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Preparation and Properties of Modified Poly(amide-imide) with Oligo dimethylsiloxane
하성용 ( Seong Yong Ha ),오부근 ( Boo Keun Oh ),이영무 ( Young Moo Lee ) 한국공업화학회 1993 한국공업화학회 연구논문 초록집 Vol.1993 No.0
Poly(amide-imide)(PAI) is an important class of tractable polyimide. However, PAI is difficult to process by conventional means. The properties of PAI can easily be altered by incoporating siloxane blocks into PAI main chain. Therefore, many researchers have focused on the synthesis of siloxane PAI copolymer(SPAI). Table 1 shows the recipe of the polymerization. Trimellitic anhydride acid chloride dissolved in THF dropped slowly into the mixture of phenylene diamine(PDA) and silicone diamine(SDA) mixture in THF under nitrogen atmosphere with vigorous stirring. The reaction was carried out for 1 day under N<sub>2</sub> atmostphere. The resulting polymeric solution was precipitated with acetone and the product was filltered. The product was dissolved in NMP and reprecipitated in distilled water for further purification. The silicone modified polyamide acid was dried in an oven for an imidization at 100, 150, 200 and 250°C. SPAIs were easily dissolved in NMP, DMAc and DMF. Methanol and toluene was non-solvents. SPAI film was prepared from casting SPAI solution onto glass plate and drying in an oven. The analysis of the structure of SPAIs was conducted by using FT-IR. The characteristic peaks of imide appeared 1778 and 1720cm<sup>-1</sup>. The stretching vibrations of amide showed at ca, 1720, 1650 and 1545cm<sup>-1</sup>. The characteristic peaks of Si-CH<sub>3</sub> appeared at 1260 and 860cm<sup>-1</sup> and that of Si-O show at 1090cm<sup>-1</sup>. In our study, the thermal properties, X-ray diffraction and mechanical properties of SPAIs were also disscussed.
오대윤 ( Dae Youn Oh ),하성용 ( Seong Yong Ha ),이정무 ( Jeong Moo Lee ),김형준 ( Hyoung Juhn Kim ),남상용 ( Sang Yong Nam ) 한국공업화학회 2011 공업화학전망 Vol.14 No.3
최근 기체분리막에서 가장 크게 관심을 받고 있는 분야는 OBIGGS용 고투과 선택성 기체분리막이다. OBIGGS용 기체분리막 소재로 기존의 polysulfone 보다 내열성, 투과성, 선택성이 우수한 소재개발에 대한 연구가 이루어지고 있다. 내열성이 우수한 고분자 소재로는 PBI, PI, PBO, PBZ, PPy가 있으며 최근에는 미세 기공을 가지는 PIMs계 고분자 소재에 대한 연구가 활발히 진행되고 있다. OBIGGS용 기체분리막은 3개 미만의 업체에서 독점하고 있으며 프리미엄급 소재의 개발은 산업적, 경제적, 기술적인 측면에서 큰 파급효과를 일으키게 될 것으로 예상되며 따라서 국내의 기체분리막에 대한 연구가 활발히 이루어져야 할 것이다.