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Al, Ag 박막에서 Electromigration과 Adhesion에 관한 연구
김대일(D.I. Kim),전진호(J.H. Jeon),박영래(Y.R. Park),최재승(J.S. Choi),김진영(J.Y. Kim) 한국진공학회(ASCT) 1992 Applied Science and Convergence Technology Vol.1 No.2
본 논문은 Al, Ag박막에서 엘렉트로마이그레이션 현상에 의한 힐록, 기공형성과 접착력에 대하여 연구하였다. Mo보트를 이용하여 1×10^(-7)Torr의 진공도에서 전자-빔 증착기로 현미경용 유리기판에 약 1000Å의 두께로 Al, Ag박막을 각각 증착하였다. Al, Ag박막에서 엘렉트로마이그레이션에 의한 결함을 연구하기 위하여 1×10^5(A/㎠) 의 d.c. 전류를 인가하였고 Scratch Method와 Tape Method로 Al과 Ag박막의 접착력을 측정하였다. 기공과 힐록, 그리고 스크레치 채널은 SEM과 광학현미경 사진을 이용하여 분석하였다. Al박막에서는 엘렉트로마이그레이션으로 힐록과 기공이 양극부분과 음극부분에서 각각 관찰되었다. 반면에 Ag박막에서는 Coulombic force에 의해 기공과 힐록이 양극부분과 음극부분에서 각각 형성되어 역엘렉트로마이그레이션 현상을 보였다. 접착력은 산소 친화력이 강한 Al박막에서 Ag박막 보다 크게 나타났다. The formation of hillocks and voids due to the electromigration and the adhesion force of Al and Ag thin films have been investigated. Thin films of 1000Å thickness were deposited onto slideglass substrates by electron-beam deposition system from Mo boats in a high vacuum in the range of 10^(-7)Torr. A constant d.c. current of 1×10^5(A/㎠) stressing has been stressed on Al and Ag thin films in order to observe the failures due to the electromigration. And the adhesion forces of Al and Ag thin films were measured by using scratch method and tape method. Hillocks and scratch channel were also characterized by utilizing scanning electron microscopy and optical microscope. In Al thin films, void formed near the negative region and hillocks formed near the positive region, which is mainly caused by the electron wind force. In contrast, Ag thin films resulted in the formation of voids near the positive region and hillocks near the negative region caused by Coulombic force. Al/glass showed stronger adhesion force than Ag/glass. This is believed to be due to the higher oxygen affinity of Al than that of Ag.
육성돈 사료 내 단백질원으로써 사과 부산물의 영양소 이용성 평가
김대일(D. I. Kim),장금일(G. I. Jang),유도일(D. I. Yoo),조진호(J. H. Cho) 충북대학교 동물생명과학연구소 2015 동물생명과학연구 Vol.7 No.-
This study was conducted to investigate the nutrient evaluation of apple by-product as protein source in growing pigs diet. A 14-day trial with 10 [(YorkshirexLandrace)xDuroc)] finishing pigs (average body weight = 30 ㎏) was conducted to investigate the dry matter (DM), energy (E) and nitrogen (N) digestibility and utilization. Treatments of this study included: 1) CON (basal diet) and 2) ABP (basal diet + 2% apple by-product). With regard to DM and E digestibity, there were no significantly differences (P>0.05). Also, with regard to N utilization, there were no significantly differences (P>0.05). In conclusion, apple by-product, incorporated up to 2 percent in the diet of 30 kg pigs, did not show any adverse effects on nutrient utilization as protein source.
