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석종원,한미경,배건성,Seok, Jong-Won,Han, Mi-Kyung,Bae, Keun-Sung 대한전자공학회 1999 電子工學會論文誌, S Vol.s36 No.7
This paper presents a speech enhancement method with spectral subtraction using wavelet, wavelet packet and cosine packet transforms which are known as multiresolutional signal analysis method. The performance of each method is compared with the conventional spectral subtraction method. Performance assessments based on average SNR, cepstral distance and informal subjective listening test are carried out. Experimental result demonstrate that cosine packet shows the best result in objective performance measure as well as subjective shows less musical noise than the conventional spectral subtraction method after removing the noise components. 본 논문에서는 최근에 널리 연구되고 잇는 다해상도 신호해석 방법인 웨이브렛 변환, 웨이브렛 패킷, 그리고 코사인 패킷 알고리듬을 잡음음성의 음질개선에 이용하여 각각의 성능을 비교하였으며, 또한 이를 기존의 스펙트럼 차감법의 성능과 비교 분석하였다. 성능비교의 척도로는 SNR과 켑스트럼 거리를 이용하였다. 실험결과 SNR면에서는 코사인 패킷이 가장 좋은 결과를 보였고 켑스트럼 거리의 경우 코사인 패킷과 웨이브렛 패킷이 훨씬 나은 결과를 보였다. 주관적인 청취결과 역시 코사인 패킷이 가장 좋은 결과를 보였으며, 기존의 스펙트럼 차감법은 musical noise의 영향으로 인해 상대적으로 다른 방식에 비해 합성음의 음질이 많이 떨어짐을 확인할 수 있었다.
석종원,김태환,배건성,Seok, Jong-Won,Kim, Tae-Hwan,Bae, Keun-Sung 한국정보통신학회 2012 한국정보통신학회논문지 Vol.16 No.9
일반적으로 수중표적 인식에서는 표적의 형상/재질에 따른 수신 표적신호의 공간적인 정보를 특징인자로 추출하여 식별하고자 하는 특징을 추출하였다. 또한, 표적신호의 수신 위치에 덜 민감한 특징파라미터 추출을 위해 다양한 신호처리 기법을 적용하는 연구가 수행되어 왔다. 본 논문에서는 표적신호의 수신위치에 상대적으로 민감하지 않은 정준상관분석(Canonical correlation Analysis; CCA)을 사용하여 합성된 수중물체의 특징을 분석하였다. 다중각도 환경에서 특징추출을 위해 정준산관분석기법이 적용되었으며, 각각 다른 각도에서 수중물체에 반사되어 되돌아오는 연속적인 두개의 소나신호를 대상으로 정준상관분석을 수행하여 두 신호의 상관성을 분석하였다. Generally, in the underwater target recognition, feature vectors are extracted from the target signal utilizing spatial information according to target shape/material characteristics. And, various signal processing techniques have been studied to extract feature vectors which is less sensitive to the location of the receiver. In this paper, we analyzed the characteristics of synthesized underwater objects using canonical correlation analysis method which is relatively less sensitive to the location of receiver. Canonical correlation analysis is applied to two consecutive backscattered sonar returns at different aspect angles to analyze the correlation characteristics in multi-aspect environment.
외부챔버와 유연한 튜브로 연결된 LCD 패널 검사기 방진용 공기 스프링의 열 및 동적 연성거동에 대한 연구: PART II, 실험적 검증 및 고찰
석종원,이주홍,김필기,Seok, Jong-Won,Lee, Ju-Hong,Kim, Pil-Kee 한국반도체디스플레이기술학회 2011 반도체디스플레이기술학회지 Vol.10 No.1
In this study, the dynamic characteristics of an air spring connected with an external chamber through a flexible tube are examined. The uncoupled dynamic parameters of the air spring are identified through experiments, followed by the suggestion of a model-based approach to obtain the remaining coupled dynamic parameters using the various frequency response functions derived in PART I paper [1]. To improve or control the damping characteristics of the air spring, this vibration isolation air spring system is physically established in laboratory scale. And we attempt to identify various parameters used to describe to air spring system by both theoretically [1] and experimentally, which is performed in this report. The damping parameter of the tube system is identified through experiments on the system incorporated with the air cylinder, and a nonlinear regression procedure is employed to find solutions. The resulting value is used to expect the frequency response function of dynamic pressure in the top chamber (air spring) with respect to that in the bottom chamber (external chamber). Comparison with the experimental data supports the validity of the present estimation procedures. Also, the dynamic mechanism of the damping effects particularly in a low frequency range is investigated through this experimental endeavor.
