중국 흥행영화의 배우관계망 분석:

Li MengLong,민대환(Daihwan Min) 한국IT서비스학회 2018 한국IT서비스학회 학술대회 논문집 Vol.2018 No.-

영화의 흥행요인에는 여러 가지 요인들이 영향을 미치는 것으로 알려져 있다. 이 연구는 최근 5년(2012-2016)간 1억 위안(CNY) 이상의 흥행수입을 기록하였던 중국 흥행영화를 대상으로 출연 배우의 사회관계망 구조 특성 중 세가지 유형의 중심성(degree centrality, between centrality, eigenvector centrality)을 분석하여 기존 한국영화를 연구한 결과와 비교하여 차이점을 밝히고 그 원인을 파악하는 동시에 중국 영화산업에 대한 새로운 이해를 제공하고자 한다. 분석 데이터로 삼은 중국 흥행영화는 총 161편이며, 등장 배우 중에서 분석대상으로 선택된 배우는 695명이었다. 한국 영화에서는 배우의 eigenvector 중심성이 높을수록 영화 흥행에 미치는 영향이 높은 결과를 보여준 것에 비해, 중국 영화에서는 세가지 유형의 중심성이 모두 영화흥행에 영향을 미쳤음을 발견하였다.

H2S adsorption performance of alkali lignocarbon/PVA composite membrane

Youjing Li,Fen Li,Menglong Zheng,Hong Yan,Qianliang Liu 한국화학공학회 2022 Korean Journal of Chemical Engineering Vol.39 No.9

In this work, lignin carbon-based membranes were prepared for H2S adsorption. Alkali lignin was carbonizedto obtain alkali lignocarbon (CLA). Using the CLA and polyvinyl alcohol (PVA) as raw materials, glycerol andwater as plasticizers, and nano-CuO and Cu2+ as dopants, CLA/PVA, CuO-CLA/PVA-1, and Cu-CLA/PVA-2 compositemembranes were prepared by solution casting method. The structures of these membranes and their H2S adsorptionproperties were then analyzed. The results show that with a membrane solution water-alcohol ratio of 3 : 1 and2 wt% CLA content, the prepared CLA/PVA membrane can adsorb H2S for 30 min. The CuO-CLA/PVA-1 and Cu-CLA/PVA-2 membranes, which were obtained after doping with nano-CuO and Cu2+, demonstrate significantlyimproved deodorization performance compared with that of CLA/PVA. The Cu-CLA/PVA-2 membrane can adsorbH2S for up to 75min and also demonstrates better mechanical properties. The H2S adsorption capacity of this membraneis up to 0.27 mol/kg. Structural analysis shows that the veneers of the three composite membranes are smoothand that doped copper is evenly distributed in the membranes as nano-CuO. The surface functional groups of theCLA/PVA, CuO-CLA/PVA-1, and Cu-CLA/PVA-2 membranes are similar and play a positive role in H2S adsorption. Nano-CuO is the main active site for H2S adsorption in the Cu-containing composite membranes.

Study of Stability Influencing Factors of Excavated Anti-Dip Rock Slope

Menglong Dong,Faming Zhang,Jingqing Lv,Yin Fei,Zinan Li 대한토목학회 2020 KSCE JOURNAL OF CIVIL ENGINEERING Vol.24 No.8

A layered rock slope often forms an anti-dip state due to tectonic movement in the historical past. In the mountainous gorge area of Southwest China, the layered rock slopes are prone to toppling and deformation due to the influence of gravity and in situ stress. The stability of these slopes after excavation is very important. The failure modes and laws of anti-dip slopes are mainly affected by factors such as lithology, dip angle and rock thickness. In this paper, the excavation process of a slope was simulated by the discrete element method, and the stability after slope excavation was analysed by comparison with field monitoring data, taking the high rock slope of a hydropower station as an example. In addition, the influence of different factors on the anti-dip rock slope was analysed by setting different factors in the model. The rock thickness was set to 5, 10, 15, 20, 25, 30 and 35 metres for the same excavated model. The dip angle of the rock was set to 65, 70, 75, 80 and 85 degrees. Two major lithologies, hard rock (sandstone) and soft rock (slate), were considered in this study. The results show that the thickness and dip angle of the rock strata affected the scale of the deformation zone and the stability of the anti-dip stratified slope. However, the lithology of the anti-dip rock slope determined the failure mode of toppling failure.

Microwave Signal Spectrum Broadening System Based on Time Compression

Menglong Kong,Zhongwei Tan,Hui Niu,Hongbo Li,Hongpei Gao 한국광학회 2020 Current Optics and Photonics Vol.4 No.4

We propose and experimentally demonstrated an all-optical radio frequency (RF) spectrum broadening system based on time compression. By utilizing the procedure of dispersion compensation values, the frequency domain is broadened by compressing the linear chirp optical pulse which has been multiplexed by the radio frequency. A detailed mathematical description elucidates that the time compression is a very preferred scheme for spectrum broadening. We also report experimental results to prove this method, magnification factor at 2.7, 8 and 11 have been tested with different dispersion values of fiber, the experimental results agree well with the theoretical results. The proposed system is flexible and the magnification factor is determined by the dispersion values, the proposed scheme is a linear system. In addition, the influence of key parameters, for instance optical bandwidth and the sideband suppression ratio (SSR), are discussed. Magnification factor 11 of the proposed system is demonstrated.