초고집적 Sub micron 박막금속화를 위한 Dielectric Overlayer의 Passivation 효과
김대일(D. I. Kim),김진영(J. Y. Kim) 한국진공학회(ASCT) 1994 Applied Science and Convergence Technology Vol.3 No.1
극소전자 디바이스의 고접적화와 더불어 박막배선의 선폭은 0.5 ㎛ 이하까지 축소되며 초고집적 submicron 박막금속화가 진행되고 있다. 미세화로에 적용되어지는 배선재료는 인가되는 고전류밀도로 인하여 electromigration에 의한 결함이 쉽게 발생한다는 단점이 있다. 금속박막 전도체 위의 dielectric overlayer는 electromigration에 대한 passivation 효과를 보여 극소전자 디바이스의 평균수명을 향상시킨다. 본 연구에서는 박막금속화에서 dielectric overlayer의 passivation 효과를 알아보기 위하여 약 3000 Å의 SiO₂ 절연 보호막을 1000 Å 두께의 Al, Al-1%Si, Ag, 그리고 Cu 박막배선 위에 증착하여 SiO₂ 절연 보호막의 유무에 따른 박막배선의 수명변화 및 신뢰도(σ)를 측정하였다. 박막배선에 인가된 전류밀도는 1×10^6 A/㎠와 1×10^7 A/㎠이었다. SiO₂ dielectric overlayer는 Al, Al-1%Si, Ag, Cu 박막배선에서 electromigration에 대한 보호막 효과를 보이며 평균수명을 모두 향상시킨다. SiO₂ passivation 효과는 Al, Ag, Cu 박막 중 Cu 박막배선에서 가장 크게 나다났다. SiO₂ dielectric overlayer가 형성되지 않은 경우 Al 박막배선의 수명이 가장 긴 것으로 나타났으나 SiO₂가 형성된 경우는 Cu 박막배선의 수명이 가장 길게 나타났다. ULSI submicron thin film metallizations of microelectronic devices have continuously reduced the line width up to less than 0.5 ㎛. Thin film metallizations in a microelectronic circuit undergo a high current density, which results in a electromigration induced failures seriously. Dielectric overlayers on a thin film conductor increase the lifetime of a microelectronic device showing passivation effects on the electromigration. In this study, 3000 Å SiO₂ dielectric overlayers were deposited onto 1000 Å Al, Al-1%Si, Ag, and Cu thin film metallizations of investigate the dielectric passivation overlayer effects. Changes of a lifetime and a reliability (σ) were measured and compared with non-passivation metal films. The current densities were 1×10^6 and 1×10^7 A/㎠ . SiO₂ dielectric overlayers showed the passivation effects on the electromigration resulting in the increased lifetime in all the Al, Ag, and Cu thin film metallizations. While a Al thin film showed the longest lifetime in the non-passivated Al, Ag, Cu thin films, a Cu thin film showed the longest lifetime in the SiO₂ passivated Al, Ag, Cu thin films.
최근 한국 연안해역에 출현하는 유해적조 플랑크톤 침편모조류 Chattonella의 특성
김대일(D. I. Kim),노일현(I. H. Noh),윤양호(Y. H. Yoon) 한국해양환경·에너지학회 2005 한국해양환경·에너지학회 학술대회논문집 Vol.2005 No.11
Harmful algal blooms are common world-wide and pose a serious problem to the aquaculture and fisheries industries. Flagellates such as Cochlodinium polykrikoides, Heterosigma akashiwo, Karenia mikimotoi and Chattonella aniiqua are recognised potentially harmful bloom organisms implicated in fish mortalities in Korean coastal waters. Although a bloom of Chattonella antiqua was reported for the first time from Jindong bay in 1983, the chloromonads species, however were never found in such high cell concentrations and formed large blooms in Korean coastal waters since 1983. In addition, the history of Chattonella spp. in the Korean coastal waters is not long. Because the cells are so fragile and difficult to preserve, they might be overlooked if cell density is low. We has been conducted an extensive marine phytoplankton monitoring program for several years, and Chattonella spp, were routinely found during regular monitoring in the Yeosu coast of southern Korea. We describes that the composition and distribution of Chattonella with environmental characteristics were based on bottle samples collected weekly from May 2004 to October 2005 at four stations. All 4 species were identified (C. antiqua, C. marina, C. globosa and C. ovata). In addition, C. globosa and C. ovata were firstly recorded in Korean coastal waters. Those are mainly presented during the spring-summer seasons when water temperature and salinity ranged 17.8~28.4℃ and 28.1~33.9 psu respectively. C. globosa was initially appeared and following C. antiqua, C. marina and C. ovata. The most abundant cell concentrations were regularly measured at the middle layers. No bloom events of Chattonella occurred during the period of our observation, but it seems that environmental conditions may be followed by the great possibility of the blooms of Chattonella in Korean coastal waters. Therefore, continued monitoring for this species is needed to learn more about its life cycle, ecological role and potential for fish kills.
섬유강화 복합재료, 고분자 포움 및 레진 콘크리트로 구성된 샌드위치 구조 설계를 위한 파라메트릭 연구
김대일(D.I. Kim),장승환(S.H. Chang) 한국생산제조학회 2005 한국생산제조시스템학회 학술발표대회 논문집 Vol.2005 No.5
In this paper sandwich structures like beams and plates are optimised by using parametric study. The structures are composed of fibre reinforced composites for facial material and resin concrete and PVC foam for core materials. The stacking sequences and thickness of the composites are controlled as major parameters to find out the optimal condition for machine tool components. For the plate structure for machine tool bed composites-skined sandwich structure which has several ribs are proposed to enhance both directional bending stiffnesses at the same time. From the results optimal configuration and materials for high precesion machine tools are proposed.