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Ki Jin Han,Younghyun Lim,Youngmin Kim 대한전자공학회 2014 Journal of semiconductor technology and science Vol.14 No.5
In this study, the effects of the frequencydependent characteristics of through-silicon vias (TSVs) on the performance of 3D ICs are examined by evaluating a typical interconnection structure, which is composed of 32-nm CMOS inverter drivers and receivers connected through TSVs. The frequency-domain model of TSVs is extracted in S-parameter from a 3D electromagnetic (EM) method, where the dimensional variation effect of TSVs can be accurately considered for a comprehensive parameter sweep simulation. A parametric analysis shows that the propagation delay increases with the diameter and height of the TSVs but decreases with the pitch and liner thickness. We also investigate the crosstalk effect between TSVs by testing different signaling conditions. From the simulations, the worst signal integrity is observed when the signal experiences a simultaneously coupled transition in the opposite direction from the aggressor lines. Simulation results for nine-TSV bundles having regular and staggered patterns reveal that the proposed method can characterize TSV-based 3D interconnections of any dimensions and patterns.
Han, Ki Jin,Lim, Younghyun,Kim, Youngmin The Institute of Electronics and Information Engin 2014 Journal of semiconductor technology and science Vol.14 No.5
In this study, the effects of the frequency-dependent characteristics of through-silicon vias (TSVs) on the performance of 3D ICs are examined by evaluating a typical interconnection structure, which is composed of 32-nm CMOS inverter drivers and receivers connected through TSVs. The frequency-domain model of TSVs is extracted in S-parameter from a 3D electromagnetic (EM) method, where the dimensional variation effect of TSVs can be accurately considered for a comprehensive parameter sweep simulation. A parametric analysis shows that the propagation delay increases with the diameter and height of the TSVs but decreases with the pitch and liner thickness. We also investigate the crosstalk effect between TSVs by testing different signaling conditions. From the simulations, the worst signal integrity is observed when the signal experiences a simultaneously coupled transition in the opposite direction from the aggressor lines. Simulation results for nine-TSV bundles having regular and staggered patterns reveal that the proposed method can characterize TSV-based 3D interconnections of any dimensions and patterns.
Inhibition of KIF20A suppresses the replication of influenza A virus by inhibiting viral entry
Hoyeon Jeon,Younghyun Lim,In-Gu Lee,Dong-In Kim,Keun Pil Kim,So-Hee Hong,Jeongkyu Kim,Youn-Sang Jung,Young-Jin Seo 한국미생물학회 2022 The journal of microbiology Vol.60 No.11
The influenza A virus (IAV) has caused several pandemics, and therefore there are many ongoing efforts to identify novel antiviral therapeutic strategies including vaccines and antiviral drugs. However, influenza viruses continuously undergo antigenic drift and shift, resulting in the emergence of mutated viruses. In turn, this decreases the efficiency of existing vaccines and antiviral drugs to control IAV infection. Therefore, this study sought to identify alternative therapeutic strategies targeting host cell factors rather than viruses to avoid infection by mutated viruses. Particularly, we investigated the role of KIF20A that is one of kinesin superfamily proteins in the replication of IAV. The KIF20A increased viral protein levels in IAV-infected cells by regulating the initial entry stage during viral infection. Furthermore, the KIF20A inhibitor significantly suppressed viral replication, which protected mice from morbidity and mortality. Therefore, our findings demonstrated that KIF20A is highly involved in the viral replication process and viral propagation both in vitro and in vivo, and could thus be used as a target for the development of novel antiviral drugs.
증발-결정화 방법을 이용한 응축 성능 증진: 자기 배열된 친수성 결정의 효과
한태양(Taeyang Han),최영현(Younghyun Choi),김무환(Moo Hwan Kim),조항진(Hang Jin Jo) 대한기계학회 2020 대한기계학회 춘추학술대회 Vol.2020 No.12
Biphilic surfaces having heterogeneous wettability have proved their outstanding condensation efficiency compared to surfaces having homogeneous wettability. However the application of the biphilic surfaces in practical industries is limited due to the difficulty of the fabrication of the surfaces. In this study, we developed a simple and low-cost method to make a biphilic surface using evaporation-crystallization method. The developed surface enhanced the efficiency of condensation by up to 63% compared to a conventional superhydrophobic surface. Furthermore, the evaporation crystallization method induced ‘self-arrangement of hydrophilic crystals’ on a zigzag structured surface. The efficiency of condensation on the zigzag structured surface was increased by 2.4 times using the evaporation-crystallization method. The developed method not only enhanced the condensation efficiency of flat surfaces but also can be applied to complex shapes, increasing the applicability of biphilic surfaces in various industries.