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        The future role of smart structure systems in modern aircraft

        Becker, J.,Luber, W.,Simpson, J.,Dittrich, K. Techno-Press 2005 Smart Structures and Systems, An International Jou Vol.1 No.2

        The paper intends to summarize some guidelines for future smart structure system application in military aircraft. This preview of system integration is based upon a review on approximately one and a half decades of application oriented aerospace related smart structures research. Achievements in the area of structural health monitoring, adaptive shape, adaptive load bearing devices and active vibration control have been reached, potentials have been identified, several feasibility studies have been performed and some smart technologies have been already implemented. However the realization of anticipated visions and previously initial timescales announced have been rather too optimistic. The current development shall be based on a more realistic basis including more emphasis on fundamental aircraft strength, stiffness, static and dynamic load and stability requirements of aircraft and interdisciplinary integration requirements and improvements of integrated actors, actuator systems and control systems including micro controllers.

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        The future role of smart structure systems in modern aircraft

        J. Becker,W. Luber,J. Simpson,K. Dittrich 국제구조공학회 2005 Smart Structures and Systems, An International Jou Vol.1 No.2

        The paper intends to summarize some guidelines for future smart structure system application in military aircraft. This preview of system integration is based upon a review on approximately one and a half decades of application oriented aerospace related smart structures research. Achievements in the area of structural health monitoring, adaptive shape, adaptive load bearing devices and active vibration control have been reached, potentials have been identified, several feasibility studies have been performed and some smart technologies have been already implemented. However the realization of anticipated visions and previously initial timescales announced have been rather too optimistic. The current development shall be based on a more realistic basis including more emphasis on fundamental aircraft strength, stiffness, static and dynamic load and stability requirements of aircraft and interdisciplinary integration requirements and improvements of integrated actors, actuator systems and control systems including micro controllers.

      • Tensile behavior of Al<sub>1-x</sub>Mo<sub>x</sub> crystalline and amorphous thin films

        Gianola, D.S.,Lee, Z.,Ophus, C.,Luber, E.J.,Mitlin, D.,Dahmen, U.,Hemker, K.J.,Radmilovic, V.R. Elsevier Science 2013 ACTA MATERIALIA Vol.61 No.5

        The exceptional strength and distinct deformation physics exhibited by pure ultrafine-grained and nanocrystalline metals in comparison to their microcrystalline counterparts have been ascribed to the dominant influence of grain boundaries in accommodating plastic flow. Such grain-boundary-mediated mechanisms can be augmented by additional strengthening in nanocrystalline alloys via solute and precipitate interactions with dislocations, although its potency is a function of the changes in the elastic properties of the alloyed material. In this study, we investigate the elastic and plastic properties of Al<SUB>1-x</SUB>Mo<SUB>x</SUB> alloys (0≤x≤0.32) by tensile testing of sputter-deposited freestanding thin films. Isotropic elastic constants and strength are measured over the composition range for which three microstructural regimes are identified, including solid solutions, face-centered cubic and amorphous phase mixtures and body-centered cubic (bcc)/amorphous mixtures. Whereas the bulk modulus is measured to follow the rule of mixtures over the Mo composition range, the Young's and shear moduli do not. Poisson's ratio is non-monotonic with increasing Mo content, showing a discontinuous change at the onset of the bcc/amorphous two-phase region. The strengthening measured in alloyed thin films can be adequately predicted in the solid solution regime only by combining solute strengthening with a grain boundary pinning model. The single-step co-sputtering procedure presented here results in diversity of alloy compositions and microstructures, offering a promising avenue for tailoring the mechanical behavior of thin films.

      • Area-Selective Atomic Layer Deposition Using Si Precursors as Inhibitors

        Khan, Rizwan,Shong, Bonggeun,Ko, Byeong Guk,Lee, Jae Kwang,Lee, Hyunsoo,Park, Jeong Young,Oh, Il-Kwon,Raya, Shimeles Shumi,Hong, Hyun Min,Chung, Kwun-Bum,Luber, Erik J.,Kim, Yoon-Seok,Lee, Chul-Ho,Kim American Chemical Society 2018 Chemistry of materials Vol.30 No.21

        <P>Short-chain aminosilanes, namely, bis(<I>N</I>,<I>N</I>-dimethylamino)dimethylsilane (DMADMS) and (<I>N</I>,<I>N</I>-dimethylamino)trimethylsilane (DMATMS), have been used as Si precursors for atomic layer deposition (ALD) of SiO<SUB>2</SUB>. In this work, the DMADMS and DMATMS Si precursors are utilized as inhibitors for area-selective ALD (AS-ALD). The inhibitors selectively adsorb on a SiO<SUB>2</SUB> surface but not on H-Si, so that SiO<SUB>2</SUB> becomes selectively deactivated toward subsequent ALD. The deactivation of the SiO<SUB>2</SUB> surface by the inhibitors was investigated using various experimental and theoretical methods, including surface potential measurements, spectroscopic ellipsometry, and X-ray photoelectron spectroscopy. Better inhibition was observed for ALD of Ru and Pt than for ALD of Al<SUB>2</SUB>O<SUB>3</SUB> and HfO<SUB>2</SUB>. Through quantum mechanical and stochastic simulations, the difference in the blocking ability for noble metal and metal oxide ALD by the aminosilane inhibitors could be attributed to the inherently partial surface coverage by the inhibitors at their saturation and the reactivity of the subsequent ALD precursors. As silane inhibitors can be easily integrated with vacuum-based processes to facilitate high volume manufacturing of upcoming electronic devices, the current study provides a potential approach for the utilization of AS-ALD in pattern fabrication inside 3D nanostructures.</P> [FIG OMISSION]</BR>

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