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AC7A를 이용한 사형주조에서 타이어 몰드의 열변형에 관한 유한요소 해석
오율권(Yoolkwon Oh),김용범(Yongbum Kim),양호동(Hodong Yang),박근욱(Keonuk Park),서동표(Dongpyo Seo) 대한기계학회 2006 대한기계학회 춘추학술대회 Vol.2006 No.11
The present study analyzed on thermal strain of the AC7A tire mold produced in sand castings by FEA. To predict the numerical result of thermal strain in AC7A mold during the cooling process, it is performed the investigation of temperature distribution, stress and strain based on the physical properties of AC7A. In results of this study, the temperature distribution result of AC7A mold is more uniform than mild steel mold and the cooling time of AC7A mold is more short than it. Also, the results of strain and stress in AC7A mold is better than it. In addition, AC7A and mild steel mold is revealed that cooling curve was observed the rapid pattern in 20 minutes after beginning cooling process and difference in temperature of mold is the biggest. These results are presented to help to make the effective and the precision tire mold. Also, the introduced technique of numerical analysis is very useful and especially needs to improve the high precision mold in the industrial aspect.
알루미늄 합금을 사용한 타이어 몰드의 열변형에 관한 수치해석적ㆍ실험적 연구
오율권(Yoolkwon Oh),김용범(Yongbum Kim),양호동(Hodong Yang) 한국자동차공학회 2007 한국자동차공학회 지부 학술대회 논문집 Vol.- No.-
Numerical analysis using a finite element method was applied to analyze that aluminum alloy mold was happened the difference of temperature distribution. Beside, thermal strain rate occurred by temperature distribution investigated to predict the accurate measurement variations of aluminum alloy. In results of this study, aluminum alloy represented rapidly cooling graph during initial 20 minutes after beginning cooling process, therefore value of stress and displacement is rapidly changed during initial 20 minutes after beginning cooling process. In addition to, temperature distribution obtained by experiment confirmed corresponding pattern then compared numerical analysis with experiment. These results are contributed to make the effective and the high precision casting mold.
온도변화에 따른 반도체 패키지 솔더볼의 변형률 분포 해석
사공영진 ( Youngjin Sagong ),주진원 ( Jinwon Joo ) 충북대학교 산업과학기술연구소 2020 산업과학기술연구 논문집 Vol.34 No.2
Thermal deformations occur during temperature changes of electronic packages because of differences in the thermal expansion coefficients of the materials. In this paper, a numerical method was proposed to obtain the strain distribution in the considering region from the displacement values at predetermined finite points measured by the DIC method. The shape function used in finite element analysis was introduced to derive the equation for the strain distribution within the element and applied it to obtain strain distribution of the solder ball owing to the temperature change of the WB-PBGA package. It has been shown that the method of this paper, which introduced the concept of shape function, can reliably obtain the strain distribution of the considering region, and thus it can be usefully used for the measurement of micro deformation due to temperature change of a semiconductor package.
윤민호 ( Yoon Min-ho ),김규용 ( Kim Gyu-yong ),최경철 ( Choe Gyeong-cheol ),황의철 ( Hwang Eui-chul ),이보경 ( Lee Bo-kyeong ),서원우 ( Seo Won-woo ) 한국건축시공학회 2016 한국건축시공학회 학술발표대회 논문집 Vol.16 No.2
In this study, the thermal strain of high strength concrete with the compressive strength of 80, 130, 180MPa were measured under 25% of compressive strength loading condition. As results, it is considered that decline of the elastic modulus and shrinkage strain of high strength concrete become grater at the elevated temperatures.
Al 합금 금형의 열변형 제어에 의한 에너지 절감에 관한 수치해석적ㆍ실험적 연구
오율권(Oh Yool-Kwon),김용범(Kim Yong-Bum),양호동(Yang Ho-Dong) 한국태양에너지학회 2007 한국태양에너지학회 학술대회논문집 Vol.- No.-
In the study analyzed on two-dimension numerical analysis and experimentation for Al alloy mold using finite element method. To predict the numerical result of thermal strain in Al alloy mold during the cooling process, it is performed the investigation of temperature distribution, stress and displacement based on the physical properties of Al alloy. In results of this study, Al alloy mold represented rapidly cooling graph during initial 20minutes after beginning cooling process, therefore value of stress and displacement is rapidly changed during initial 20 minutes after beginning cooling process. In addition to, temperature distribution obtained by experiment confirmed corresponding pattern then compared numerical analysis with experiment. These results are contribute to make the effective and the high precision casting mold. In addition to, reduction of energy is contributed to saving time from manufacturing as possible temperature to prediction.
강의 열응력 및 변형발생에 미치는 침적 냉각조건의 영향
서창민(Chang-Min Suh),황병원(Byong-Won Hwang),정현진(Hyun-Jin Jung),김동현(Dong-Hyun Kim) 대한기계학회 2001 대한기계학회 춘추학술대회 Vol.2001 No.8
To investigate the behavior of residual stress and deformation for the immersion Quenched steel, SK5, SPV50, and STS304 steels were heat treated and then analyzed. Residual stresses generated on the surface of cooled specimen were measured by the X-ray diffraction method and the incremental strain method. The effect of volume change caused by phase transformation on the residual stress was compared among the materials used. Thermal deformations were produced when the specimens were immersed at a slant into the coolant and the more increase of slant the larger deformation was produced. Compressive residual stress occurred on both sides of the SK5 steel, whereas tensile stress was measured on SPV50. It was analyzed that magnitude and sign of residual stress were influenced by the volume change due to phase transformation and the plastic deformation generated at inner or outer part of the Quenched specimen.
ESPI를 이용한 플립칩 솔더접합부의 열응력 인가에 따른 전단변형률 평가
장우순(Woosoon Jang),이백우(Baik-Woo Lee),김동원(Dong-Won Kim),권동일(Dongil Kwon) 대한기계학회 2001 대한기계학회 춘추학술대회 Vol.2001 No.8
In this study, we measure the thermal deformation of flip-chip solder joint by ESPI (Electronic Speckle Pattern Interferometry) system that has some advantages such as non-contact, non-destructive, real-time and full-field measurement. The ESPI system has been applied to bulk materials, but we try to apply it to micro material such as flip-chip package by improving its resolution with long working-distance microscope, zoom lens and iris. The sub-micrometer scale thermal deformation of flip-chip solder joint is measured from 25℃ to 125℃. Local shear strain in solder ball is also calculated from the measured thermal displacement. In addition, the experimental result from ESPI is compared with the predicted result from FEA(Finite Element Analysis). It is shown that shear strain from the experiment are similar to the predicted result from FEA.
금형주조기를 이용한 알루미늄 합금 금형의 수치해석적 열변형 해석과 실험에 관한 연구
오율권(Yool-Kwon Oh),김용범(Yong-Bum Kim),윤희성(Hee-Sung Yoon) 대한기계학회 2007 대한기계학회 춘추학술대회 Vol.2007 No.5
This study numerically and experimentally investigated on thermal strain analysis of aluminum alloy casting mold using metal foundry. To predict the numerical result of thermal strain in Al alloy casting mold during the cooling process, it is performed the investigation of temperature distribution, stress and displacement based on the physical properties of Al alloy. In results of this study, Al alloy casting mold represented rapidly cooling graph during initial 20minutes after beginning cooling process, therefore value of stress and displacement is rapidly changed during initial 20minutes after beginning cooling process. In addition to, temperature distribution obtained by experiment confirmed corresponding pattern then compared numerical analysis with experiment. These results are distribute to make the effective and the high precision casting mold.