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난청 고령자의 우울정도, 인지기능, 의사소통능력 및 정량뇌파 분석 연구
김형재(Hyoung Jae Kim),원희욱(Hee Wook Weon) 한국산학기술학회 2021 한국산학기술학회논문지 Vol.22 No.4
본 연구는 난청 고령자의 우울정도, 인지기능, 의사소통능력 및 정량뇌파를 분석하고, 관련성을 규명할 목적으로 시도하였다. Y 시 소재의 S 청능재활 센터를 내원한 60세 이상의 난청 고령자 중 모집공고문을 통해 남성 37명, 여성 26명이 2020년 6월 20일부터 2020년 9월 3일까지 자발적으로 참여했다. 구조화된 설문지를 통해 대상자의 전반적인 특성, 우울정도, 인지기능을 평가하였다. 의사소통능력의 척도인 단어인지도는 한국표준 단음절어를 사용하여 진단용 청력검사기로 평가하였다. 정량뇌파는 전전두엽 Fp1과 Fp2에 건식 전극을 사용하여 2채널 뇌파 측정기로 측정하였다. 수집된 자료는 SPSS/WIN 25.0 프로그램으로 인구 사회학적 특성 파악을 위한 빈도분석, 변수간 Pearson’s correlation분석, 3분할 집단 간 One-way ANOVA분석을 하였다. 결과를 요약하면 다음과 같다. 의사소통능력은 전전두엽 좌우 대칭성(<SUP>**</SUP>p <.01)과 정(+)적 상관관계를 보였고, 우뇌 정신적 산만 및 스트레스(<SUP>*</SUP>p <.05)와 부(-)적 상관관계를 보였다. 그러나 우울정도와 인지기능과는 유의한 상관관계는 없었다. 의사소통능력에 따른 3분할 집단별 차이 검정에서도 전전두엽 좌우 대칭성(<SUP>**</SUP>p <.01)이 우울정도와 인지능력보다 높은 수준의 상관관계를 보였다. 이상의 결과는 정량뇌파에서 측정된 전전두엽 좌우 대칭성이 난청 고령자의 의사소통능력의 강력한 생체적 지표 가능성을 시사 하였다. The purpose of this study was to analyze the degree of depression, cognitive function, communication ability, and the quantitative electroencephalogram (EEG) in elderly individuals with hearing loss and to investigate their inter-relationship. Hearing-impaired elderly participants, aged 60 years or older (37 men and 26 women) who visited the S Hearing Rehabilitation Center in Y City from June 20, 2020, to September 3, 2020, participated voluntarily after a recruitment announcement.The participants’ overall characteristics, depression, and cognitive functions were evaluated with a structured questionnaire. The Word Recognition Score (WRS) was evaluated with an audiometer using the Korean Standard Monosyllabic Word Lists for Adults (KS-MWL-A). The quantitative EEG was measured with dry electrodes using a 2-channel EEG on the frontal lobes Fp1 and Fp2. The results are summarized as follows: Communication ability showed a positive correlation with the left-right symmetry of the frontal lobes (<SUP>**</SUP>p<.01) and a negative correlation with right-brain mental distraction and stress (<SUP>*</SUP>p<.05). In the difference WRS test for each group, the left-right symmetry of the frontal lobes (<SUP>**</SUP>p<.01) showed the greatest correlation with communication ability. Our results suggest that the left-right symmetry of the frontal lobes can be a biomarker indicative of the communication ability of older people with hearing impairments.
김구연,김형재,박범영,이현섭,박기현,정해도,Kim, Goo-Youn,Kim, Hyoung-Jae,Park, Boum-Young,Lee, Hyun-Seop,Park, Ki-Hyun,Jeong, Hae-Do 한국전기전자재료학회 2004 전기전자재료학회논문지 Vol.17 No.10
Chemical Mechanical Polishing (CMP) is referred to as a three body tribological system, because it includes two solids in relative motion and the CMP slurry. On the assumption that the abrasives between the pad and the wafer could be a major reason not only for the friction force but also for material removal during polishing, the friction force generated during CMP process was investigated with the change of abrasive size and concentration of CMP slurry. The threshold point of average coefficient of friction (COF) with increase in abrasives concentration during interlayer dielectric (ILD) CMP was found experimentally and verified mathematically based on contact mechanics. The predictable models, Mode I (wafer is in contact with abrasives and pad) and Mode II (wafer is in contact with abrasives only), were proposed and used to explain the threshold point. The average COF value increased in the low abrasives concentration region which might be explained by Mode I. In contrast the average COF value decreased at high abrasives concentration which might be regarded to as Mode II. The threshold point observed seemed to be due to the transition from Mode I to Mode II. The tendency of threshold point with the variation of abrasive size was studied. The increase of particle radius could cause contact status to reach transition area faster. The correlation between COF and material removal rate was also investigated from the tribological and energetic point of view. Due to the energy loss by vibration of polishing equipment, COF value is not proportional to the material removal rate in this experiment.
