http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
구조 강성 및 내구도를 고려한 점용접 구조물의 성능 평가
주병현(Byeong-Hyeon Ju),이병채(Byung-Chai Lee),김동석(Dong-Seok Kim),강오성(Oh-Sung Kang) 한국자동차공학회 2005 한국자동차공학회 Symposium Vol.- No.-
Many modeling methods of representing a spot weld have developed to evaluate structural stiffuess and durability. One of the most famous methods is to use a CWELD element. The main advantages of the CWELD element are that it is able to connect a shell element to another shell element and calculate the structural stress using Rupp's method. In spite of these advantages the property of the CWELD element is influenced by many factors. But intensive research on it has been rarely done. In this research it is first found that which factors affect structural stiffness and durability. Finally, the guidelines for the affecting factors are provided.
크리깅 근사모델과 적분 차수 감소 방법을 이용한 모멘트 기반 신뢰도 해석의 성능 개선
주병현(Byeong-Hyeon Ju),조태민(Tae-Min Cho),이병채(Byung-Chai Lee) 대한기계학회 2006 대한기계학회 춘추학술대회 Vol.2006 No.6
To consider uncertainty in the design process, the design based on reliability has been introduced. Of the many methods of reliability analysis that have been studied, the moment method has the advantage of not needing the sensitivities of performance functions. However, calculating the statistical moments of the performance function requires many amounts of calculation, especially involving finite element analysis or having the performance function with many random variables. To solve these problems, new strategy with two steps is proposed. In the first step, the performance function is approximated by the kriging metamodel. However, if the performance function has many random variables, it is impossible to obtain the statistical moments because of the curse of dimensionality. For that reason, a dimension reduction method for integration is used in the second step. The examples show that the proposed strategy can calculate the statistical moments exactly and efficiently.
구조 강성 및 내구도를 고려한 점용접 구조물의 성능 평가
주병현(Byeong-Hyeon Ju),이병채(Byung-Chai Lee),김동석(Dong-Seok Kim),강오성(Oh-Sung Kang) 대한기계학회 2005 대한기계학회 춘추학술대회 Vol.2005 No.11
Many modeling methods of representing a spot weld have developed to evaluate structural stiffness and durability. One of the most famous methods is to use a CWELD element. The main advantages of the CWELD element are that it is able to connect a shell element to another shell element and calculate the structural stress using Rupp's method. In spite of these advantages the property of the CWELD element is influenced by many factors. But intensive research on it has been rarely done. In this research it is first found that which factors affect structural stiffness and durability. Finally, the guidelines for the affecting factors are provided
주병현(B. H. Joo),남기원(K. W. Nam),이병채(B. C. Lee ) 한국정밀공학회 2004 한국정밀공학회 학술발표대회 논문집 Vol.2004 No.10월
We evaluate the durability of vehicle chassis component under dynamic loadings. Since the fatigue analysis of vehicle component is based on the dynamic load history it must be done by dynamic analysis. But in case the vehicle component has natural frequencies much larger than reversing frequencies of load history, we can get small analysis errors by applying quasi-static analysis. So it is inefficient that we apply to the dynamic analysis for all the vehicle components. In this research, we discuss the quasi-static analysis method which is appropriate for the fatigue analysis. And in case we can only perform the fatigue analysis based on dynamic analysis, we introduce more efficient method in the analysis time and hard disk storage.
직접 접합된 실리콘 기판쌍에 있어서 계면 산화막의 상태와 이의 새로운 평가 방법
주병권,이윤희,정회현,정경수,차균현,오명현 대한전자공학회 1995 전자공학회논문지-A Vol.32 No.3
We discovered that each distinct shape of the roof-shaped peaks of (111) facets, which are generated on (110) cross-section of the directly bonded (100) silicon wafer pairs after KOH etching, can be mapped to one of three conditions of the interfacial oxide existing at the bonding interface as follows. That is, thick solid line can be mapped to stabilization, thin solid line to disintegration, and thin broken line to spheroidization. also we confirmed that most of the interfacial oxides of a well-aligned wafer pairs were disintegrated and spheroidized through high-temperature annealing process above 900$^{\circ}$C while the oxide was stabilized persistently when two wafers are bonded rotationally around their common axis perpendicular to the wafer planes.