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PEEK(Polyetheretherketone)고분자 플라스틱의물리적 변화 연구
박기원(Ki-Won Park) 한국산업기술융합학회(구. 산업기술교육훈련학회) 2024 산업기술연구논문지 (JITR) Vol.29 No.1
cmp공정은 반도체 칩 생산에 있어서 중요한 핵심 공정이다. 이는 웨이퍼의 박막표면의 균일성에 따라 광역 평탄화를 실현 할 수 있기 때문이다. 현재 현업에서 사용되고 있는 리테이너링은 웨이퍼 표면 연마 시 박막표면을균일하게 유지시키는 중요한 부품으로써 금속과 플라스틱을 본딩으로 접착한 스타일의 링이 다양한 공정에서 사용되고 있다. 이는 제작하는 기간이 길고 접착되는 부분의 탈착되는 현상과 금속의 내경면에 슬러리가 달라붙어응고되어 일부는 임의 탈락으로 인한 웨이퍼에 스크레치를 유발 시키는 문제가 발생되고 있다. 본 논문에서는 이러한 문제점을 개선하고자 기존 방식 보다는 사출type의 인서트 내장형 링의 개발방안을모색하였다. 현재 Engineering Plastics인 PEEK(Polyetheretherketone)재료를 이용한 사출성에 관한 연구는다소 부족한 상황이다. 따라서, 연구개발에 있어서 보다 더 정확하고 신속한 방향 설정이 필요하다는 점을 인식하여 기기분석을 통해 재질의 안정성 및 물질의 온도 특성을 분석하고 이를 기반으로 인서트 몰드 링 사출조 건에 적용하고자 연구를 하게 되었다. The cmp process is key to the uniformity of the thin film surface of wafers in semiconductor chip production. Retaining is an important process that is used in the field to maintain the surface of a thin film uniformly during wafer polishing; additionally, a ring is used in a style that facilitates the bonding of metal and plastics in various processes. This results in an extended manufacturing period and the adhering and subsequent solidification of the slurry to the diameter of the inner surface of the metal, which results in a scratch on the wafer owing to arbitrary dropout. This study aimed to replace the existing method by developing an injection-type insert-embedded ring to address the aforementioned challenge. Thermal stress tests for the accurate injection of polyetheretherketone materials detected phenol, phenyl ether, and dibenzofuran components using Py-Gc/MS. DSC analysis showed that the glass transition temperature was as high as 150 °C and the melting temperature was 342 °C. During TG-DTA, the heat weight was reduced by 50%, and the change in the calorific value of the peak occurred at 585.1 °C when the heating and cooling rates were constant.
부모의 방임 및 학대가 청소년의 학교생활적응에 미치는 영향
박기원(Ki Won Park) 한국아동학회 2014 아동학회지 Vol.35 No.1
In this paper, the effects of parental neglect and abuse on school adjustment mediated by social withdrawal in adolescents were examined using a sample of 2,163 second grade middle school students(1,096 boys and 1,067 girls) from the Korean Child and Youth Panel Survey(KCYPS) data set. All research variables were measured using self-reported questionnaires. They were analyzed by means of Structural Equation Modeling. The results indicated that parents` abuse had no direct effect, but there was an indirect effect on adolescents` school adjustment mediated by adolescents` social withdrawal. Parental neglect had a direct effect on adolescents` school adjustment and also had an indirect effect on adolescents` school adjustment mediated by social withdrawal. The results indicate that parental neglect is a more significant contributor than adolescents` social withdrawal on adolescents` school adjustment. The results of this study show that parenting attitude, more specifically parental neglect, tend to be more important factors on school adjustment compared to adolescents` psychological problems, such as social withdrawal in adolescence. Taken together, these findings suggest that interventions aimed at improving parental neglect and adolescents` social withdrawal need to be emphasized if adolescents are to better adjust to school life.
CMP용 리테이닝 링의 재질이 웨이퍼의 연마성능에 미치는 영향
박기원(Ki-Won Park),김은영(Eun-young Kim),박동삼(Dong-Sam Park) 한국기계가공학회 2020 한국기계가공학회지 Vol.19 No.3
This paper investigates the effects of retaining ring materials, particularly PPS and PEEK, used in the CMP process, on wafer polishing and ring wear. CMP can be performed using bonded type retaining rings made with PPS or injection molding type retaining rings made with PEEK. In this study, after polishing a wafer with a PPS retaining ring, the average profile height of the wafer was 0.098 μm less than that of the wafer polished with a PEEK retaining ring, implying that PPS retaining rings achieve a higher polishing rate. In addition, the center area of the wafer profile had less deviation and improved flatness after polishing with the PPS ring. These results indicate that a higher polishing rate and smaller profile height deviation can be achieved using retaining rings made with PPS compared to retaining rings made with PEEK. Therefore, with semiconductor circuit patterns becoming finer and wafer sizes becoming larger, the use of PPS in CMP retaining rings can obtain more stable wafer polishing results compared to that of PEEK.