Effects of Sn Layer Orientation on the Evolution of Cu/Sn Interfaces

Menglong Sun,Zhangjian Zhao,Fengtian Hu,Anmin Hu,Ming Li,Huiqin Ling,Tao Hang 대한금속·재료학회 2018 ELECTRONIC MATERIALS LETTERS Vol.14 No.4

The effects of Sn layer orientation on the evolution of Cu/Sn joint interfaces were investigated. Three Sn layers possessing(112), (321) and (420) orientations were electroplated on polycrystalline Cu substrates respectively. The orientations of Snlayer preserved during reflowing at 250 °C for 10 s. After aging at 150 °C for different time, the interfacial microstructureswere observed from the cross-section and top-view. The alignment between the c-axis of Sn and Cu diffusion direction significantlysped up the Cu diffusion, leading to the thickest intermetallic compound layer formed in (112) joint. Two types ofvoids, namely, intracrystalline voids and grain islanding caused intercrystalline voids generated at Cu/Cu3Sn interfaces dueto the different interdiffusion coefficients of Cu and Sn (112) oriented Sn/Cu joint produced many more voids than (321)joint, and no voids were detected in (420) joint. Therefore, to enhance the reliability of solder joints, using (420) orientedSn as solder layer could be an efficient way.

A Hierarchical Bilateral-Diffusion Architecture for Color Image Encryption

Menglong Wu,Yan Li,Wenkai Liu 한국정보처리학회 2022 Journal of information processing systems Vol.18 No.1

During the last decade, the security of digital images has received considerable attention in various multimediatransmission schemes. However, many current cryptosystems tend to adopt a single-layer permutation ordiffusion algorithm, resulting in inadequate security. A hierarchical bilateral diffusion architecture for colorimage encryption is proposed in response to this issue, based on a hyperchaotic system and DNA sequenceoperation. Primarily, two hyperchaotic systems are adopted and combined with cipher matrixes generationalgorithm to overcome exhaustive attacks. Further, the proposed architecture involves designing pixelpermutation,pixel-diffusion, and DNA (deoxyribonucleic acid) based block-diffusion algorithm, consideringsystem security and transmission efficiency. The pixel-permutation aims to reduce the correlation of adjacentpixels and provide excellent initial conditions for subsequent diffusion procedures, while the diffusionarchitecture confuses the image matrix in a bilateral direction with ultra-low power consumption. The proposedsystem achieves preferable number of pixel change rate (NPCR) and unified average changing intensity (UACI)of 99.61% and 33.46%, and a lower encryption time of 3.30 seconds, which performs better than some currentimage encryption algorithms. The simulated results and security analysis demonstrate that the proposedmechanism can resist various potential attacks with comparatively low computational time consumption.

Influence of a Dominant Fault on the Deformation and Failure Mode of Anti-dip Layered Rock Slopes

Menglong Dong,Faming Zhang,Cheng Yu,Jingqing Lv,Huixin Zhou,Yukun Li,Yiyan Zhong 대한토목학회 2022 KSCE JOURNAL OF CIVIL ENGINEERING Vol.26 No.8

Toppling is a kind of failure mode that commonly exists in anti-dip rock slopes. Toppling deformation has a great influence on the stability of rock slopes, which often leads to geological disasters such as sliding and collapse of anti-dip slopes. However, a large number of faults and other structural planes will be produced in many rock slopes due to the action of geological structure movement. In the investigation, it is found that there are not only toppling deformation,but also faults and other geological structures in the toppling deformation rock slope. Previous studies have calculated the depth of toppling deformation, which is considered from the development characteristics of toppling deformation itself. In this paper, based on the field investigation of the anti-dip rock slope with bedding faults, the relationship between the depth of toppling deformation and the location of faults is analyzed by three-dimensional discrete element method. When the dominant structural plane and toppling fracture surface exist at the same time, the main factors affecting the failure of the reverse dip rock slope can be obtained by determining the different depths of the two planes. The final failure depth and failure mode of the toppling deformation in an anti-dip rock slope with a dominant structural plane can be preliminarily determined.

Formation Mechanism of Novel Sidewall Intermetallic Compounds in Micron Level Sn/Ni/Cu Bumps

Siru Ren,Menglong Sun,Zebin Jin,Yukun Guo,Huiqin Ling,Anmin Hu,Ming Li 대한금속·재료학회 2019 ELECTRONIC MATERIALS LETTERS Vol.15 No.5

A new kind of intermetallic compounds (IMC) were found around copper pillar in micron level bumps. To investigate theformation mechanism, three different sized Sn/Ni/Cu bumps (10 μm, 20 μm, 50 μm) were electroplated then reflowed at230 °C for 100 s. After reflow process, a thin layer of IMC was formed around copper pillar, which is attributed to surfacewetting behavior. After aging at 170 °C and 200 °C for different times, the growth mechanism of sidewall IMC was observedby scanning electron microscopy combined with electron backscatter diffraction (EBSD) technology. Surface diffusion wasconsidered to be the main driving force for sidewall IMC growth for the activation energy of them was found to be muchsmaller than that in previous studies. The EBSD results showed a preferred orientation of sidewall Cu3Sngrains <100> beingperpendicular to copper periphery, which indicated direction of Cu atoms flux during Cu3Sngrowth. Formation mechanismof this novel sidewall IMC was proposed based on surface wetting and surface diffusion. The findings contribute to the failuremechanism study in small size bumps and provide insights into the reliability of 3D electronic packaging.