유방암 치료에 대한 한의 임상 가이드라인 개발을 위한 기초연구

이강욱,유화승,이진선,이남헌,Lee, Kang-Wook,Yoo, Hwa-Seung,Lee, Jin-Sun,Lee, Nam-Hun 대한한방부인과학회 2016 大韓韓方婦人科學會誌 Vol.29 No.2

Objectives : The purpose of this study was to present the clinical practice guidelines for breast cancer through the analysis of existing clinical practice guidelines in Western and Chinese medicine. Methods : The literature search was performed regarding conventional and integrative medical treatment of breast cancer using Google Scholar, KIOM OASIS, PUBMED and Jisan library of Daejeon university. Results : Breast cancer is the fifth most common cancer in Korea. Recent studies revealed that combining conventional and integrative medical treatment can reduce the sequela of surgical operation and improve survival rate. However there isn’t still a systemic clinical guideline for breast cancer in korean medicine. This study will be a preliminary study to establish clinical practice guidelines of Korean Medicine for breast cancer.Conclusions : Further objective and systemic clinical studies related to Korean Medicine are needed to develope more advanced clinical practice guidelines of breast cancer.

김치유산균용 발현벡터 pSJE6c 개발과 이를 이용한 외래 유전자 발현

이강욱,박지영,이지연,이황아,백창운,조현덕,김주연,권건희,천지연,김정환,Lee, Kang-Wook,Park, Ji-Yeong,Lee, Ji-Yeon,Lee, Hwang-A,Baek, Chang-Un,Jo, Hyeon-Deok,Kim, Joo-Yeon,Kwon, Gun-Hee,Chun, Ji_Yeon,Kim, Jeong-Hwan 한국미생물·생명공학회 2009 한국미생물·생명공학회지 Vol.25 No.4

본 연구실에서 개발한, 김치에서 분리한 Leu. mesenteroides SY2 유래 pFMBL1 을 바탕으로 구축한 셔틀벡터인, pSJE[7]를 외래유전자 발현에 적합하게 개량한 발현벡터를 구축하였다. Lactococcus lactis LM0230에서 분리한 프로모터 P6C를 pSJE에 도입하였다. P6C 염기서열을 지닌 oligonucleotide 쌍을 따로 제조한 후 annealing을 통해 짧은 DNA 단편을 얻어서 제한효소 처리후 pSJE에 도입하여 pSJE6c를 구축하였다. PSJE6c 효능 검증을 위해서 외래 유전자인 aga와 lacZ를 각각 pSJE6c에 도입하였다. P6C 프로모터와 비교를 위해 고유 프로모터를 지닌 유전자들도 각각 pSJE에 도입하였다. 재조합 plasmid들을 electroporation 방법으로 Lactobacillus brevis 2.14 균주에 도입하고 재조합균주들의 생육곡선과 효소역가 그리고 slot blot으로 전사체 농도를 측정하였다. 결과를 보면 PSJE6c에 클로닝 된 유전자들이 pSJE상의 유전자보다 효소역가들이 약 1.5배에서 2배 정도로 높았다. 전사체 농도 측정 결과도 pSJE6c 들에서 더 많은 전사체가 생성됨을 보여주었다. 이상 결과들은 효율적인 발현벡터들의 사용을 통해서 김치유산균에서 외래유전자 발현 효율을 높일 수 있음을 보여준다. Development of expression vectors is important for the basic and applied researches on kimchi LAB (lactic acid bacteria). An expression vector, pSJE6c was constructed by inserting P6C promoter sequence from Lactococcus lactis into pSJE, a shuttle vector for E. coli and Leuconostoc species. To test the efficiency of pSJE6c, aga ($\alpha$-galactosidase) and lacZ ($\beta$-galactosidase) genes were expressed in Lactobacillus brevis 2.14. Compared to the pSJE, expression levels of both genes were increased, indicating P6C promoter was better than indigenous promoters. Enzyme activities of L. brevis cells harboring pSJE6caga (pSJE6c with aga) or pSJE6Z (pSJE6c with lacZ) were 1.5-2 fold higher than those with pSJEaga (pSJE with aga) or pSJEZ (pSJE with lacZ). More RNA transcripts were detected in cells harboring pSJE6c based recombinant plasmid. The results indicated that heterologous gene expressions in kimchi LAB could be improved significantly by use of efficient expression vectors.