극저온 $CO_2$ 세정공정을 위한 거친표면 위 미세입자의 점착특성 연구
석종원,이성훈,김필기,Seok, Jong-Won,Lee, Seong-Hoon,Kim, Pil-Kee 한국반도체디스플레이기술학회 2010 반도체디스플레이기술학회지 Vol.9 No.1
Among a variety of cleaning processes, the cryogenic carbon dioxide ($CO_2$) cleaning has merits because it is highly efficient in removing very fine particles, innoxious to humans and does not produce residuals after the cleaning, which enables us to extend its area of coverage in the semi-conductor fabrication society. However, the cryogenic carbon dioxide cleaning method has some technical research issues in aspect to particles' adhesion and removal. To resolve these issues, performing an analysis for the identification of particle adhesion mechanism is needed. In this study, a research was performed by a theoretical approach. To this end, we extended the G-T (Greenwood-Tripp) model by applying the JKR (Johnson-Kendall-Roberts) and Lennard-Jones potential theories and the statistical characteristics of rough surface to investigate and identify the contact, adhesion and deformation mechanisms of soft or hard particles on the rough substrate. The statistical characteristics of the rough surface were taken into account through the employment of the normal probability distribution function of the asperity peaks on the substrate surface. The effects of surface roughness on the pull-off force for these particles were examined and discussed.
화학-기계적 연마 공정의 물질제거 메커니즘 해석 Part I: 연성 통합 모델링
석종원,오승희,석종혁,Seok, Jong-Won,Oh, Seung-Hee,Seok, Jong-Hyuk 한국반도체디스플레이기술학회 2007 반도체디스플레이기술학회지 Vol.6 No.2
An integrated material removal model considering thermal, chemical and contact mechanical effects in CMP process is proposed. These effects are highly coupled together in the current modeling effort. The contact mechanics is employed in the model incorporated with the heat transfer and chemical reaction mechanisms. The mechanical abrasion actions happening due to the mechanical contacts between the wafer and abrasive particles in the slurry and between the wafer and pad asperities cause friction and consequently generate heats, which mainly acts as the heat source accelerating chemical reaction(s) between the wafer and slurry chemical(s). The proposed model may be a help in understanding multi-physical interactions in CMP process occurring among the wafer, pad and various consumables such as slurry.
극저온 $CO_2$ 세정과정 시 미세오염물의 탈착 메커니즘 연구
석종원,이성훈,김필기,이주홍,Seok, Jong-Won,Lee, Seong-Hoon,Kim, Pil-Kee,Lee, Ju-Hong 한국반도체디스플레이기술학회 2008 반도체디스플레이기술학회지 Vol.7 No.4
Rapid increase of integrity for recent semiconductor industry highly demands the development of removal technology of contaminated particles in the scale of a few microns or even smaller. It is known that the surface cleaning technology using $CO_2$ snow has its own merits of high efficiency. However, the detailed removal mechanism of particles using this technology is not yet fully understood due to the lack of sophisticated research endeavors. The detachment mechanism of particles from the substrates is known to be belonged in four types; rebounding, sliding, rolling and lifting. In this study, a modeling effort is performed to explain the detachment mechanism of a contaminant particle due to the rebounding caused by the vertical collision of the $CO_2$ snow. The Hertz and Johnson-Kendall-Roberts(JKR) theories are employed to describe the contact, adhesion and deformation mechanisms of the particles on a substrate. Numerical simulations are followed for several representative cases, which provide the perspective views on the dynamic characteristics of the particles as functions of the material properties and the initial inter-particle collision velocity.
화학-기계적 연마 공정의 물질제거 메커니즘 해석 Part II: 동적 시뮬레이션
석종원,오승희,Seok, Jong-Won,Oh, Seung-Hee 한국반도체디스플레이기술학회 2007 반도체디스플레이기술학회지 Vol.6 No.3
The integrated thermal-chemical-mechanical (TCM) material removal model presented in the companion paper is dynamically simulated in this work. The model is applied to a Cu CMP process for the simulation and the results of the three individual ingredients composing the model are presented separately first. These results are then incorporated to calculate the total material removal rate (MRR) of the Cu CMP. It is shown that the non-linear trend of MRR with respect to the applied mechanical power (i.e., non-Prestonian behavior), which is not well explained with the models established in principle on conventional contact mechanics, may be due to the chemical reaction(s) varying non-linearly with the temperature in the wafer.