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Fabrication and application of flexible, multimodal light-emitting devices for wireless optogenetics
McCall, Jordan G,Kim, Tae-il,Shin, Gunchul,Huang, Xian,Jung, Yei Hwan,Al-Hasani, Ream,Omenetto, Fiorenzo G,Bruchas, Michael R,Rogers, John A Nature Publishing Group, a division of Macmillan P 2013 Nature protocols Vol.8 No.12
The rise of optogenetics provides unique opportunities to advance materials and biomedical engineering, as well as fundamental understanding in neuroscience. This protocol describes the fabrication of optoelectronic devices for studying intact neural systems. Unlike optogenetic approaches that rely on rigid fiber optics tethered to external light sources, these novel devices carry wirelessly powered microscale, inorganic light-emitting diodes (μ-ILEDs) and multimodal sensors inside the brain. We describe the technical procedures for construction of these devices, their corresponding radiofrequency power scavengers and their implementation in vivo for experimental application. In total, the timeline of the procedure, including device fabrication, implantation and preparation to begin in vivo experimentation, can be completed in ∼3–8 weeks. Implementation of these devices allows for chronic (tested for up to 6 months) wireless optogenetic manipulation of neural circuitry in animals navigating complex natural or home-cage environments, interacting socially, and experiencing other freely moving behaviors.
Materials and Fabrication Processes for Transient and Bioresorbable High‐Performance Electronics
Hwang, Suk‐,Won,Kim, Dae‐,Hyeong,Tao, Hu,Kim, Tae‐,il,Kim, Stanley,Yu, Ki Jun,Panilaitis, Bruce,Jeong, Jae‐,Woong,Song, Jun‐,Kyul,Omenetto, Fiorenzo G.,Rogers, John. A. WILEY‐VCH Verlag 2013 Advanced functional materials Vol.23 No.33
<P><B>Abstract</B></P><P>Materials and fabrication procedures are described for bioresorbable transistors and simple integrated circuits, in which the key processing steps occur on silicon wafer substrates, in schemes compatible with methods used in conventional microelectronics. The approach relies on an unusual type of silicon on insulator wafer to yield devices that exploit ultrathin sheets of monocrystalline silicon for the semiconductor, thin films of magnesium for the electrodes and interconnects, silicon dioxide and magnesium oxide for the dielectrics, and silk for the substrates. A range of component examples with detailed measurements of their electrical characteristics and dissolution properties illustrate the capabilities. In vivo toxicity tests demonstrate biocompatibility in sub‐dermal implants. The results have significance for broad classes of water‐soluble, “transient” electronic devices.</P>