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정전기보호를 위한 이중극성 소스를 갖는 EDNMOS소자의 특성
서용진(Yong-Jin Seo),김길호(Kil-Ho Kim),박성우(Sung-Woo Park),이성일(Sung-Il Lee),한상준(Sang-Jun Han),한성민(Sung-Min Han),이영균(Young-Keun Lee),이우선(Woo-Sun Lee) 대한전기학회 2006 대한전기학회 학술대회 논문집 Vol.2006 No.10
High current behaviors of extended drain n-typc metal-oxide-semiconductor field effects transistor (EDNMOS) with double polarity source (DPS) for electrostatic discharge (ESD) protection are analyzed. Simulation based contour analyses reveal that combination of bipolar junction transistor operation and deep electron channeling induced by high electron injection gives rise to the second on-state. Therefore, the deep electron channel formation needs to be prevented in order to realize stable and robust ESD protection performance. Based on our analyses, general methodology to avoid the double snapback and to realize stable ESD protection is to be discussed.
혼합 산화제를 사용한 텅스텐 막의 전기화학적 부식 및 CMP 특성
나은영,서용진,이우선,Na, Eun-Young,Seo, Yong-Jin,Lee, Woo-Sun 한국전기전자재료학회 2005 전기전자재료학회논문지 Vol.18 No.4
In this paper, the effects of oxidants on tungsten chemical mechanical polishing (CMP) process were investigated using three different oxidizers such as Fe(NO₃)₃, KIO₃ and H₂O₂. Moreover, the interaction between the tungsten film and the oxidizer was discussed by potentiodynamic polarization measurement with three different oxidizers, in order to compare the effects of W-CMP and electrochemical characteristics on the tungsten film as a function of oxidizer. As an experimental result, the tungsten removal rate reached a maximum at 5 wt% Fe(NO₃)₃concentration, and when 5 wt% H₂O₂was added in the slurry, the removal rate of W increased. Also, the microstructures of surface layer by atomic force microscopy(AFM) image were greatly influenced by the slurry chemical composition of oxidizers. It was shown that the surface roughness and removal rate of the polished surface were improved in Fe(NO₃)₃than KIO₃. The electrochemical results indicate that the corrosion current density of the 5 wt% H₂O₂ and 5 wt% H₂O/sub 2+/+ 5 wt% Fe(NO₃)₃was higher than the other oxidizers. Therefore, we conclude that the W-CMP characteristics are strongly dependent on the kinds of oxidizers and the amounts of oxidizer additive.
MAS (Mixed Abrasive Slurry)가 Metal CMP에 미치는 영향
이영균(Young-Kyun Lee),박성우(Sung-Woo Park),이우선(Woo-Sun Lee),서용진(Yong-Jin Seo) 대한전기학회 2006 대한전기학회 학술대회 논문집 Vol.2006 No.10
Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, so as to investigate the influence of mixed abrasive slurry (MAS), such as ZrO₂, CeO₂, and MnO₂ for Ti-CMP application.
H<sub>2</sub>O<sub>2</sub> 산화제가 W/Ti 박막의 전기화학적 분극특성 및 CMP 성능에 미치는 영향
나은영,서용진,이우선,Na, Eun-Young,Seo, Yong-Jin,Lee, Woo-Sun 한국전기전자재료학회 2005 전기전자재료학회논문지 Vol.18 No.6
CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. Also CMP process got into key process for global planarization in the chip manufacturing process. In this study, potentiodynamic polarization was carried out to investigate the influences of $H_2O_2$ concentration and metal oxide formation through the passivation on tungsten and titanium. Fortunately, the electrochemical behaviors of tungsten and titanium are similar, an one may expect. As an experimental result, electrochemical corrosion of the $5\;vol\%\;H_2O_2$ concentration of tungsten and titanium films was higher than the other concentrations. According to the analysis, the oxidation state and microstructure of surface layer were strongly influenced by different oxidizer concentration. Moreover, the oxidation kinetics and resulting chemical state of oxide layer played critical roles in determining the overall CMP performance. Therefore, we conclude that the CMP characteristics tungsten and titanium metal layer including surface roughness were strongly dependent on the amounts of hydrogen peroxide oxidizer.