두부외상후 만성 기질성 정신장애 환자에서 Tc-99m HMPAO Brain SPECT 분석

이강욱,이종진,송민호,강민희,지익성,신영태,노흥규 ( Kang Wook Lee,Jong Jin Lee,Min Ho Shong,Min Hee Kang,Ick Sung Ghi,Young Tai Shin,Heung Kyu Ro ) 대한핵의학회 1994 핵의학 분자영상 Vol.28 No.3

It is well known that Tc-99m HMPAO brain SPECT can reflect the functional lesions better than X-ray computerized tomography(CT) and magnetic resonance imaging(MRI) in the cerebral disorders. In order to evaluate the clinical utilities of Tc-99m HMPAO brain SPECT in patients with post-traumatic chronic organic mental disorder(OMD). We included 28 patients diagnosed as OMD in department of psychiatry after traumatic head injury. And we compared the results of Tc-99m HMPAO SPECT with those of MRI, EEG and MINI mental status examination(MMSE). The results were as follows 1) All patients diagnosed as OMD showed diffuse or focal decreased cerebral perfusion on Tc-99m HMPAO SPECT. 2) Most frequent lession on brain Tc-99m HMPAO SPECT was decreased perfusion on both frontal lobe. And most frequent lesion on brain Tc-99m HMPAO SPECT was decreased perfusion on both frontal lobe. And most frequent lesion on brain Tc-99m HMPAO SPECT showing normal brain MRI result was also decreased both frontal perfusion. 3) Eight of 28 patients showed focal brain MRI lesions(4 small frontal hygroma, 3small cerebral infarction and 1 cerebellar encephalomalacia) which were not detected in brain Tc-99m HMPAO SPECT. 4) The patients showing less than 20 points on MMSE disclosed abnormal results of EEG more frequently than those disclosing more than 20points. In conclusion, we think that Tc-99m HMPAO brain SPECT is sensitive method to detect functional lesions of the brains in patients with chronic post-traumatic organic mental disoder.

임신한우의 혈액에 관한 연구 2 . 임신한우의 혈액학치에 관한 연구

이강욱,강희탁 ( Kang Wook Lee,Hi Tak Kang ) 한국축산학회 1976 한국축산학회지 Vol.18 No.5

한인진(韓茵蔯), 울금(鬱金), 산사(山査), 단삼(丹蔘) 발효복합추출물이 RAW264.7 및 HUVEC 세포에서 나타나는 이상지질혈증 관련 염증인자 발현 및 항산화에 미치는 영향

이강욱,조현경,유호룡,설인찬,김윤식,Lee, Kang-wook,Cho, Hyun-kyoung,Yoo, Ho-ryong,Seol, In-chan,Kim, Yoon-sik 대한한방내과학회 2018 大韓韓方內科學會誌 Vol.39 No.4

Objectives: To investigate the effect of fermented extract of Artemisiae Iwayomogii Herba, Curcumae Longae, Crataegi Fructus and Salviae Miltiorrhizae Radix (FMH) on anti-inflammation associated with dyslipidemia and anti-oxidation in RAW264.7 and HUVEC cells. Methods: The total polyphenols, total flavonoids, DPPH radical scavenging activity, ABTS radical scavenging activity, and cytotoxicity of FMH were measured. RAW264.7 cells treated with FMH were tested for production of NO, and for cytokine and LTB4 levels and HUVEC cells treated with FMH were examined for production of cDNA of genes related to inflammation. Results: 1. FMH contained polyphenols and flavonoids. The DPPH and ABTS radical scavenging activity of FMH increased in a concentration-dependent manner. 2. FMH treatment inhibited the production of nitric oxide (NO), cytokines, and LTB4 in RAW264.7 cell when compared to the untreated control group. 3. FMH decreased the transcription of pro-inflammatory genes, whereas it increased transcription of anti-inflammatory genes, in HUVEC cells. Conclusion: FMH is effective as an antioxidant and for treatment and prevention of dyslipidemia, atherosclerosis, ischemic heart disease, stroke, and other cardiocerebrovascular diseases.

완전삽입형 인공망막 구현을 위한 인공망막모듈 개발

이강욱,카이호 요시유키,후쿠시마 타카후미,타나까 테츠,고야나기 미쯔마사,Lee, Kang-Wook,Kaiho, Yoshiyuki,Fukushima, Takafumi,Tanaka, Tetsu,Koyanagi, Mitsumasa 대한의용생체공학회 2010 의공학회지 Vol.31 No.4

