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Fabrication of a large scanning micromirror array using vertical combdrive actuator
하준근(Joon-Geun Ha),전진아(Jin-A Jeon),서정은(Jung-Eun Seo),유병욱(Byung-Wook Yoo),진주영(Joo-Young Jin),박일흥(Il-Heung Park),박재형(Jae-Hyoung Park),김용권(Yong-Kweon Kim) 대한전기학회 2010 대한전기학회 학술대회 논문집 Vol.2010 No.7
In this paper, a 2-degree-of-freedom (DOF) Micro-electro-mechanical systems(MEMS) scanning micromirror array is fabricated, which has a large area mirror, a large actuation displacement and high fill factor. Each mirror is designed for independent actuation to two axis. The mirrror is designed as leverage structure in order to achieve large actuation angle with electrostatic actuator. To achieve this, a vertical combdrive actuator is fabricated with leverage structure. The tilting angles are 9.87 ° and 9.76 ° for each axis at the voltage of 150 V. The high fill factor is accomplished by fabricating actuator under the mirror plate. The array is composed of 9 single mirrors with 3 by 3 matrices, of which the size is 1 ㎜ by 1 ㎜. The fill factor of mirror array is 84 %.
하준근 ( Ha Joon Geun ),유석형 ( Yoo Suk Hyeong ),이상훈 ( Lee Sang Hun ) 한국구조물진단유지관리공학회 2018 한국구조물진단유지관리공학회 학술발표대회 논문집 Vol.22 No.2
The purpose of this research is to carry out an analysis of resident' satisfaction in a Smaller House with low market competitiveness and low architectural level in order to provide basic data on the development and construction of in a Smaller House in the future. For the purpose, we have conducted a questionnaire survey on their satisfaction with the residents who live in a Smaller House in JinJu, Gyeongsang Namdo as target , and the collected data was analyzed using SPSS 18.0 Statistical Program. As for methods of analysis, we carried out such analysis as frequency analysis, reliability analysis, regression analysis, t-test, and One-way ANOVA. The results of our findings can be summarized as follows The supply of closed and uniform one-bedroom apartments continues to take into account the efficiency of supply, and previous studies point to the worsening housing conditions, Therefore, smaller apartments that are relatively less competitive in the market need to improve their technology and performance levels. Theregore, it is expected that matters concerning usage behavior and satisfaction shown in this research result in planning and building small houses in the future will be actively utilized.
소형주택의 건설 프로세스 개선방향에 관한 연구 -전문가 집단을 중심으로-
하준근 ( Ha Joon Geun ),유석형 ( Yoo Suk Hyeong ),이상훈 ( Lee Sang Hun ) 한국구조물진단유지관리공학회 2018 한국구조물진단유지관리공학회 학술발표대회 논문집 Vol.22 No.2
Most of the companies that build small houses are mostly private businesses or small corporations. Lack of awareness of poor management environment and small-scale projects and lack of systematic management cause many losses and management difficulties in project execution. Therefore, there is a need to improve the quality of small - sized houses by identifying the difficulties and weaknesses of small - and mid - sized construction companies that build small houses, and the factors that impede the safety and housing environment of small houses. The purpose of this study is to propose an improvement plan through a questionnaire survey on small - scale housing construction specialists.
Fabrication method of through wafer nickel interconnects for wafer level packaging
하준근(Joon-Geun Ha),유병욱(Byung-Wook Yoo),진주영(Joo-Young Jin),이경건(Kyounggun Lee),박재형(Jae-Hyoung Park),김용권(Yong-Kweon Kim) 대한전기학회 2009 대한전기학회 학술대회 논문집 Vol.2009 No.11
In this paper, we present the fabrication process and results of through wafer nickel interconnects using high aspect ratio deep silicon etching, nickel electroplating and glass thermal reflowing techniques. Low resistivity silicon wafer and borosilicate glass wafer are used as substrate and isolation layer material, respectively. Diameter of silicon pole after deep silicon etching is designed to be 30 and 40 ㎛. Isolation gap is set to be 20, 30 and 40 ㎛. Average thickness of electroplated nickel and expected resistance of nickel interconnects will be presented. This fabrication method can be applicable to hermetic wafer level packaging of devices with through wafer interconnections because of its wafer level fabrication and rigid structure.
A clindrical post dipping method to fabricate PDMS microlens array
Kyounggun Lee(이경건),Yun-Ho Jang(장윤호),Byung-Wook Yoo(유병욱),Joo-Young Jin(진주영),Joon-Geun Ha(하준근),Jae-Hyoung Park(박재형),Yong-Kweon Kim(김용권) 대한전기학회 2009 대한전기학회 학술대회 논문집 Vol.2009 No.7
A cylindrical post dipping (CPD) method to fabricate the PDMS microlens arrays is presented in this paper. The proposed CPD method is based on the surface tension effect. 2 ㎜ gap and gapless lenses with 2 ㎜ diameter are fabricated and characterized geometically. Both profiles of the fabricated microlens are well-fitted with ideal lens profile. The surface roughness average of the fabricated lens is measured to be 1.953 ㎚. The focal length of 2㎜ gap lenses and the gapless lenses is calculated to be 17.00 ㎜ with 0.65 ㎜ standard deviation and 29.88 ㎜ with 2.58 ㎜ standard deviation, respectively. The proposed CPD method can be applied to wafer level lens fabrication due to its simplicity and versatility.