조성환,김형재,김호윤,서헌덕,김경준,정해도,Cho, Sung-Hwan,Kim, Hyoung-Jae,Kim, Ho-Youn,Kim, Heon-Deok,Seo, Kyoung-Jun,Jeong, Hae-Do 대한기계학회 2001 大韓機械學會論文集A Vol.25 No.10
This study presents the possibility of scratch reduction on wafer in CMP by applying the ultrasonic and megasonic energy into the slurry which might contain large abrasive particles. Experiments were conducted to verify the dispersion ability of agglomerated particles by applying ultrasonic, megasonic waves and analyze the particle distribution of used slurry in case, of sonic energy assisted or none. And the dispersion stability of megasonic waves was investigated through the experiment of stability of the dispersed slurry, Finally, to confirm that the distribution of particles in slurry by ultrasonic waves was actually related to scratches on wafer when CMP was done, tungsten blanket wafer was processed, by CMP to compare and investigate scratches on wafer.
연마불균일도에 영향을 미치는 패드 표면특성에 관한 연구
박기현,박범영,김형재,정해도,Park, Ki-Hyun,Park, Boum-Young,Kim, Hyoung-Jae,Jeong, Hae-Do 한국전기전자재료학회 2006 전기전자재료학회논문지 Vol.19 No.4
Pad surface characteristics such as roughness, groove and wear rate of pad have a effect on the within wafer non-uniformity(WIWNU) in chemical mechanical polishing(CMP). Although WIWNU increases as the uniformity of roughness(Rpk: Reduced peak height) becomes worse in an early stage of polishing time, WIWNU decreases as non-uniformity of the Rpk value. Also, WIWNU decreases with the reduction of the pad stiffness, though original mechanical properties of pad are unchanged by the grooving process. In addition, conditioning process causes the inequality of pad wear during in CMP. The profile of pad wear generated by the conditioning process has a significant effect on the WIWNU. These experiments results could help to understand the effect of pad surface characteristics in CMP.
산화막 CMP에서 발생하는 온도가 연마특성에 미치는 영향
김영진,박범영,김형재,정해도,Kim, Young-Jin,Park, Boum-Young,Kim, Hyoung-Jae,Jeong, Hae-Do 한국전기전자재료학회 2008 전기전자재료학회논문지 Vol.21 No.2
We investigated the effect of process temperature on removal rate and non-uniformity based on single head kinematics in oxide CMP. Generally, it has been known that the temperature profile directly transfers to the non~uniformity of removal rate on the wafer, which has similar tendency with the sliding distance of wafer. Experimental results show that platen velocity is a dominant factor in removal rate as well as average temperature. However, the non-uniformity does not coincide between process temperature and removal rate, due to slurry accumulation and low deviation of temperature. Resultantly, the removal rate is strongly dependent on the rotational speed of platen, and its non -uniformity is controlled by the rotational speed of polishing head. It means lower WIWNU (With-in-wafer-non-uniformity) can be achieved in the region of higher head speed.
이현섭,박범영,정해도,김형재,Lee, Hyun-Seop,Park, Boum-Young,Jeong, Hae-Do,Kim, Hyoung-Jae 한국전기전자재료학회 2007 전기전자재료학회논문지 Vol.20 No.1
Most studies on copper Chemical Mechanical Planarization (CMP) have focused on material removal and its mechanisms. Although many studies have been conducted on the mechanism of Cu CMP, a study on uniformity in Cu CMP is still unknown. Since the aim of CMP is global and local planarization, the approach to various factors related to uniformity in Cu CMP is essential to elucidate the Cu CMP mechanism as well. The main purpose of the experiment reported here was to investigate and mechanically analyze the roles of slurry components in the formation of the uniformity in Cu CMP. In this paper, Cu CMP was performed using citric acid($C_{6}H_{8}O_{7}$), hydrogen peroxide($H_{2}O_{2}$), colloidal silica, and benzotriazole($BTA,\;C_{6}H_{4}N_{3}H$) as a complexing agent, an oxidizer, an abrasive, and a corrosion inhibitor, respectively. All the results of this study showed that within-wafer non-uniformity(WIWNU) of Cu CMP could be controlled by the contents of slurry components.