powder, Syntograft and Calcitite. 3. The more the porcelain powder was contained in the implants, the more the porosity was and the bigger the pore size was under the scanning electron microscope. And there was ingrowing of the fibrous connective and the osteoid tissue. 4. The osteoid tissues were found to be directly fused to the implant of the ashed tooth powder, and the mixture implant of the porcelain powder and the ashed tooth powder at the weight ratio of 4:6 under the light and scanning electron microscopes.
조영학,김사라은경,김성동,Cho, Young Hak,Kim, Sarah Eunkyung,Kim, Sungdong 한국마이크로전자및패키징학회 2013 마이크로전자 및 패키징학회지 Vol.20 No.1
3D 적층 IC 개발을 위한 본딩 기술의 현황에 대해 알아보았다. 실리콘 웨이퍼를 본딩하여 적층한 후 배선 공정을 진행하는 wafer direct bonding 기술보다는 배선 및 금속 범프를 먼저 형성한 후 금속 본딩을 통해 웨이퍼를 적층하는 공정이 주로 연구되고 있다. 일반적인 Cu 열압착 본딩 방식은 높은 온도와 압력을 필요로 하기 때문에 공정온도와 압력을 낮추기 위한 연구가 많이 진행되고 있으며, 그 가운데서 Ar 빔을 조사하여 표면을 활성화 시키는 SAB 방식과 실리콘 산화층과 Cu를 동시에 본딩하는 DBI 방식이 큰 주목을 받고 있다. 국내에서는 Cu 열압착 방식을 이용한 웨이퍼 레벨 적층 기술이 현재 개발 중에 있다. 3D stacked IC is one of the promising candidates which can keep Moore's law valid for next decades. IC can be stacked through various bonding technologies and they were reviewed in this report, for example, wafer direct bonding and atomic diffusion bonding, etc. As an effort to reduce the high temperature and pressure which were required for high bonding strength in conventional Cu-Cu thermo-compression bonding, surface activated bonding, solid liquid inter-diffusion and direct bonding interface technologies are actively being developed.
조영학,이민석,박성현,김예솔,이은정,임성갑 한국생물공학회 2021 Biotechnology and Bioprocess Engineering Vol.26 No.2
For last two decades, the demand for precisely engineered three-dimensional structures has increased continuously for the developments of biomaterials. With the recent advances in micro- and nano-fabrication techniques, various devices with complex surface geometries have been devised and produced in the pharmaceutical and medical fields for various biomedical applications including drug delivery and biosensors. These advanced biomaterials have been designed to mimic the natural environments of tissues more closely and to enhance the performance for their corresponding biomedical applications. One of the important aspects in the rational design of biomaterials is how to configure the surface of the biomedical devices for better control of the chemical and physical properties of the bioactive surfaces without compromising their bulk characteristics. In this viewpoint, it of critical importance to secure a versatile method to modify the surface of various biomedical devices. Recently, a vapor phase method, termed initiated chemical vapor deposition (iCVD) has emerged as damage-free method highly beneficial for the conformal deposition of various functional polymer films onto many kinds of micro- and nano-structured surfaces without restrictions on the substrate material or geometry, which is not trivial to achieve by conventional solutionbased surface functionalization methods. With proper structural design, the functional polymer thin film via iCVD can impart required functionality to the biomaterial surfaces while maintaining the fine structure thereon. We believe the iCVD technique can be not only a valuable approach towards fundamental cell-material studies, but also of great importance as a platform technology to extend to other prospective biomaterial designs and material interface modifications for biomedical applications.