국가기상위성센터 영상처리 시스템 구축을 위한 국내외 기상위성 영상처리 시스템 아키텍처 분석
국승학 ( Seung Hak Kuk ),서용진 ( Yong Jin Seo ),김현수 ( Hyeon Soo Kim ),사공영보 ( Young Bo Sakong ),이봉주 ( Bong Ju Lee ),장재동 ( Jae Dong Jang ),오현종 ( Hyun Jong Oh ) 대한원격탐사학회 2012 大韓遠隔探査學會誌 Vol.28 No.1
본 논문에서는 기존에 구축되어있는 위성영상처리 시스템의 구축현황을 살펴보고, 향후 국내 기상위성 영상처리 시스템 구축에서 고려해야 할 사항에 대해 살펴본다. 기존의 위성영상처리 시스템은 운영중인 개별 위성에 대한 영상의 수집, 처리, 배포 기능을 구현한 시스템이 대부분이었다. 그러나 향후 지구환경 감시를 위한 다양한 위성들의 개발에 따른 새로운 시스템의 통합, 기존 시스템에 대한 유지보수에 대한 문제점이 지적되고 있다. 미국의 NOAA, NWS, 유럽의 ESA등에서는 이러한 문제점을 해결하기 위해 기존의 시스템에 대한 개선 사업을 진행 중에 있다. 이에 본 논문에서는 현재 국내외에서 개발되는 위성영상처리 시스템의 구축 현황을 살펴보고, 개발 이슈 및 개발 전략에 대해 살펴보고자 한다. In this paper, we have surveyed the existing architectures of the image processing systems for several meteorological satellites and identified issues which are taken into consideration to construct the advanced meteorological satellite image processing system that is being developed by NMSC (National Meteorological Satellite Center). Most of the existing systems provide the functionalities of the image acquisition, the image processing, the data management, and the data dissemination. Those systems have some common problems with respect to system integration and system maintenance. To solve these problems, NOAA, NWS and ESA suggest new system architectures to improve the existing systems. This paper introduces domestic and foreign approaches to build the satellite image processing systems and studies some issues and strategies for developing those systems.
국승학 ( Seung Hak Kuk ),최창민 ( Chang Min Choi ),서용진 ( Yong Jin Seo ),김현수 ( Hyeon Soo Kim ),사공영보 ( Young Bo Sakong ),이봉주 ( Bong Ju Lee ),장재동 ( Jae Dong Jang ),오현종 ( Hyun Jong Oh ) 대한원격탐사학회 2012 大韓遠隔探査學會誌 Vol.28 No.1
본 논문에서는 국가기상위성센터에서 진행 중인``한국형 기상·환경 위성영상처리 기본체계``구축을 위한 위성영상처리 시스템 아키텍처를 제안한다. 위성영상처리 기본 체계는 위성영상의 수신, 처리, 저장, 배포의 기본적인 기능을 갖는다. 그런데 기존 시스템은 향후 개발될 다양한 위성 및 처리 시스템을 수용하기에는 시스템 통합과 유지보수 측면에서 문제점이 있었다. 현재 운영 중인 시스템의 문제점을 해결하고, 향후 개발될 다양한 위성 및 처리 시스템을 수용할 수 있도록 시스템 아키텍처는 설계되어야 한다. 이를 위해 본 논문에서는 위성영상 처리 기본 체계의 주요 아키텍처 드라이버를 변경가능성, 상호운영성, 확장성, 재사용성, 플랫폼 독립성으로 도출하고 각 아키텍처 드라이버를 달성할 수 있도록 시스템 아키텍처를 설계하였다. 이를 통해 기존 시스템이 갖고 있는 통합 시스템 관리, 시스템 간 의존성 문제, 데이터 관리의 문제를 해결할 수 있을 것이다. 또한 향후 시스템에 대한 유지보수와 새로운 시스템의 도입 시에도 쉽게 변경하고 통합할 수 있을 것으로 기대된다. This paper suggests a system architecture for the advanced meteorological satellite image processing system that is developing by NMSC (National Meteorological Satellite Center). The meteorology satellite image processing system has basically the image acquisition, the image processing, the data management, and the data dissemination functionalities. However, the existing system has some problems with respect to system integration as well as maintenance to accommodate new satellites and/or the new image processing systems for them which will be developed in the near future, To cope with these problems we propose a new system architecture for the advanced meteorology satellite image processing system, To do this we select as the architectural drivers the quality attributes such as modifiability, inter-operability, extendability, reusability, and platform independency and design the architecture to achieve such quality attributes. We expect that the new approach will solve current issues such as system integration, system dependency, or data management problems and will provide easy ways to incorporate new systems and to maintain them.
CMP 공정을 적용한 유기발광소자의 전압 · 전류 특성
최권우(Gwon-Woo Choi),이우선(Woo-Sun Lee),전영길(Young-Kil Jun),정판검(Pan-Gum Jueng),서용진(Yong-Jin Seo) 대한전기학회 2006 대한전기학회 학술대회 논문집 Vol.2006 No.7
Indium tin oxide (ITO) thin film is a transparent electrode, which is widely applied to solar battery, illuminators, optical switches, liquid crystal displays (LCDs), plasma display panels (PDPs), and organic light emitting displays (OLEDs) due to its easy formation on glass substrates, good optical transmittance, and good conductivity. ITO thin film is generally fabricated by various methods such as spray, CVD, evaporation, electron gun deposition, direct current electroplating, high frequency sputtering, and reactive DC sputtering. However, some problems such as peaks, bumps, large particles, and pin-holes on the surface of ITO thin film were reported, which caused the destruction of color quality, the reduction of device life time, and short-circuit. Chemical mechanical polishing (CMP) processis one of the suitable solutions which could solve the problems