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Novel microfluidic platform for modeling and evaluating osteoconduction of 3D printed scaffold
( Jinsub Han ),( Sangbae Park ),( Jae Eun Kim ),( Jae Woon Lim ),( Hyunmok Son ),( Kyoung-je Jang ),( Jong Hoon Chung ) 한국농업기계학회 2021 한국농업기계학회 학술발표논문집 Vol.26 No.1
Using scaffold in bone regenerative treatment for efficient osteoconduction to induce the bone healing is still challenging. Thus, the aim of the study was to develop scaffold-on-a-chip device that comprises a 3D environment and fluid shear stress. The chip is composed with space for scaffold in the center and a microfluidic channel which encircles the scaffold area. This structure can allow real time monitoring of cell adhesion, proliferation, differentiation and migration. The design of chip model focused on minimizing bubble and controlling of cell seeding area, both verified using computational fluid dynamics (CFD). Different channel coatings were compared to enhance cell adhesion on the chip and coating with 200 μg/ml of fibronectin was applied on the chip. MC3T3-E1 cells were cultured in the chip device for 7 days and investigated using immunocytochemical staining. Results demontrated that the cells were successfully cultured and differentiated in the chip. Fabricated scaffold-on-a-chip has a potential to help our understanding of scaffold-tissue interaction and provide an alternative to animal and clinical studies for scaffold development.
Jae Young Jang,Jiho Lee,Young Gun Park,Jinsub Kim,Jae Woong Shim,Min Cheol Ahn,Kyeon Hur,Tae Kuk Ko,Al-Ammar, A.,Babar, M. IEEE 2013 IEEE transactions on applied superconductivity Vol.23 No.3
<P>By the advent of the Smart Grid and integration of distributed generators, electrical networks are facing uncountable challenges. The existing protection schemes that simply limit the fault current to the predetermined set values may not perform optimally, and even the existing protection coordination schemes fail and lead to catastrophic failures in the increasingly complex and unpredictable grid operation. This paper proposes a novel and smart design of fault current controller constituting a full-bridge thyristor rectifier embedding a superconducting coil. When a fault occurs and the resulting current through the superconducting coil exceeds a certain preset value based on the current operating conditions of the grid to maintain the grid integrity, the magnitude of the fault current is regulated to a desired value by automatic controlling of the thyristor. This research also implements a lab-scale Smart FCC with smart current control capability and demonstrates the desired functionality and efficacy of design by changing the fault conditions. This proposed Smart FCC design will make the Smart Power Grid capable of self-healing against current faults.</P>
Jae Young Jang,Young Jin Hwang,SangGap Lee,Jinsub Kim,Sangjin Lee,Min Cheol Ahn Institute of Electrical and Electronics Engineers 2017 IEEE transactions on applied superconductivity Vol.27 No.4
<P>Because low-temperature superconducting (LTS) magnets can conduct large electric current and generate intense magnetic fields under cryogenic conditions, such magnets are used in many applications such as MRI, nuclear magnetic resonance spectrometers, and mass spectrometers. However, an abnormal termination called “quench” disturbs the normal operation and increases the magnet temperature. To protect the LTS magnet from excessive heat, the maximum temperature of a magnet under the quench process should be calculated. The design of a superconducting magnet protection system is performed according to the calculated maximum temperature. This is why accurate estimation of magnet temperature is important. The quench process of a superconducting magnet involves complex physical mechanisms, which requires a thermal-electrical simulation using computational analysis. We propose a highly efficient and reliable three-dimensional quench calculation method that can calculate the magnet temperature in the quench process. The LTS magnet is divided into many unit nodes; multiphysics analysis at each node is carried out with respect to the elapsed time. To verify the feasibility of the simulation, LTS magnet quench experimental results were compared with the simulation results. This study has the potential to develop a computational method for heat propagation analysis of a superconducting magnet.</P>
AlGaN-based deep ultraviolet light-emitting diodes on nanopatterned AlN/sapphire substrates
Donghyun LEE,Jong Won LEE,Jeonghwan JANG,In-Su SHIN,Lu JIN,Jungsub KIM,Jinsub LEE,Hye-Seok NOH,Yong-Il KIM,Youngsoo PARK,Gun-Do LEE,Yongjo PARK,Jong Kyu KIM,Euijoon YOON 한국진공학회 2016 한국진공학회 학술발표회초록집 Vol.2016 No.8
분광측색계, 색차계의 색 수치 값을 이용한 타이타늄 산화막의 두께 정량화
이다영(Dayoung Lee),한아영(Ayoung Han),하동흔(Dongheun Ha),유현석(Hyeonseok Yoo),김훈식(Hunsik Kim),정나겸(Nagyeom Jung),장관섭(Kwanseop Jang),최진섭(Jinsub Choi) 한국표면공학회 2018 한국표면공학회지 Vol.51 No.3
The anodic TiO₂ layers which are prepared in various anodization conditions exhibit their specific color depending on the thickness of TiO₂. In this study, the relationship between the color of TiO₂ layer, which is grown by PEO (Plasma electrolytic oxidation), and the thickness of the TiO₂ layer is investigated. To evaluate the color change of the TiO₂ layer, the value of color (dE<SUP>*</SUP>ab) is measured and calculated by spectrophotometer and chromameter. As a result, it is found that dE<SUP>*</SUP>ab values and thickness of TiO₂ layers form a linear relationship with meaningful formular. This formula can be helpful to quantify the thickness of the TiO₂ layer by the numerical dE<SUP>*</SUP>ab values. In this process, the spectrophotometer shows more precise results than the chromameter dose. If fluoride ions (F-) are included in the electrolyte, it will affect the dE<SUP>*</SUP>ab values of the TiO₂. layer. This is against the propensity, which is analyzed by XRD (X-ray diffraction) and XPS (X-ray photoelectron spectroscopy). It is important that the formular suggested in this study provides other metals which can be also anodized with the possibility of quantifying the thickness of the TiO₂ layer by the dE<SUP>*</SUP>ab values.