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다구찌 기법을 이용한 스크린 프린팅 공정에서의 실리콘 웨이퍼 응력 해석
이승창(S. C. Lee),김찬기(C. K. Kim),송희은(H. E. Song),김영석(Y. S. Kim) 한국소성가공학회 2012 한국소성가공학회 학술대회 논문집 Vol.2012 No.10
Screen printing is key of the process in manufacturing silicon solar cells. There are a variety of variables to characterize the process performances in screen printing process. In this study, we have studied about the impact of variables such as the snap off, squeegee pressure, squeegee speed on the stress distributions of silicon wafer and breakage rate evaluated by the stress level during the process. For this purpose, finite element analysis has been performed according to Taguchi design of experiments. We analyzed the factors most effecting on the wafer quality performance. Also optimal screen printing conditions for lower breakage rate were selected according to the thickness of wafer.
김찬기(C. K. Kim),박진기(J. G. Park),이승창(S. C. Lee),서창희(C. H. Suh),김동모(D. M. Kim),김영석(Y. S. Kim) 한국소성가공학회 2012 한국소성가공학회 학술대회 논문집 Vol.2012 No.10
In recent, Because of its rustproof property, Stainless steel is widely used in kitchen appliances, building materials, electronics, chemical plants and automobile exhausts. In addition, the utilization of stainless steel for fuel cell application is growing. As the demand for this material increases, it is necessary to study the basic properties of stainless steel such as corrosion resistance, heat transfer, formability, cutting or shearing ability and weld ability. In this study, FLD test and Uniaxial tensile and biaxial tensile test of Stainless steel 304 were performed. R-value and stress-strain curve were obtained. Biaxial tensile tests with cruciform specimen were performed until the breakdown of specimen occurs. The yield surface are made by application of plastic work theory. The results are compared with the theoretical prediction based on the Hill, Mises, Logan-Hosford model.