http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
ICB seeding에 의한 CVD Cu 박막의 증착 및 특성 분석
윤경렬,최두진,김석,김기환,고석근,Yoon, Kyoung-Ryul,Choi, Doo-Jin,Kim, Seok,Kim, Ki-Hwan,Koh, Seok-Keun 한국재료학회 1996 한국재료학회지 Vol.6 No.7
ICB 공정으로 선행 증착한 Cu Seeding 층이 이후의 CVD 공정으로 증착하는 최종의 Cu 박막의 기계적 전기적 특성에 미치는 영향을 고찰하였고, seening을 하지 않은 CVD-Cu 박막과의 특성을 비교하였다. seeding 층을 형성한 경우의 CVD-Cu 박막에 있어서 증착 속도가 증가하였으며, grain 크기의 균일성도 향상되는 경향을 보였다. 증착된 Cu 박막은 seening에 무관하게 모두 FCC 우선배향인 (111)의 결정배향을 나타냈으며, seeding 우에 성정된 박막의 경우 $I_{111}/I_{200}$비가 향상되었다.$ 180^{\circ}C$의 동일 조건하에서 증착하는 경우 $40\AA$ seeding층 위에 성장한 박막의 전기비저항이 $2.42\mu$$\Omega$.cm로 낮은 값을 나타내었으며, 130$\AA$ seeding 경우는 오히려 전기비저항이 증가하는 경향을 나타내었다. Cu 박막의 접착력은 seeding층의 두께가 $0\AA$에서 $130\AA$으 증가함에 따라 21N에서 27N 으로 향상되었다. Cu films were deposited by chemical wapor deposition on the as-received substrates (TiN/Si) and three kinds of Cu-seeded substrates (Cu/TiN/Si) which had seeding layer in the thick ness of 5 ${\AA}$ and 130 ${\AA}$ coated by ICB(Ionized Cluster Beam) method. The effect of Cu seeding layers on the growth rate, crystallinity, grain size uniformity and film adhesion strength of final CVD-Cu films was investigated by scanning eletron microscopy(SEM), X-ray diffractometry and scratch test. The growth rate was found to incresase somewhat in the case of ICB-seeding. The XRD patterns of the Cu films on the as-received substrate and ICB Cu-seeded substrates exhibited the diffraction peaks corresponding to FCC phase, but the peak intensity ratio($I_{111}/I_{200}$) of Cu films deposited on the ICB Cu-seeded substrates increased compared with that of Cu films on the as-received substrate. The resistivity of final Cu film on 40 ${\AA}$ seeded substrate was observed as the lowest value, 2.42 $\mu\Omega\cdot$cm compared with other Cu films. In adhesion test, as the seeding thickness increased from zero to 130 ${\AA}$, the adhesion strength increased from 21N to 27N.
3.5MCuCl₂+0.5MHCl+0.5MKCl 용액으로 식각된 구리표면의 결합상태에 대한 정량적 분석연구
강민구,김석,오경희,윤경렬 연세대학교 산업기술연구소 1995 논문집 Vol.27 No.2
Thermally evaporated copper was chemically etched with 3.5McuCl₂+0.5MHCl+0.5MKCl at room temperature. X-ray photoelectron was used to characterize the surface chemical bonding states. The result shows that the surface of chemically etched copper with 3.5McuCl₂+0.5MHCl+0.5MKCl solution is composed of carbon, oxygen, chlorine and copper. Through the quantitative comparison and bonding state analysis of the photoelectron spectra and Auger electron spectra for the surface elements, the qualitative and quantitative bonding states of Cu could be characterized as Cu-Cu, Cu-Cl, Cu-O, and Cu-2Cl bonds.
윤경렬(KyongRyol Yoon),곽병철(ByongChul Kwak) 한국자동차공학회 2006 한국자동차공학회 춘 추계 학술대회 논문집 Vol.- No.-
Noise and Vibration problems in SUV's and minivans are getting important due to customer's high demand for a quiet interior. In these vehicle, a tailgate plays a critical role in these problems, especially vehicle's low frequency booming phenomena, because it has relatively weak mounting structures while a large amount of mass and volumes is fitted to a rear part of the vehicle body. In this paper, the modal analysis on a tailgate component has been carried out and the analysis results have been correlated with a test. In order to estimate the vehicle structural-acoustic performance, an road noise simulation has been conducted using FEA. The frequency response function also has been done to hold the effect of tailgate sensitivity with respect to a low frequency noise. Improvement technique has been conducted and the result has been applied into designing tailgate structure. Throughout the improvement technique, an emphasis has been placed on high performance optimized solutions.