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문석환,최광성,엄용성,윤호경,주지호,최광문,신정호,S.H. Moon,K.S. Choi,Y.S. Eom,H.G. Yun,J.H. Joo,G.M. Choi,J.H. Shin 한국전자통신연구원 2023 전자통신동향분석 Vol.38 No.6
Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.
최광성,문석환,배현철,장건수,엄용성,Choi, K.S.,Moon, S.H.,Bae, H.C.,Jang, K.S.,Eom, Y.S. 한국전자통신연구원 2017 전자통신동향분석 Vol.32 No.6
Electronic packaging technology is a technology that easily connects devices to the outside. The fourth industrial revolution is thought to be possible with the advancement of certain devices. The advancement of these devices must be accompanied by innovations in electronic packaging that connects the devices to the outside world, allowing their performances to be implemented at the system level. In this paper, the development trends of 2.5D/3D technology, heterogeneous integration technology, ultrafine interconnection technology, and heat dissipation technology will be examined, and the development direction of these technologies will be discussed.
반도체 패키징용 에폭시 기반 접합 소재 및 공정 기술 동향
엄용성,최광성,최광문,장기석,주지호,이찬미,문석환,문종태,Eom, Y.S.,Choi, K.S.,Choi, G.M.,Jang, K.S.,Joo, J.H.,Lee, C.M.,Moon, S.H.,Moon, J.T. 한국전자통신연구원 2020 전자통신동향분석 Vol.35 No.4
Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.
다차원 이종 복합 디바이스 인터커넥션 기술 - 레이저 기반 접합 기술
최광성,문석환,엄용성,Choi, K.S.,Moon, S.H.,Eom, Y.S. 한국전자통신연구원 2018 전자통신동향분석 Vol.33 No.6
As devices have evolved, traditional flip chip bonding and recently commercialized thermocompression bonding techniques have been limited. Laser-assisted bonding is attracting attention as a technology that satisfies both the requirements of mass production and the yield enhancement of advanced packaging interconnections, which are weak points of these bonding technologies. The laser-assisted bonding technique can be applied not only to a two-dimensional bonding but also to a three-dimensional stacked structure, and can be applied to various types of device bonding such as electronic devices; display devices, e.g., LEDs; and sensors.
마이크로 LED 전사, 접합, 그리고 불량 화소 수리 기술
최광성,엄용성,문석환,윤호경,주지호,최광문,Choi, K.S.,Eom, Y.S.,Moon, S.H.,Yun, H.G.,Joo, J.,Choi, G.M. 한국전자통신연구원 2022 전자통신동향분석 Vol.37 No.2
MicroLEDs have various advantages and application areas and are in the spotlight as next-generation displays. Nevertheless, the commercialization of microLEDs is slow because of high cost as well as difficulties in the transfer, bonding, and bad pixel repairing process. In this study, we review the development trends of transfer, bonding, and defective pixel repair technologies, which are critical for microLED commercialization, focusing on materials that determine these technologies. In addition, we focus on the simultaneous transfer bonding technology developed by the Electronics and Telecommunications Research Institute, which has been attracting enormous research attention recently.
모바일 전자장비 냉각을 위한 micro-CPL의 열성능 해석
배찬효(C.H. Bae),김병기(B.G. Kim),서정세(J.S. Suh),황건(G. Hwang),문석환(S.H. Moon) 대한기계학회 2005 대한기계학회 춘추학술대회 Vol.2005 No.11
As more high power wide band gap devices are being utilized, the thermal management issues associated with these devices need to be resolved. High power small devices dissipate excessive heat that must be cooled, but traditional cooling methods are insufficient to provide such a cooling means. This paper will evaluate a micro-capillary pumped loop thermal management system that is incorporated into the shim of the device, taking advantage of phase-change to increase the thermal conductivity of the system. The results of the modeling of the thermal management system will be discussed.