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문종태,엄용성,이종현,Moon, Jong-Tae,Eom, Yong-Sung,Lee, Jong-Hyun 대한용접접합학회 2015 대한용접·접합학회지 Vol.33 No.3
With the simplicity of process and high reliability in chip or package bonding, epoxy solder paste (ESP) has been recently considered as a competitive bonding material. The ESP material is composed of solder powder and epoxy formulation which can remove oxide layers on the surface of solder powder and pad finish metal. The bonding formed using ESP shows outstanding bonding strength and suppresses electrical short between adjacent pads or leads owing to the reinforced structure by cured epoxy after the bonding. ESP is also expected to suppress the formation and growth of whisker on the pads or leads. With the mentioned advantages, ESP is anticipated to become a spotlighted bonding material in the assembly of flexible electronics and electronic modules in automotive vehicles.
고해상도 근접 센서, 자율 주행 및 차세대 통신 시스템을 위한 94GHz 대역 팬-아웃 웨이퍼 레벨 패키지(FOWLP)
주지호(Jiho Joo),이상흥(Sang-Heung Lee),김동영(Dong-Young Kim),최광문(Gwang-Mun Choi),신정호(Jungho Shin),이찬미(Chanmi Lee),장기석(Ki-seok Jang),오진혁(Jin Hyuk Oh),정지은(Ji-Eun Jung),이가은(Gaeun Lee),엄용성(Yong-Sung Eom),최광성(Kwa 대한전자공학회 2024 대한전자공학회 학술대회 Vol.2024 No.6