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이온빔에 의한 Cu/Polyimide 표면개질에 따른 접착력향상에 관한 연구
신윤학,추준식,이승우,정찬회,김명한,Shin Youn-Hak,Chu Jun-Sick,Lee Seoung-Woo,Jung Chan-Hoi,Kim Myung-Han 한국재료학회 2005 한국재료학회지 Vol.15 No.1
In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer sufaces by ion beam irradiation and rf plasma are commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $Ar^+$ ion beam irradiation pretreatment conditions. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the $90^{\circ}$ peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $Ar^+$ ion beam irradiation energy at the fixed metal-layer thickness.