To restore visual sensation of blind patients, we have proposed a fully implantable retinal prosthesis comprising an three dimensionally (3D) stacked retinal chip for transforming optical signal to electrical signal, a flexible cable with stimulus electrode array for stimulating retina cells, and coupling coils for power transmission. The 3D stacked retinal chip is consisted of several LSI chips such as photodetector, signal processing circuit, and stimulus current generator. They are vertically stacked and electrically connected using 3D integration technology. Our retinal prosthesis has a small size and lightweight with high resolution, therefore it could increase the patients` quality of life (QOL). For realizing the fully implantable retinal prosthesis, we developed a retinal prosthesis module comprising a retinal prosthesis chip and a flexible cable with stimulus electrode array for generating optimal stimulus current. In this study, we used a 2D retinal chip as a prototype retinal prosthesis chip. We fabricated the polymide-based flexible cable of $20{\mu}m$ thickness where 16 channels Pt stimulus electrode array was formed in the cable. Pt electrode has an impedance of $9.9k{\Omega}$ at 400Hz frequency. The retinal prosthesis chip was mounted on the flexible cable by an epoxy and electrically connected by Au wire. The retinal prosthesis chip was cappted by a silicone to pretect from corrosive environments in an eyeball. Then, the fabricated retinal prosthesis module was implanted into an eyeball of a rabbit. We successfully recorded electrically evoked potential (EEP) elicited from the rabbit brain by the current stimulation supplied from the implanted retinal prosthesis module. EEP amplitude was increased linearly with illumination intensity and irradiation time of incident light. The retinal prosthesis chip was well functioned after implanting into the eyeball of the rabbit.

삼차원적층형 집적회로 구현을 위한 자기조직화정합기술을 이용한 고속.고정밀 접합기술

이강욱,Lee, Kang-Wook 대한용접접합학회 2011 대한용접·접합학회지 Vol.29 No.3

본 논문에서는 액체의 표면장력을 이용하여 복수의 KGD 들을 웨이퍼 상태에서 일괄접합함으로써, 높은 수율의 삼차원적층칩을 빠른 생산성으로 제작할 수 있는, 고속 고정밀 접합기술인 자기조직화정합 (Selfassembly) 기술에 대해 소개를 하였다. 본 연구실에서 개발한 self-assembly 기술을 적용하여 5mm 각(角) 크기의 칩 500개를 1초 이내에 평균 $0.5{\mu}m$ 정도의 높은 정밀도로 8인치 웨이퍼상에 일괄접합시키는데 성공하였다. Self-assembly 기술에 의한 삼차원 칩 적층방식은, 기존의 pick-and-place 적층방식에서 높은 정밀도의 접합특성을 확보하는데 필요한 공정시간을 혁신적으로 단축하는 것이 가능하고, 웨이퍼 레벨에서 복수의 KGD 들을 일괄접합하는 것이 가능하므로, 향후 TSV 기술의 양산화를 실현하는데 적합한 고속 고정밀 접합 기술로서 기대가 크다. 현재 본 연구실에서는 두께가 $50{\mu}m$ 이하의 얇은 LSI 칩 및 메탈범프가 형성된 LSI 칩 등을 이용하여, self-assembly 기술에 의한 삼차원 적층형 집적회로 구현을 위한 접합기술을 개발 중에 있다.

3-D Hetero-Integration Technologies for Multifunctional Convergence Systems

이강욱,Lee, Kang-Wook The Korean Microelectronics and Packaging Society 2015 마이크로전자 및 패키징학회지 Vol.22 No.2

Since CMOS device scaling has stalled, three-dimensional (3-D) integration allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. 3-D integration has many benefits such as increased multi-functionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, because it vertically stacks multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip. Anticipated applications start with memory, handheld devices, and high-performance computers and especially extend to multifunctional convengence systems such as cloud networking for internet of things, exascale computing for big data server, electrical vehicle system for future automotive, radioactivity safety system, energy harvesting system and, wireless implantable medical system by flexible heterogeneous integrations involving CMOS, MEMS, sensors and photonic circuits. However, heterogeneous integration of different functional devices has many technical challenges owing to various types of size, thickness, and substrate of different functional devices, because they were fabricated by different technologies. This paper describes new 3-D heterogeneous integration technologies of chip self-assembling stacking and 3-D heterogeneous opto-electronics integration, backside TSV fabrication developed by Tohoku University for multifunctional convergence systems. The paper introduce a high speed sensing, highly parallel processing image sensor system comprising a 3-D stacked image sensor with extremely fast signal sensing and processing speed and a 3-D stacked microprocessor with a self-test and self-repair function for autonomous driving assist fabricated by 3-D heterogeneous integration technologies.

