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김대곤,김종웅,하상수,정재필,신영의,문정훈,정승부,Kim, Dae-Gon,Kim, Jong-Woong,Ha, Sang-Su,Jung, Jae-Pil,Shin, Young-Eui,Moon, Jeong-Hoon,Jung, Seung-Boo 대한용접접합학회 2006 대한용접·접합학회지 Vol.24 No.2
The 3-dimensional (3D) chip stacking technology is a leading technology to realize a high density and high performance system in package (SiP). There are several kinds of methods for chip stacking, but the stacking and interconnection through Cu filled through-hole via is considered to be one of the most advanced stacking technologies. Therefore, we studied the optimum process of through-hole via formation and Cu filling process for Si wafer stacking. Through-hole via was formed with DRIE (Deep Reactive ion Etching) and Cu filling was realized with the electroplating method. The optimized conditions for the via formation were RE coil power of 200 W, etch/passivation cycle time of 6.5 : 6 s and SF6 : C4F8 gas flow rate of 260 : 100 sccm. The reverse pulsed current of 1.5 A/dm2 was the most favorable condition for the Cu electroplating in the via. The Cu filled Si wafer was chemically and mechanically polished (CMP) for the following flip chip bumping technology.
Wetting Balance Test를 이용한 솔더의 젖음성 분석
정도현,임동욱,백범규,임송희,윤종혁,정재필,Jung, Do-hyun,Lim, Dong-uk,Baek, Bum-gyu,Yim, Song-hee,Yoon, Jong-hyuk,Jung, Jae Pil 한국마이크로전자및패키징학회 2017 마이크로전자 및 패키징학회지 Vol.24 No.2
Recently, there has been a continuous researches on solders having sophisticated and improved performance due to demand for high-density and miniaturization of electronics, and development of solder for automotive electronics which can be used in harsh environment. When developing a new solder alloy, there is a wettability of solder on substrate for things to consider, and the wetting balance test is one of the methods for measuring that one. In this paper, the wetting balance test is introduced, and the calculus of the surface tension of solder and the contact angle between solder and substrate using wetting curve obtained is introduced too. In detail, the principle and test method of the wetting balance test, the introduction of the parameters with important meaning in the wetting curve, the method of calculating the contact angle as well as the surface tension of the solder using the shape of the solder meniscus.