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Darveaux 모델에 의한 플립칩 패키지 솔더 접합부의 열피로 해석 및 수명 평가
신영의,김연성,김종민,최명기,Shin Young-Eui,Kim Yeon-Sung,Kim Jong-Min,Choi Myun-Gi 대한용접접합학회 2004 대한용접·접합학회지 Vol.22 No.6
Experimental and numerical approaches on the thermal fatigue for the solder joint of flip chip package are discussed. However, it is one of the most difficult problems to choose the proper fatigue model. It was found that viscoplstic FE model with Darveaux method was very desirable and useful to predict the thermal fatigue life of solder joint for flip chip package under $208{\~}423K$ thermal cycling condition such as steep slope of temperature(JEDEC standard condition C). Thermal fatigue life was 1075 cycles as a result of viscoplatic model. It was a good agreement compared to the experimental. And also, it was found from the experimental that probability of the thermal fatigue life was $60{\%}$ at 1500 cycles.
열초음파 접합 공정과 접합부의 신뢰성 평가에 관한 연구
신영의,박진석,손선익,Shin, Young-Eui,Pak, Jin-Suk,Son, Sun-Eik 한국전기전자재료학회 2009 전기전자재료학회논문지 Vol.22 No.8
In this thesis, lateral thermosonic bonding with ACFs was investigated as a process to make high reliability joints for FPD fabrication. Conditions for thermosonic and thermocompression bonding with ACFs were determined and used to make specimens in a driving test jig for testing of bond reliability by thermal shock. The results showed that thermosonic bonding temperature of $199\;^{\circ}C$ and bonding time of 1s produced bonds with good reliability. Additionally, thermosonic bonding temperature and time were reduced and thermal shock test results compared to this proposed curing condition. It is concluded that theromosonic bonding with ACFs can be effectively applied to reduce bonding temperature and time compared with that of thermocompression bonding.
신영의,양협,김경섭,Shin, Young-Eui,Yang, Hyub,Kim, Kyung-Sub 대한용접접합학회 1994 대한용접·접합학회지 Vol.12 No.4
This paper has been researched bondability of electronics devices, such as lead frame and the thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to consist of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, it is realized fluxless bonding process with filler metal such as plating layers.
신영의,김종민,김영탁,김주석,Shin, Young-Eui,Kim, Jong-Min,Kim, Young-Tark,Kim, Joo-Seok 대한용접접합학회 2006 대한용접·접합학회지 Vol.24 No.2
본 논문에서는 전자 패키징의 고밀도 실장 프로세스와 관련하여 많은 연구와 개발이 이루어지고 있는 무연 솔더의 양산적용시의 문제점 침 도전성 접착제 및 3차원 패키징 기술과 신뢰성 평가방법 등을 개략적으로 소개하였다. 현재 국제적 규약에 의한 무연 솔더의 사용이 의무화되어 가고, 이에 따라 기존 솔더의 전기적 접속성, 열 도전성, 접합성 등의 특성을 확보하기 위한 새로운 재료 및 공정에 대한 연구 및 개발이 필요한 시점이다. 또한 기존의 접합 방법에서의 고집적화 및 미세 피치의 한계를 넘기 위한 3차원 패키징 기술 등이 시도되고 있다. 따라서 신소재 개발 및 공정 변화에 맞는 새로운 신뢰성 평가 방법의 도출도 필요하다. 아울러 국내 대학 및 관련 연구소에서도 국제 경쟁력을 향상시키고 차세대 첨단 산업 분야의 신기술을 확보하고 이를 선도하기 위한 체계적인 연구 활동이 요구된다.
신영의,정승부 대한용접접합학회 1996 대한용접·접합학회지 Vol.14 No.3
This paper presents the investigations on the initial strength and its variation of Sn-Pb solder joint using different lead frames, such as are 42 alloy lead and Cu alloy lead. As the result of the lack of initial strength at solder joints, whose pitch is from 0.3 to 0.4mm, short circuit often occured at the solder joint by thermal shock or external impact. Therefore, in this paper investigations were performed on the initial strength and its variation of Sn-Pb solder joint as well as fractured mode with using different lead frames.
Fe-Ni 합금 클래드 리드 프레임을 이용한 전자 재료 접합부의 품질향상과 그 신뢰성
신영의,최인수,안승호 대한용접접합학회 1995 대한용접·접합학회지 Vol.13 No.2
This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.
$\mu$BGA 솔더 접합부의 최적 형상 예측에 관한 연구
신영의,지시헌,후지모토고조,김종민 한국마이크로전자및패키징학회 2001 마이크로전자 및 패키징학회지 Vol.8 No.4
본 연구에서 솔더 접합부의 최적 형상을 예측하는 몇 가지 방법에 대하여 연구하였다. 솔더 접합부 형상 예측법에는 Truncated Sphere법, 힘-평형 해석법(force-balanced analytical method), Ken Brakke에 의해 개발된 Surface Evolver등이 있다. 이상의 형상 예측법 붕 본 연구에서는 Truncated Sphere 법과 SurfaceEvolver를 사용하여 $\mu$BGA치 솔더 접합부의 형상을 예측하고, 결과를 비교하였다. 그 결과 Truncated Sphere법과 SurfaceEvolve가 제시하는 두 가지의 형상은 아주 작은 오차를 두고 거의 일치함을 확인하였다. 또한, 형상 예측법이 제시한 형상의 신뢰성을 검증하기 위하여, FEA 프로그램인 ANSYS(version5.62)를 이용하여 대상 형상에 열 사이클 시험을 실시하였다. 해석 결과, 형상 예측법이 제시한 형상이 임의 오차를 가한 다른 형상에 비하여 가장 좋은 신뢰성을 나타냄을 확인할 수 있었다. In this paper, several methods to predict the solder joint shape are studied. Although there are various methods to predict the solder joint shape, such as truncated sphere method. force-balanced analytical solution, and energy-based methods like surface evolver developed by Ken Brakke, we calculate solder joint shape of $\mu$BGA by two solder joint shape prediction methods(truncated sphere method and surfaceevolver) and then compare results of each method. The results indicate that two methods can accurately predict the solder Joint shape in an accurate range. After that, we calculate reliability solder joint shape under thermal cycle test by FEA program ANSYS(version 5.62). As a result, it could be found that optimal solder joint shape calculated by solder joint prediction method has best reliability in thermal cycle test.
Pb Free 솔더를 사용한 솔더 접합부의 접합 강도 향상에 관한 연구
신영의,김영탁 대한용접접합학회 1997 대한용접·접합학회지 Vol.15 No.2
In this paper, stability of initial strength at solder joint with lead free solders, such as Sn-In (52-48%) and Sn-Ag (96.5-3.5wt%) was studied. To obtain at solder joint with high quality, it is very important to control the temperature at the interface of solder joints. It is found that the thermal EMF (electro motive force) occurs betwee lead frame and copper pad on a substrate during reflow soldering process using heated tip. As a result of control the temperature at interface of solder joints, variation of initial strength at solder joint decreases from about $\pm40%$ to $\pm20%$, and it is realized Pb free soldering process using Sn/In and Sn-Ag solder paste.