국내 토목산업의 설계-시공 균형발전 방안 도출에 관한 연구

이강욱,한승헌,박형근,진경호,Lee, Kang Wook,Han, Seung Heon,Park, Hyung Keun,Chin, Kyung Ho 대한토목학회 2013 대한토목학회논문집 Vol.33 No.1

최근 해외건설시장에서는 산업설비 분야를 중심으로 기획, 설계, 구매조달, 시공을 통합하는 EPC(Engineering, Procurement, & Construction) 형태의 발주물량이 증가하고 있으며, 토목산업 분야에서도 점차 Design-Build 발주사례가 증가하고 있다. 이러한 발주환경의 변화에 따라 프로젝트종합관리, 기본설계 등 건설엔지니어링의 중요성이 대두되고 있으나, 아직까지 국내 건설산업은 시공 위주의 산업구조에서 벗어나지 못하고 있다. 따라서 본 연구는 국내 토목산업의 엔지니어링 역량을 제고하고, 장기적으로는 설계-시공 균형발전을 위한 산업 차원의 발전방안을 제시하는데 목적을 두고 진행되었다. 이를 위해 우선 국내외 건설산업 현황을 분석하였으며, 국내 건설업체들의 인식수준 및 니즈 파악을 위한 설문조사와 발전방안의 실효성 검토를 위한 전문가 심층면담을 순차적으로 진행하였다. 본 연구에서 도출한 국내 토목산업의 설계-시공 균형발전 방안은 1) 토목설계업 관리체계 효율화, 2) 토목설계업 관련 제도 선진화, 3) 고부가가치 우수인력 육성, 4) 엔지니어링조합 및 컨소시엄 구성, 5) 해외건설 협력기구 조직 및 운영으로 구분하여 제시되었다. In the recent global construction environment, EPC contracts that integrate planning, design, procurement, and construction have been widely used for industrial facilities. Similarly, as the importance of the engineering capability such as project management consulting(PMC) and front end engineering design(FEED) has been increased, design-build contracts also have been gradually adopted for infrastructure projects. Whereas, the Korean infrastructure industry has fragmentary features which mainly emphasize on the construction sector. Therefore, this study aims at developing strategies for enhancing the engineering capability and for balancing the competitiveness between engineering and construction sectors in the Korean infrastructure industry. To this end, the authors first carried out market analysis for both global and domestic market. Then, a structured survey and expert in-depth interviews were sequentially performed in order to reflect practitioners' perspectives and needs for institutional strategies. As a result, five strategies drawn from this study are as follows: 1) rearranging the government's roles for supporting the engineering sector; 2) establishing institutional bases being compatible with global standards; 3) fostering value-added workforce for undertaking complex tasks; 4) constructing an consortium between an engineering association and general contractors; and 5) building a nationwide collaborative networks for overseas market expansion.

슈퍼 칩 구현을 위한 헤테로집적화 기술

이강욱,Lee, Kang-Wook 한국마이크로전자및패키징학회 2010 마이크로전자 및 패키징학회지 Vol.17 No.4

삼차원 집적화기술의 현황과 과제 및 향후에 요구되어질 새로운 삼차원 집적화기술의 필요성에 대해 논의를 하였다. Super-chip 기술이라 불리우는 자기조직화 웨이퍼집적화 기술 및 삼차원 헤테로집적화 기술에 대해 소개를 하였다. 액체의 표면장력을 이용하여지지 기반위에 다수의 KGD를 일괄 실장하는 새로운 집적화 기술을 적용하여, KGD만으로 구성된 자기조직화 웨이퍼를 다층으로 적층함으로써 크기가 다른 칩들을 적층하는 것에 성공을 하였다. 또한 삼차원 헤테로집적화 기술을 이용하여 CMOS LSI, MEMS 센서들의 전기소자들과 PD, VC-SEL등의 광학소자 및 micro-fluidic 등의 이종소자들을 삼차원으로 집적하여 시스템화하는데 성공하였다. 이러한 기술은 향후 TSV의 실용화 및 궁극의 3-D IC인 super-chip을 구현하는데 필요한 핵심기술이다. Three-dimensional (3-D) integration is an emerging technology, which vertically stacks and interconnects multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip to form highly integrated micro-nano systems. Since CMOS device scaling has stalled, 3D integration technology allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. The potential benefits of 3D integration can vary depending on approach; increased multifunctionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, increased yield and reliability, flexible heterogeneous integration, and reduced overall costs. It is expected that the semiconductor industry's paradiam will be shift to a new industry-fusing technology era that will offer tremendous global opportunities for expanded use of 3D based technologies in highly integrated systems. Anticipated applications start with memory, handheld devices, and high-performance computers and extend to high-density multifunctional heterogeneous integration of IT-NT-BT systems. This paper attempts to introduce new 3D integration technologies of the chip self-assembling stacking and 3D heterogeneous opto-electronics integration for realizng the super-chip.