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On-chip temperature compensation for optical transmitter modules
Sangirov, J.,Park, T-W,Ukaegbu, I. A.,Lee, T-W,Park, H-H IET 2013 Electronics letters Vol.49 No.3
<P>On-chip temperature compensation (TC) for optical transmitter (Tx) modules is reported. The TC block is integrated in common silicon (Si)-substrate with the Tx and demonstrates the ability to maintain a constant VCSEL output light power without an additional monitoring photodiode. Designed and fabricated in a 0.13 μm technology, the Tx with a TC block operates at up to 5 Gbit/s. A BER of less than 10<SUP>-12</SUP> is achieved at a received input power of - 3 dBm, with a 1.3 dBm variation of received power for a temperature increase of 20-100°C at 5 Gbit/s data rate. The percentage error of the temperature compensated Tx output light power is ± 3%. The Tx module consumes a power of 20 mW at 1.3 V, including the TC block.</P>
40 Gb/s optical subassembly module for a multi-channel bidirectional optical link
Sangirov, Jamshid,Joo, Gwan-Chong,Choi, Jae-Shik,Kim, Do-Hoon,Yoo, Byueng-Su,Ukaegbu, Ikechi Augustine,Nga, Nguyen T. H.,Kim, Jong-Hun,Lee, Tae-Woo,Cho, Mu Hee,Park, Hyo-Hoon The Optical Society 2014 Optics express Vol.22 No.2
10 Gbps Transimpedance Amplifier-Receiver for Optical Interconnects
Jamshid Sangirov,이태우,박효훈,Ikechi Augustine Ukaegbu,조무희 한국광학회 2013 Current Optics and Photonics Vol.17 No.1
A transimpedance amplifier (TIA)-optical receiver (Rx) using two intersecting active feedback system with regulated-cascode (RGC) input stage has been designed and implemented for optical interconnects. The optical TIA-Rx chip is designed in a 0.13 μm CMOS technology and works up to 10 Gbps data rate. The TIA-Rx chip core occupies an area of 0.051 mm2 with power consumption of 16.9 mW at 1.3V. The measured input-referred noise of optical TIA-Rx is 20 pA/√Hz with a 3-dB bandwidth of 6.9 GHz. The proposed TIA-Rx achieved a high gain-bandwidth product per DC power figure of merit of 408 GHzΩ/mW.
Jamshid Sangirov,Ikechi Augustine Ukaegbu,Tae-Woo Lee,Mu Hee Cho,박효훈 한국전자통신연구원 2012 ETRI Journal Vol.34 No.1
A video signal through a high-density optical link has been demonstrated to show the reliability of optical link for high- data-rate transmission. To reduce optical point-to-point links, an electrical link has been utilized for control and clock signaling. The latency and flicker with background noise occurred during the transferring of data across the optical link due to electrical-to-optical with optical-to-electrical conversions. The proposed synchronization technology combined with a flicker and denoising algorithm has given good results and can be applied in high-definition serial data interface (HD-SDI), ultra-HD-SDI, and HD multimedia interface transmission system applications.
10 Gbps/ch Full-Duplex Optical Link Using a Single-Fiber Channel for Signal Transmission
Nga, Nguyen T. H.,Sangirov, Jamshid,Gwan-Chong Joo,Byueng-Su Yoo,Ukaegbu, Ikechi A.,Tae-Woo Lee,Mu-Hee Cho,Hyo-Hoon Park IEEE 2014 IEEE photonics technology letters Vol.26 No.6
<P>A 10 Gbps/ch full-duplex (simultaneous bidirectional) optical link utilizing two optical subassembly (OSA) transceiver (TRx) modules and two wavelengths, 850 and 1060 nm, for sending and receiving optical signals through a single fiber channel in a fiber array is demonstrated. Each of the OSA TRx modules consists of transmitter/receiver chips, optical fibers embedded in a V-grooved silicon substrate, two 45 ° mirrors formed in fibers, and three silicon optical benches for mounting vertical-cavity surface-emitting lasers, photodiodes (PDs), and monitoring PDs. Mirror-1 in the fiber is coated with a wavelength-filtering layer to reflect transmitted light and pass through received light. Mirror-2 deflects received light to the PD. Two OSA TRx modules were applied in an end-to-end quad small form-factor pluggable optical link for 40-Gbps operation. This optical link showed good performance with clear eye-diagrams and a BER of at <;10<SUP>-12</SUP> Gbps/ch with -8-dBm input power.</P>