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미세 표면 구조물을 갖는 패드의 제작 및 STI CMP 특성 연구
정석훈,정재우,박기현,서현덕,박재홍,박범영,주석배,최재영,정해도,Jeong, Suk-Hoon,Jung, Jae-Woo,Park, Ki-Hyun,Seo, Heon-Deok,Park, Jae-Hong,Park, Boum-Young,Joo, Suk-Bae,Choi, Jae-Young,Jeong, Hae-Do 한국전기전자재료학회 2008 전기전자재료학회논문지 Vol.21 No.3
Chemical mechanical polishing (CMP) allows the planarization of wafers with two or more materials. There are many elements such as slurry, polishing pad, process parameters and conditioning in CMP process. Especially, polishing pad is considered as one of the most important consumables because this affects its performances such as WIWNU(within wafer non-uniformity) and MRR(material removal rate). In polishing pad, grooves and pores on its surface affect distribution of slurry, flow and profile of MRR on wafer. A subject of this investigation is to apply CMP for planarization of shallow trench isolation structure using microstructure(MS) pad. MS pad is designed to have uniform structure on its surface and manufactured by micro-molding technology. And then STI CMP performances such as pattern selectivity, erosion and comer rounding are evaluated.
Development of Multiple CMP Monitoring System for Consumable Designs
Park, Sun-Joon,Park, Boum-Young,Kim, Sung-Ryul,Jeong, Hae-Do,Kim, Hyoung-Jae The Korean Institute of Electrical and Electronic 2007 Transactions on Electrical and Electronic Material Vol.8 No.1
Consumables used in Chemical Mechanical Polishing (CMP) have been played important role to improve quality and productivity. Since the properties of consumables constantly change with various reasons, such as shelf time, manufactured time, lot to lot variation from supplier and so on, CMP results are not constant during the process. Also, CMP process results are affected by multiple sources from wafer, conditioner, pad and slurry. Therefore, multiple sensing systems are required to monitor CMP process variation. In this paper, the authors focus on development of monitoring system for CMP process which consist of force, temperature and displacement sensor to measure the signal from CMP process. With monitoring systems mentioned above, complex CMP phenomena can be investigated more clearly.
Consumable Approaches of Polysilicon MEMS CMP
Park, Sung-Min,Jeong, Suk-Hoon,Jeong, Moon-Ki,Park, Boum-Young,Jeong, Hae-Do,Kim, Hyoung-Jae The Korean Institute of Electrical and Electronic 2006 Transactions on Electrical and Electronic Material Vol.7 No.4
Chemical-mechanical polishing (CMP), one of the dominant technology for ULSI planarization, is used to flatten the micro electro-mechanical systems (MEMS) structures. The objective of this paper is to achieve good planarization of the deposited film and to improve deposition efficiency of subsequent layer structures by using surface-micromachining process in MEMS technology. Planarization characteristic of poly-Si film deposited on thin oxide layer with MEMS structures is evaluated with different slurries. Patterns used for this research have shapes of square, density, line, hole, pillar, and micro engine part. Advantages of CMP process for MEMS structures are observed respectively by using the test patterns with structures larger than 1 urn line width. Preliminary tests for material selectivity of poly-Si and oxide are conducted with two types of silica slurries: $ILD1300^{TM}\;and\;Nalco2371^{TM}$. And then, the experiments were conducted based on the pretest. A selectivity and pH adjustment of slurry affected largely step heights of MEMS structures. These results would be anticipated as an important bridge stone to manufacture MEMS CMP slurry.
Development of Multiple CMP Monitoring Systemfor Consumable Designs
Sun-Joon Park,Boum-Young Park,Sung-Ryul Kim,Hae-Do Jeong,Hyoung-Jae Kim 한국전기전자재료학회 2007 Transactions on Electrical and Electronic Material Vol.8 No.1
Consumables used in Chemical Mechanical Polishing (CMP) have been played important role to improve quality and productivity. Since the properties of consumables constantly change with various reasons, such as shelf time, manufactured time, lot to lot variation from supplier and so on, CMP results are not constant during the process. Also, CMP process results are affected by multiple sources from wafer, conditioner, pad and slurry. Therefore, multiple sensing systems are required to monitor CMP process variation. In this paper, the authors focus on development of monitoring system for CMP process which consist of force, temperature and displacement sensor to measure the signal from CMP process. With monitoring systems mentioned above, complex CMP phenomena can be investigated more clearly.
연마불균일도에 영향을 미치는 패드 표면특성에 관한 연구
박기현,박범영,김형재,정해도,Park, Ki-Hyun,Park, Boum-Young,Kim, Hyoung-Jae,Jeong, Hae-Do 한국전기전자재료학회 2006 전기전자재료학회논문지 Vol.19 No.4
Pad surface characteristics such as roughness, groove and wear rate of pad have a effect on the within wafer non-uniformity(WIWNU) in chemical mechanical polishing(CMP). Although WIWNU increases as the uniformity of roughness(Rpk: Reduced peak height) becomes worse in an early stage of polishing time, WIWNU decreases as non-uniformity of the Rpk value. Also, WIWNU decreases with the reduction of the pad stiffness, though original mechanical properties of pad are unchanged by the grooving process. In addition, conditioning process causes the inequality of pad wear during in CMP. The profile of pad wear generated by the conditioning process has a significant effect on the WIWNU. These experiments results could help to understand the effect of pad surface characteristics in CMP.
송영우,이한석,박준범,Song, Young-Woo,Lee, Han-Sok,Park, Jun-Boum 한국지하수토양환경학회 2010 지하수토양환경 Vol.15 No.6
This paper presents the prediction of shear strength of oil contaminated clay using fall cone test used to determine the liquid limit of soil. The penetration depth of fall cone is related to water content of soil. Laboratory vane shear can also be related to water content. To explore the relative correlation between penetration depth of fall cone and laboratory vane shear, both fall cone tests and laboratory vane shear test were carried out with water contents of soil. The developed empirical relationships in this studys showed that the shear strength is reduced to 3.9% with 1% increase of oil content. And, the lesser initial water content of contaminated clay, the more shear strength of contaminated clay is affected by oil content.